JPS60207108A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To automate the assembly by forming at least two positioning holes in a solid-state image pickup element package, and thus easily obtaining the size precision of an optical axis, a swing, etc., during an assembling process. CONSTITUTION:The CCD package 5 is made of ceramic so as to improve the position precision stably, and a CCD chip 12 is die-bonded to the metallized layer on the bottom surface of a recessed part formed in the center of the package; and a color separation filter 13 is laminated thereupon, its front surface is covered with seal glass 14, and a screw hole 16 and positioning holes 17 and 17' are bored at a left and a right side part. A pin indicating a reference position is inserted into those positioning holes 17 and 17' to specify the X- and Y-directional positions of the CCD chip 12, and the CCD package 5 is fitted to the CCD unit 1 on the basis of positioning holes 17 and 17' to easily obtain the size precision of the optical axis and swing during the assembling process.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to an imaging device using a solid-state imaging device.

"Background technology and its problems" In general, in solid-state imaging devices, in order to obtain images that are sharp, have good contrast, and are free from vignetting, blur, etc., it is necessary to focus the light received by the lens on the imaging surface with good positional accuracy. It is necessary to do so. FIG. 7 shows a state in which a light beam 82 incident on a lens 81 is imaged on an imaging surface 83, and 84 is
The inside of the lens effective image is shown. In FIG. 7, when there is a misalignment of the optical axis indicated by α between the lens 81 and the imaging surface 83, vignetting and zero image blurring of the captured image occurs.◇Also.

In order to prevent one-sided blurring of the captured image, the optical axis of the lens 81 and the vertical precision of the imaging surface 83 are matched.

In addition, it is necessary to match 2&, which is the distance from the back focus lens mounting surface to the imaging surface 83.

Therefore, in the solid-state imaging device, it is necessary to adjust the optical axis in the X and Y directions, to adjust the pack focus Z, and also to adjust the tilt angles θX and θ. In addition, solid-state imaging devices have good sensitivity, so if dust adheres to the seal glass on the front of the imaging device or the optical path system of the optical filter, it will appear as dots on one image.

8A and 8B show an example of a conventional solid-state imaging device, in which 91 is a lens, 92 is a solid-state imaging device, and 93 is a solid-state imaging device.
is an optical filter, and 94 is a frame. A solid-state image sensor 92 is attached to a substrate 95, and this substrate 95 is attached to a frame 94 with a plurality of screws 96, 97, 98 and a substrate retainer 9.
9 or the like, and the paired male V lens 1 of the frame 94 is attached. In addition, when attaching the substrate 95 and the optical filter 93 to the frame 94, the rubber seal 1
00 and 101 are provided.

In such a conventional solid-state imaging device, the solid-state imaging device 92 is directly attached to a substrate 95, and the positional relationship with the lens 91 is adjusted by correcting several positions of the frame 94 of the substrate 95 using screws. Therefore, the optical axis and tilt as mentioned above.

Figure 7 on the back - The work of adjusting debris etc. had to be done while drawing the picture, which was very troublesome. Along with this, there was a drawback that a large number of nine parts were required, resulting in a large device.

In addition, in conventional solid-state imaging devices, mounting the solid-state imaging element 92 to the substrate 95 and mounting the optical filter 93 requires assembling a large number of mechanical parts, so it is usually assembled in a workplace in a normal working environment. be. Therefore, it becomes difficult to prevent the adhesion of small amounts of dust, and the task of wiping off dust on the optical path system is troublesome, and there are also problems that lead to a decrease in reliability.

Therefore, by positioning the solid-state image sensor and attaching it to the package, and then positioning and attaching the solid-state image sensor attached to this package to the unit, the first assembly process is simplified and precision is increased, and the second assembly is carried out in a dust-free room. It may be possible to do this consistently.

A ceramic material having a multi-layered structure is suitable for the pancase of this solid-state imaging device from the viewpoint of insulation, moisture resistance, hardness, and the like. Ceramic materials with a multilayered structure are produced by applying the necessary processing to several, for example, five thin plates of an inorganic compound, such as silicon atomide, stacking the thin plates of the inorganic compound, trimming the outer shape, and baking at a high temperature. It is molded from K. The fired ceramic material is extremely hard (it is no longer possible to process this ceramic material.

Ceramic materials formed in this manner are baked and hardened with a high grain size after being processed, resulting in 1M layer displacement and baking shrinkage deformation, making it very difficult to process with high precision. Therefore, when a ceramic material is used as a package for a solid-state image sensor.

