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JPS60199586A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS60199586A
JPS60199586A JP59054832A JP5483284A JPS60199586A JP S60199586 A JPS60199586 A JP S60199586A JP 59054832 A JP59054832 A JP 59054832A JP 5483284 A JP5483284 A JP 5483284A JP S60199586 A JPS60199586 A JP S60199586A
Authority
JP
Japan
Prior art keywords
head
laser
inverter
laser beam
processing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59054832A
Other languages
Japanese (ja)
Other versions
JPH0155076B2 (en
Inventor
Yoshihide Kanehara
好秀 金原
Motoi Kitani
木谷 基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59054832A priority Critical patent/JPS60199586A/en
Publication of JPS60199586A publication Critical patent/JPS60199586A/en
Publication of JPH0155076B2 publication Critical patent/JPH0155076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To perform stable laser working without change in light condensability according to the position of a working head by moving the moving distance of a laser light inverter in the same direction in the specific relation with the moving distance of the working head. CONSTITUTION:When a working head 3 is moved leftward from the position D to the position E, a laser inverter 9 existing in the position F is pulled by a wire 12 extended to a pulley 10 and moves to the position G by overcoming the force of a tension spring 13. The moving distance between the head 3 and the inverter 9 is the displacement between the head 3 and the inverter 9 by a differential movement via the wire 12 and the pulley 10 and therefore and displacement of the inverter 9 is 1/2 the displacement L of the head 3. The changing length of the distance to a laser oscillator 1 according to the movement of the head 3 and the length of the optical path moving back and forth invertedly between the inverter 9 and the head 3 are offset so that the optical path maintains the specified length regardless of the movement in the position of the head 3.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は、レーザ加工装置のレーザ光の伝送に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to transmission of laser light of a laser processing device.

〔従来技術〕[Prior art]

従来この踵の装置として第1図に示すものがあった。図
において、(1)はレーザ発振器、 (23は平面鏡、
(3)は加工ヘッド、(48!レンズ、(5)はレーザ
光、(6)は被加工物で、平面鏡(2)お↓び加工ヘッ
ド(6目ま筺体に固定され、レーザ発振器(1)からの
出力であるレーザ光(51ヲ平面鏡(2)に1って反射
させ、加工ヘッド(6)内に設けたレンズ(4)へ入射
させて、このレンズ+41により集光さね、たレーザ光
(5)の焦点位Uに被加工物(61が定置されている。
Conventionally, there is a heel device shown in FIG. 1. In the figure, (1) is a laser oscillator, (23 is a plane mirror,
(3) is the processing head, (48! lens, (5) is the laser beam, (6) is the workpiece, the plane mirror (2) and the processing head (6 eyes) are fixed to the housing, and the laser oscillator (1 ) output from the laser beam (51) is reflected by a plane mirror (2), is incident on a lens (4) provided in the processing head (6), and is condensed by this lens +41. A workpiece (61) is placed at the focal point U of the laser beam (5).

次に上記装置の動作について説明する。第1図の構成に
おいて、レンズ(4)で集光されたレーザ光(51が焦
点位置にある被加工物(6)に照射さね、ると、レーザ
光(5)は被加工物(6)の表面層で吸収されて熱エネ
ルギに変換され、被加工物(6)馨溶融して穴あけ、溶
断等の加工を行なう。例えば被加工物(61にレーザ光
(51を照射しながら、加工ヘッド(6)の位置を図示
のAから破線で示したBへ移動すると、し−ザ光(5)
の被加工物(6)へ照射した軌跡長さ、すなわち図のL
に相当する長さの溶断加工を行なうことができる。また
、上記の加工ヘッド131 ’& N C装置等で制御
して移動させれば、任意の形状の加工が行なえる。
Next, the operation of the above device will be explained. In the configuration shown in Fig. 1, when the laser beam (51) focused by the lens (4) irradiates the workpiece (6) at the focal position, the laser beam (5) irradiates the workpiece (6). ) is absorbed by the surface layer of the workpiece (6) and converted into heat energy, which melts the workpiece (6) and performs processing such as drilling or cutting.For example, while irradiating the workpiece (61 with a laser beam (51), When the position of the head (6) is moved from A shown in the diagram to B shown by the broken line, the laser light (5)
The length of the trajectory irradiated onto the workpiece (6), that is, L in the figure
It is possible to cut the length corresponding to . Further, by controlling and moving the processing head 131' and the NC device described above, processing into an arbitrary shape can be performed.

