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JPS60195957U - Engine intake air temperature automatic adjustment device - Google Patents

Engine intake air temperature automatic adjustment device

Info

Publication number
JPS60195957U
JPS60195957U JP8292584U JP8292584U JPS60195957U JP S60195957 U JPS60195957 U JP S60195957U JP 8292584 U JP8292584 U JP 8292584U JP 8292584 U JP8292584 U JP 8292584U JP S60195957 U JPS60195957 U JP S60195957U
Authority
JP
Japan
Prior art keywords
adjustment device
air temperature
intake air
automatic adjustment
engine intake
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8292584U
Other languages
Japanese (ja)
Other versions
JPH0117644Y2 (en
Inventor
杢屋 博一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzuki Motor Corp
Original Assignee
Suzuki Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuki Motor Corp filed Critical Suzuki Motor Corp
Priority to JP8292584U priority Critical patent/JPS60195957U/en
Publication of JPS60195957U publication Critical patent/JPS60195957U/en
Application granted granted Critical
Publication of JPH0117644Y2 publication Critical patent/JPH0117644Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Temperature-Responsive Valves (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はエイシン吸入空気温度自動調整装置の構成を示
す縦断−面図、第2図はこの考案装置の実施例を示すサ
ーモワックスシリンダ装置の側面図、第3図は同上正面
図、第4図はこの考案の他の実施例を示すサーモワック
スシリンダ装置の側面図、第5図は同上正面図である。 2・・・吸入通路、2a・・・通路壁、3・・・暖気供
給通路1.4・・・冷気供給通路、5・・・切換バルブ
、6・・・サーモワックスシリンダ装置、12・・・感
熱板。
Fig. 1 is a vertical cross-sectional view showing the structure of the Eisin intake air temperature automatic adjustment device, Fig. 2 is a side view of a thermowax cylinder device showing an embodiment of this devised device, Fig. 3 is a front view of the same, and Fig. 4 The figure is a side view of a thermowax cylinder device showing another embodiment of this invention, and FIG. 5 is a front view of the same. 2... Suction passage, 2a... Passage wall, 3... Hot air supply passage 1.4... Cold air supply passage, 5... Switching valve, 6... Thermowax cylinder device, 12...・Heat-sensitive plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャブレタ上流の吸入通路に暖気供給通路と冷気供給通
路とを切換バルブを介して接続し、この切換バルブを吸
入通路に設置したす」モワックスシリツダ装置によって
制御するようにすると共にサーモワックスシリンダ装置
の感熱部に感熱板を延設し、この感熱板を吸入通路壁に
密着あるいは通路壁を貫通して外気に晒すようにしたこ
とを特徴とするエンジンの吸入空気温度自動調整装置。
The hot air supply passage and the cold air supply passage are connected to the intake passage upstream of the carburetor via a switching valve, and this switching valve is installed in the intake passage. An automatic intake air temperature adjustment device for an engine, characterized in that a heat-sensitive plate is extended to the heat-sensitive part of the engine, and the heat-sensitive plate is exposed to the outside air by closely contacting the wall of the intake passage or penetrating the wall of the passage.
JP8292584U 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device Granted JPS60195957U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292584U JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8292584U JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Publications (2)

Publication Number Publication Date
JPS60195957U true JPS60195957U (en) 1985-12-27
JPH0117644Y2 JPH0117644Y2 (en) 1989-05-23

Family

ID=30631085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8292584U Granted JPS60195957U (en) 1984-06-06 1984-06-06 Engine intake air temperature automatic adjustment device

Country Status (1)

Country Link
JP (1) JPS60195957U (en)

Cited By (59)

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US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
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US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
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US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
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US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
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US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe

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US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7560804B1 (en) 1998-06-24 2009-07-14 Amkor Technology, Inc. Integrated circuit package and method of making the same
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
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US7564122B2 (en) 1998-11-20 2009-07-21 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US7535085B2 (en) 1999-10-15 2009-05-19 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
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US7321162B1 (en) 1999-10-15 2008-01-22 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
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