It is difficult to use this package as a reference for positioning.

Therefore, when using a package using ceramic,
While detecting the position of the solid-state image sensor chip that is bonded to this package, wire bonding, color filter attachment, anti-flare coating, etc. were performed. Therefore, there was a problem in that one assembly process took a very long time.

"Objective of the Invention" The object of the present invention is to make a hole for the purpose of determining the position f1 in the X and Y directions in a layer having a die-bonding surface of a package of a solid-state image sensor, and to raise the rjN cut surface of this hole. An object of the present invention is to provide a solid-state imaging device that can automate the assembly of the solid-state imaging device by creating standards in the X, Y, and Z directions as a reference plane in the horizontal direction.

Further, in the present invention, positioning can be easily performed by assembling the imaging device using the above-mentioned criteria.

"Summary of the Invention" The present invention relates to a solid-state imaging device having a solid-state imaging device package to which a solid-state imaging device is attached.

This solid-state imaging device is characterized in that a solid-state imaging device package is provided with at least two positioning holes.

"Embodiment" An embodiment of the present invention will be described below with reference to the drawings. This embodiment uses a CCD image sensor as the solid-state image sensor.

In FIG. 1, 1 is a CCD unit, 2 is a lens barrel, and the lens barrel 2 is provided with lenses 3A and 3B. CCD unit 1 is.

It consists of an optical filter section and a CCD block, and an exploded perspective view thereof is shown in FIG. In fig.

4 is a metal CCJ) holder, 5 is a ceramic CC
The D-Pack package has a rubber backing for dustproofing.

1 is a filter holder formed by resin molding, 8 is an optical filter, and 9 is a filter holder. As shown in FIG. 1, the rear end of the lens barrel 2 is fitted into the cylindrical portion 10 of the filter holder 7 of the CCD unit 1, and the positional relationship between the CCD 1 and the lens barrel 2 is defined. Ru. Lens barrel 2
is screw 11A.

It is fixed to the CCD unit 1 at the position where the back focus is adjusted by 11B.

The CCD package 5 is made of ceramic in order to stably increase the nine-position accuracy, and the metallized layer on the bottom of the four parts formed in the center of the CCD package 5 is coated with CO.
The D chip 12 is bonded with silver paste and wire bonded first, and the color separation filter 13 is placed on top of it.
The front surface is covered with a sealing glass 14. Although not shown, a 7-rare prevention plate may be provided between the one-color separation filter 13 and the seal glass 14 ~ 1° CCD
Leads 15 are led out from the package 5. I love this CCD/Z cage 5! , screw holes 16 and positioning holes 17 are symmetrically drilled on the left and right sides.

To assemble the CCD unit 1, attach the CCDC manocage 5 to C
This is accomplished by firstly fixing the CCD holder 4 to the CD holder 4, attaching the optical filter 8 to the filter holder I, and then fixing the CCD holder 4 and filter holder 7 via the rubber backing 6. The CCD holder 4 has a slit that leads out a four-part lead 15 into which the CCD package 5 is fitted. Screw holes 21 are drilled symmetrically in the bottoms of these four parts, and bins 22 for positioning the CCD package are placed in the recesses of the 0CCD holder 4, which are symmetrically press-fitted. 5 positioning hole 17
The CCD package 5 is inserted so as to be inserted into the inside. Then, the pair of screws 23 are screwed into the screw holes 16 and 21, thereby fixing the CCD holder 4 to the CCD package 5.

A pair of screw holes 25 are provided in one diagonal direction of the CCD holder 4, a pair of screw holes 26 are provided in the other diagonal direction, and a pair of positioning pins are provided near the screw holes 26. 27 are planted by press-fitting. These screw holes 25° 26 and the pin 27 are, as described later,
It is used to combine the CCD unit 1 and filter holder 7.

On the bottom surface of the cylindrical portion 10 of the filter holder 10, a rectangular 171j 31 is formed, as shown in FIG.

A step portion 32 is provided along the periphery of this opening 310. The optical filter 8 inserted into the cylindrical portion 10 engages with this stepped portion 32. The optical filter 8 consists of an infrared cut filter and an optical low-pass filter made up of a plurality of crystal plates. Optical filter 8 inserted into cylindrical part 10
The inosita retainer 9 is brought into contact with the front surface of the screw 33 (
(omitted in FIG. 1). A groove 34 is provided on the back surface of the filter holder 1 to surround the opening 31, and the rubber backing 6 is inserted into the groove 34.