しかし、第2図に示すように、レーザ発振器(11から
発振するレーザ光(5)はθで示した発散角を持つ特性
があるので、レーザ発振器(1)からの距離の長さに応
じて、レーザ光(5)の径が大きくなる。この発散角θ
はシングルモードで2ミリラジアル程度であるが、例え
ば、レーザ発振器(1)からの距離がIQmの点では、
出口の径が20fgのレーザ光(51)径カ40 mと
なって、大きな径の差が生じてくる。
However, as shown in Fig. 2, the laser beam (5) emitted from the laser oscillator (11) has a characteristic of having a divergence angle indicated by θ, so the distance from the laser oscillator (1) , the diameter of the laser beam (5) increases.This divergence angle θ
is about 2 milliradial in single mode, but for example, when the distance from the laser oscillator (1) is IQm,
The laser beam (51) with an exit diameter of 20 fg has a diameter of 40 m, resulting in a large difference in diameter.

第6図は第2図におけるA位置のレーザ光を(−)。Figure 6 shows the laser beam at position A in Figure 2 (-).

B位置のレーザ光な(5b)とした、レンズ(4)によ
る集光性の差を示す。すなわち、焦点Cにおける集光径
は、太い径のレーザ光(5&)が細い径のレーザ光(5
b)より小さい。さらに、詳細にこの集光径の差を示し
7を第4図では、レンズからの距離に↓ってレーザ光(
5a)とレーザ光(5b)との集光性能の相異が認めら
れる。
It shows the difference in light convergence between the lens (4) and the laser beam at position B (5b). In other words, the condensing diameter at the focal point C is such that the laser beam (5&) with a large diameter becomes the laser beam (5&) with a narrow diameter.
b) smaller. Furthermore, in Figure 4, which shows the difference in the condensing diameter in detail, the laser beam (
Differences in light focusing performance between 5a) and laser light (5b) are recognized.

従来のレーザ加工装置は、以上のように構成されている
ので、レーザ発振器から距離が異なる位置では、それぞ
れのレーザ光の径が相異するので。
Since the conventional laser processing apparatus is configured as described above, the diameter of each laser beam differs at positions at different distances from the laser oscillator.

集光性の差によって被加工物に照射するレーザ光のスポ
ット径が均一でないため、同一条件で加工できないとい
う欠点があった。
Since the spot diameter of the laser beam irradiated onto the workpiece is not uniform due to the difference in light focusing ability, there is a drawback that processing cannot be performed under the same conditions.

〔発明の概要〕[Summary of the invention]

この発明は、上記のような従来のものの欠点を解決する
ためになされたもので、加工ヘッドが移動してもレーザ
発振器から加工ヘッドまでの光路長を一定にすることに
より、集光性が加工ヘッドの位置にニジ変化しないレー
ザ加工装置V提供するものである。
This invention was made to solve the drawbacks of the conventional ones as described above, and by keeping the optical path length from the laser oscillator to the processing head constant even when the processing head moves, the light focusing ability is improved during processing. This invention provides a laser processing device V that does not cause any slight change in the position of the head.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一笑施例ケ図について説明する。 Hereinafter, an explanation will be given of an exemplary embodiment of the present invention.

第5図において、 +71.181は平面鏡、(9)は
平面鏡17L(81ヲ固定しているレーザ光反転器で5
図エリみて左右に自在に移動できるようになっている。
In Figure 5, +71.181 is a plane mirror, (9) is a plane mirror 17L (81 is a fixed laser beam inverter, and 5
As you can see from the diagram, it can be moved freely left and right.

(10)j2滑車でレーザ光反転器(9)と一体にt、
rつてふする支持片(9a′)OJ一端に軸支されてい
る。 (11a)(11b)は固定点、(12)はワイ
ヤで、ワイヤ(12)の一端は固定点(Ila)に、他
端は加工ヘッド(31の筐体に接続され、滑車(10)
に張架して6る。(13)は引張りばねで一端は固定点
(11b)に、他端は支持片(9a)に固定されており
、光反転器(9)を常に図エリみて右方・\引張る作用
をしている。
(10) t integrally with the laser beam inverter (9) using the j2 pulley;
A supporting piece (9a') supporting R is pivotally supported at one end of OJ. (11a) and (11b) are fixed points, (12) is a wire, one end of the wire (12) is connected to the fixed point (Ila), the other end is connected to the housing of the processing head (31), and the pulley (10)
6. (13) is a tension spring, one end of which is fixed to the fixed point (11b) and the other end to the support piece (9a), which always pulls the light inverter (9) to the right when looking at the diagram. There is.

次に本発明の動作について説明する、加工ヘッド(6]
?図示のD位置エリ左方の破線で示し九E位置へ移動す
ると、F位置にあったレーザ反転器(9)は引張りばね
(13)Oツカに抗しながら、滑車(10)に張架され
たワイヤ(12)に引張られて、破線で示しyhG位置
まで移動する。この加工ヘッド(61とレーザ反転器(
91との移動距離、すなわちD−BとF’−Gとはワイ
ヤ(12)と滑車(10)とを介した差動による加工ヘ
ッド131とレーザ反転器(9)の変位となるので。
Next, the operation of the present invention will be explained. Processing head (6)
? When the D position shown in the figure moves to the 9E position indicated by the broken line on the left, the laser inverter (9) that was in the F position is stretched on the pulley (10) while resisting the tension spring (13). It is pulled by the wire (12) and moves to the yhG position shown by the broken line. This processing head (61 and laser inverter (
91, that is, D-B and F'-G, are the displacements of the processing head 131 and the laser inverter (9) due to the differential movement via the wire (12) and the pulley (10).

レーザ反転器(9)の変位は加工ヘッド(31の変位り
の1/2になる。したがって、加工ヘッド(61の移動
に一ザ反転器(91と加工ヘッド(31間を反転して往
律する光路の長さとが相殺し合うので、加工ヘッド(6
)の位置の移動には無関係に光路長は一定ン保つことに
なる。
The displacement of the laser inverter (9) is 1/2 of the displacement of the processing head (31). Therefore, when the processing head (61) moves, the laser inverter (91) and the processing head (31 are inverted and reciprocated). Since the length of the optical path cancels out each other, the processing head (6
) The optical path length remains constant regardless of the movement of the position.

上記実施例では加工ヘッド(3)が−次元の移動をする
場合について説明したが、第6図に示すように二次元の
任意形状で加工できるレーザ装置では。
In the above embodiment, a case has been described in which the processing head (3) moves in a -dimensional direction, but as shown in FIG. 6, a laser device capable of processing an arbitrary two-dimensional shape may be used.

加工台(14恥長手方向に移動するX軸台(15X)に
取付けられて直交する方向に移動するY m 似15Y
)に加工ヘッド(6)が取付けられ、またレーザ光反転
器(9X)、(9F)はそれぞれX軸台(15X )−
Y 1lII伍15Y)と同じ方向に移動でき、この移
動は滑車(10X) 。
Processing table (14 Y, which is attached to an X-axis table (15X) that moves in the longitudinal direction and moves in the orthogonal direction, similar to 15Y)
) is attached to the processing head (6), and the laser beam inverters (9X) and (9F) are each attached to the
You can move in the same direction as Y 1lII 515Y), and this movement is done using a pulley (10X).

(10Y)および引張りばね(13X)、(13Y)の
作用によってX、Y軸移動台(15X) (15YX7
−3移動亙の1/2になるので、第5図の実施例と同様
に加工ヘッド(3の位置に無関係に光路長は一定となる
(10Y) and tension springs (13X) and (13Y), the X and Y axis moving table (15X) (15YX7
Since the travel distance is 1/2 of -3, the optical path length is constant regardless of the position of the processing head (3), similar to the embodiment shown in FIG.