As shown in FIG. 3 and FIG. 3B, the filter holder 7 is formed with a pair of screw holes 35 located approximately on one side of the diagonal direction and located on the other side of the diagonal direction. A pair of screw holes 36 are formed, and a pair of positioning holes 37 are drilled near the screw holes 36. A filter holder 1 to which an optical filter 8 is attached and is vignetted is stacked on a CCD holder 4 to which a CCD package 5 is fixed, with a rubber backing 6 interposed therebetween. In this case, the bin 27 is located at the positioning hole 3T.
It is made to be inserted within. In this state, a pair of screws 38 are screwed into the screw holes 35.25 from the front, and
A pair of screws 2B are screwed into the screw holes 26.36 from the back side. Let's do this 5K.

CCD unit 1 is assembled.

FIG. 4 and FIG. 4B show the shape of the CCD package 5. As shown in FIG.
The four parts 50 formed in the center have stepped parts 51 around them.
A, 51 B, and 51 C are formed, and a metallized layer 52 is printed on the bottom surface thereof. Leads 15 are led out from the bottom of the CCD package 5. CCD
A screw hole 16 and positioning holes 17 and 17' are formed symmetrically at the center of the left and right sides of the package 5.

The screw hole 16 passes through the CCD package 5, and a seat 41 is provided on the side of the screw hole 16 that is in contact with the filter holder T with a depth such that the head of the screw 23 does not protrude beyond the contact surface. It is formed.

In addition, one positioning hole 11 is a round hole.
is considered to be long.

The CCD chip 12 is die-bonded to the metallized layer 52 on the bottom surface of the four parts 50 formed at the center of the CCD package 5 using silver paste. The position of this die bonding is the positioning hole 1 formed in the CCD package 5.
It will be held on the basis of 7.17. A color separation filter 13 is stacked on the CCD chip 12. The seal glass 14 is attached to a stepped portion 51C formed around the fourth portion 500. When a flare prevention plate (not shown) is provided, the flare prevention plate is provided on the stepped portion 51B.

All of the parts to be attached to the CCD package 5 are attached with reference to the positions of the positioning holes 17 and 17. This installation can be done 2. For example, positioning pins are planted in the mounting base on which each part is attached, and the positioning is done by inserting and fixing the positioning holes 17 and 17 into this bin, and each part is attached. .

Note that one of the two positioning holes 17 and 17 is long. Therefore, even if a deviation occurs due to shrinkage during processing of the CCD package, one positioning hole 17.17 can always be used as a constant reference.

This CCD package 5 is made of a thin plate 53.54°55.56.57 of an inorganic compound such as silicon pentide as shown in FIG.
is formed into a yi layer and baked and hardened. Two CCD packages 5 are processed using the inorganic compound thin plates 53 to 51.

Holes 60A, 61A, 62A, 63A and holes 64A, 65A, 6fiA, 67A are formed in the thin plate 53, and holes 68A, 69A, 70A, 71A are formed in the four pairs thereof. The holes 60A to 63A have the same shape, and their diameters are as follows:
It is made slightly larger than the outer diameter of the screw 23. Holes 64A to 67A
In the IC, hole 64A.

One of the holes 65A is circular and the other hole is elongated, and one of the holes 66A and 61 is circular and the other hole is elongated. A metal rice layer 52 is printed on the thin plate 53.

Holes 60B, 61B, 62B, 63B and holes 64B, 65B, 661 (, 67B) are formed in the thin plate 54, and holes 68B, 69B, 70B, 71B are formed in the four pairs.The holes 60B to 63B are the same. The holes 64B to 67B have the same shape and have a slightly larger diameter than the holes 64A to 67A described above.The thin plate 54 has a notch 72A. , 73A are formed, and an electrode pattern is formed around the notches 72A and 73A.

Thin plate 55Kk'! , holes 60C, 61C, 62C, 63C
and holes 64C, 65C, 66C, and 67C are formed, and holes 68C, 69C, 70C, and 71C are formed in the four pairs.

The holes 60C to 63C have the same shape and are slightly larger than the outer diameter of the screw 23. The holes 64C to 67C have the same shape, and are substantially the same shape as the holes 64B to 67B described above. Cutouts 72B73B are formed in the thin plate 55.