まfc、第7図に示す工うに、加工ヘッド(3)を移動
させるボールネジ(17)と光反転器(91を移動させ
るボールネジ(18)のピッチ、あるいは歯車列(19
)の歯車比によって加工ヘッド(6)と光反転器(9)
の移動量を2:1にしてもよい。さらには、第8図に示
す工5に、モータ(20)、(21)をNC装置(22
)等で駆動して回転比を制御し、上記移動量を2:1に
しても前記実施例と同様の効果を奏する。
7, the pitch of the ball screw (17) that moves the processing head (3) and the ball screw (18) that moves the optical inverter (91), or the pitch of the gear train (19)
) processing head (6) and optical inverter (9) depending on the gear ratio.
The amount of movement may be set to 2:1. Furthermore, the motors (20) and (21) are connected to the NC device (22) in the workpiece 5 shown in FIG.
) etc. to control the rotation ratio and set the above-mentioned movement amount to 2:1, the same effect as in the embodiment described above can be obtained.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、加工ヘッドが移動して
もレーザ発振器から加工ヘッドまでの光路長を常に一定
にすることができるので、加工ヘッドの位置によって集
光性が変化しない、安定なレーザ加工装置が得られる効
果がある。
As described above, according to the present invention, even if the processing head moves, the optical path length from the laser oscillator to the processing head can always be kept constant, so that the light focusing ability does not change depending on the position of the processing head and is stable. This has the effect of providing a laser processing device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のレーザ加工装置を示す構成図、第2図第
3図および第4図は従来のレーザ加工装置の動作を示す
説明図、笛5図はこの発明の一実施例を示す構成図、属
6図、第7図および第8図はそねそれこの発明の他の実
施fll?示した構成図である。 図において、(1)はレーザ発振器、(2)は平面鏡、
(3)は加工ヘッド、(4)はレンズ、(51はレーザ
光、(6)は被加工物、 +71.+81は平面鏡、[
91はレーザ光反転器。 (10)ハ滑車−(11a)、(11b) l;El’
j定点、(12)は’71ヤ、 (13)は引張りばね
である。 なお1図中同一群号は同一まfcは相当部分を示すもの
とする。 代理人 弁理士 木 村 三 朗 第1図 し〉スウ・う、1茎旨占電 (mm) 15 図 第6図 1 3X
FIG. 1 is a configuration diagram showing a conventional laser processing device, FIG. 2, FIG. 3, and FIG. 4 are explanatory diagrams showing the operation of a conventional laser processing device. FIG. Figures 6, 7 and 8 are all of the other embodiments of this invention. FIG. In the figure, (1) is a laser oscillator, (2) is a plane mirror,
(3) is the processing head, (4) is the lens, (51 is the laser beam, (6) is the workpiece, +71. +81 is the plane mirror, [
91 is a laser beam inverter. (10) H pulley - (11a), (11b) l; El'
j fixed point, (12) is '71 Y, (13) is a tension spring. Note that the same group numbers in Figure 1 are the same, and fc indicates the corresponding parts. Agent Patent Attorney Mitsuro Kimura Diagram 1 〉 Sue U, 1 stem (mm) 15 Diagram 6 1 3X

Claims (1)

【特許請求の範囲】[Claims] (1)レーザ発振器よりのレーザ光をレンズを設けた加
工ヘッドに入射させ、前記加工ヘッドを移動させて被加
工物ヶ加工する装置において、前記レーザ発振器エリの
レーザ光を反転して前記加工ヘッドへ入射させるレーザ
光反転器ケ備え、この光反転器の移動距離が前記加工ヘ
ッドの移動距離の1/2で同方向へ移動することを特徴
とするレーザ加工装置。 (2光反転2非に固定された支持片に軸支した滑車と、
一端な第1の固定点に他端を加工ヘッドに接続し前記滑
車に張架したワイヤと、一端を第20J固定点に他端を
前記支持片に接続さね友引張りばねと?備えIC特許請
求の範囲第1項記載のレーザ加工装置。
(1) In a device that makes a laser beam from a laser oscillator enter a processing head provided with a lens and moves the processing head to process a workpiece, the laser beam from the laser oscillator is inverted and the processing head 1. A laser processing apparatus comprising: a laser beam inverter for causing a laser beam to enter the laser beam; the laser beam inverter moves in the same direction at a distance of 1/2 of the movement distance of the processing head. (A pulley pivotally supported on a support piece fixed to two light inverters,
A wire with one end connected to the first fixed point and the other end connected to the processing head and stretched around the pulley, and a tongue and groove tension spring connected one end to the 20J fixed point and the other end connected to the support piece? A laser processing apparatus according to claim 1.
JP59054832A 1984-03-22 1984-03-22 Laser working device Granted JPS60199586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054832A JPS60199586A (en) 1984-03-22 1984-03-22 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054832A JPS60199586A (en) 1984-03-22 1984-03-22 Laser working device

Publications (2)

Publication Number Publication Date
JPS60199586A true JPS60199586A (en) 1985-10-09
JPH0155076B2 JPH0155076B2 (en) 1989-11-22

Family

ID=12981615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054832A Granted JPS60199586A (en) 1984-03-22 1984-03-22 Laser working device

Country Status (1)

Country Link
JP (1) JPS60199586A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245492A (en) * 1985-08-09 1987-02-27 サントル・ド・ルシエルシユ・メタリユルジク Apparatus for compensating track of laser beam and its use
JPH04182090A (en) * 1990-11-19 1992-06-29 Koike Sanso Kogyo Co Ltd laser processing equipment
WO1993005921A1 (en) * 1991-09-26 1993-04-01 Fanuc Ltd Optical path length fixing system in laser processing machine
EP1285718A1 (en) * 2001-08-18 2003-02-26 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser beam
KR20030058321A (en) * 2001-12-31 2003-07-07 대우종합기계 주식회사 Beam length constant device of raser machine
EP1566235A1 (en) * 2004-02-18 2005-08-24 Yamazaki Mazak Kabushiki Kaisha Laser beam working machine with first and second beam guide portions for shortening the length of the optical path, the latter being held constant during laser processing
WO2009142607A1 (en) * 2008-05-23 2009-11-26 Durmazlar Makina Sanayi Ve Ticaret Anonim Sirketi A laser cutting machine with moving mirror mechanism
CN105880845A (en) * 2016-05-31 2016-08-24 孔剑 Double-station laser cutting machine for pipe products

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200724276A (en) * 2005-12-26 2007-07-01 Foxsemicon Integrated Tech Inc Laser cutting apparatus
KR100998484B1 (en) * 2010-07-07 2010-12-06 레이져라이팅(주) Light guide plate laser processing device with constant optical path distance of laser beam

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245492A (en) * 1985-08-09 1987-02-27 サントル・ド・ルシエルシユ・メタリユルジク Apparatus for compensating track of laser beam and its use
JPH04182090A (en) * 1990-11-19 1992-06-29 Koike Sanso Kogyo Co Ltd laser processing equipment
WO1993005921A1 (en) * 1991-09-26 1993-04-01 Fanuc Ltd Optical path length fixing system in laser processing machine
US5406048A (en) * 1991-09-26 1995-04-11 Fanuc Ltd. Optical path length fixing apparatus for a laser processing machine
EP1285718A1 (en) * 2001-08-18 2003-02-26 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser beam
US6586706B2 (en) 2001-08-18 2003-07-01 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laser machine tool with beam guide
EP1336448A3 (en) * 2001-08-18 2003-09-10 Trumpf Werkzeugmaschinen GmbH + Co. KG Machine tool for machining workpieces by laser, with at least one common shared rack
KR20030058321A (en) * 2001-12-31 2003-07-07 대우종합기계 주식회사 Beam length constant device of raser machine
EP1566235A1 (en) * 2004-02-18 2005-08-24 Yamazaki Mazak Kabushiki Kaisha Laser beam working machine with first and second beam guide portions for shortening the length of the optical path, the latter being held constant during laser processing
US7220939B2 (en) 2004-02-18 2007-05-22 Yamazaki Mazak Kabushiki Kaisha Laser beam machine
WO2009142607A1 (en) * 2008-05-23 2009-11-26 Durmazlar Makina Sanayi Ve Ticaret Anonim Sirketi A laser cutting machine with moving mirror mechanism
CN105880845A (en) * 2016-05-31 2016-08-24 孔剑 Double-station laser cutting machine for pipe products

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