Holes 60D, 61D, 62D, 63D and holes 54D, 65D, 66D, 67D are formed in MiS6, and holes 68D, [i9D, 70D, 71D are formed in the four pairs, and holes 60D to 63D have the same shape. The hole is slightly larger than the outer diameter of the screw 23. The holes 64D to 67D have the same shape, and are substantially the same shape as the holes 64B to 67B described above. Cutouts 72C and 73C are formed in the thin plate 56.

The thin plate 57 has holes soE, 61B, 62E, s3E and 6.
4E, 65B, 66B, and 67E are formed, and holes 68B, 69 are formed in the four pairs, and 70B, 71E are formed therein.

The holes 60E to 63B have a diameter larger than that of the head of the screw 23 and have the shape shown in the figure. The holes 64D to 67D have the same shape and are substantially the same shape as the holes 64E to 67B described above. The thin plate 56 has a notch 72D.

73D is formed.

Holes 68A-7 in which the thin plates 53 to 57 are formed in each quadruple shape.
1A, 68I) ~71B, 68C ~ 71C, 68D-
By sequentially inserting TID and 68E to 71g into the standard guide bin, thin plates 53 to 5T are superimposed as shown in FIG.

The holes formed in the thin plates 53 to 57 are overlapped to form the screw holes and positioning holes of the CCD package 5. In other words, holes 60A to 60B and holes 61A to 61H
A pair of screw holes 16 of one CCD package and another CCD puff cage 5 through holes 63A to 63B.
0 holes 64A to 64E and holes 65A to 65F are formed.
Positioning holes 17 and 17 of one other CCD package 5 are formed by i. In this case, the holes 601 to 63B of the thin plate 57 serve as seats 41 for accommodating the heads of the screws 23.

Cutouts 72A to 72D and 73A to 73D formed in thin plates 54 to 5T are thin plates 53 on which metallized layers are printed.
One CCD package 5 can be stacked on top of each other.
recess 50 of one CCD package 5 and recess 5 of another CCD package 5
0 is formed.

The sizes of the cutouts 72A to 72D are the size of the cutout 72E,
72D, 72C, 72B, 72A are larger in order, and the size of notches 73A to 73D is larger than that of notches 73B, 73D.
, 730.73B, and 73A.

As a result, stepped portions 51A, 51B, and 51C are formed around the four parts 50 of one CCD package 5 and the four parts 50 of another CCD package 50.

The laminated thin plates 54 to 57 are calcined, and the CCD package 5 is formed as shown by the broken line in FIG. 10.

Note that the present invention can be similarly applied to solid-state image sensors such as MO8 image sensors other than CCD image sensors. In addition, the lens may be an interchangeable lens,
An engagement means for this purpose may be provided in the filter holder.

"Effects of the Invention" According to this invention, two positioning holes 17 and 17 are provided in the CCD package 5.

By inserting pins indicating reference positions into the positioning holes 17 and 17, the X of the CCD chip 12 is adjusted.

The position in the Y direction is defined. Therefore, by using this standard, wire bonding of the CCD chip 12, mounting of the color separation filter 13, etc. can be automated. Furthermore, since the CCD package 5 with the CCD chip 12 attached can be attached to the CCD unit 1 using the positioning hole 17. One assembly process can be simplified and assembly accuracy can be improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is an exploded perspective view of a CCD unit of an embodiment of the invention.
The figures are a plan view and a bottom view of a filter holder according to an embodiment of the invention, and FIG. 4 is a plan view and a sectional view of a CCD package according to the invention. FIG. 5 is an exploded perspective view used to explain a CCD package according to an embodiment of the present invention, FIG. 6 is a perspective view used to explain a CCD package according to an embodiment of this invention, and FIG. 7 is a position of a solid-state image sensor. Route map used to explain adjustments;
FIG. 8 is a cross-sectional view and a bottom view used to explain a conventional solid-state imaging device. 1... CCD unit, 2... Lens barrel. 3A, 3B...Lens, 4...CCD
holder. 5...CCD package, 7...filter holder, 8...optical filter, 12...
...CCD chip, 13...color separation filter, 17.17'...positioning hole. Agent Masatomo Sugiura

Claims (1)

[Scope of Claim] A solid-state imaging device having a solid-state imaging device cage to which a solid-state imaging device is attached. A solid-state imaging device, characterized in that the solid-state imaging device package is provided with at least two positioning holes.