JPS60193347A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To enable to form distinct characters, etc. to a semiconductor molded piece having favorable workability by a method wherein a stamping means to the resin molded body is provided to the tip surface of an ejector pin provided to a mold for resin molding. CONSTITUTION:A lower mold 2 having a cavity 3 is provided under an upper mold 1. An ejector pin 4 to move upwards and downwards toward the inside of the cavity 3 is provided to the mold 2 thereof. A projected type stamp body 5 is fixed as a stamping means to the tip surface of the pin 4 thereof. At a device constructed in such a way, the expression of a stamp is attained by pushing up the pin 4 upwards to release the mold after a package main body is formed, and at the same time by pressing the package main body with the stamp body. As a result, the prescribed expression of the stamp can be attained to the part to be stamped on the back of the package main body.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to semiconductor manufacturing equipment, and more particularly to semiconductor manufacturing equipment used in resin molding of semiconductor products such as DIP type ICs.

[Technical background of the invention]

As is well known, the cage body of semiconductor products such as DIP type ICs is usually made by resin molding. and,
Among the semiconductor products manufactured in this way, those that are judged to have passed various functions, appearance, etc. tests are displayed with the country of origin, company name, product name, etc. By the way, such display has conventionally been performed using a rubber stamp, a metal stamp, a laser, etc. using mark ink or the like.

However, in the case of a rubber stamp or metal stamp,
Since ink for marks is used, the characters tend to become unclear and need to be retyped, reducing work efficiency.

Further, especially when a rubber stamp is used, characters may be cut off, characters may smear, etc. due to the lifespan of the rubber stamp. Furthermore, in the case of display using a laser, it is necessary to set a magnifying film in which a portion corresponding to the displayed characters is cut out in the laser device, which reduces work efficiency.

In addition, if the resin molded product is small, and considering the accuracy of stamping with rubber stamps or metal stamps, the company name and product name will be marked on the arm cage body, and the country of origin will naturally be slightly spaced. You will be able to hit where you are. In order to avoid this, it is conceivable to display the characters in very small characters of, for example, 0.5 m or less, but as described above, blurring of the characters cannot be avoided.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor manufacturing apparatus that can print clear characters on semiconductor molded products with good workability.

[Summary of the invention]

The present invention utilizes one eject turbine that is always provided in one cavity when resin-molding a semiconductor molded product in a mold and releasing it from the mold. By providing a marking means such as a convex marking body, it is possible to display clear characters on a semiconductor molded product at low cost and with good workability.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1(a) and 2.

1 in the figure is the upper mold. A lower mold 3 having a cavity 2 is provided below the upper mold. This lower mold 3 is provided with an ejector turbine 4 that moves up and down into the cavity 2. This ejector turbine 4 is often used to release the T4 cage body from the resin molded body after molding. A convex stamp 5 is attached to the tip surface of the ejector turbine 4 as a stamp means, and is labeled with "JIA9^hair", which corresponds to "JAPAN", for example.

In an apparatus having such a structure, the country of origin "JAPAN" is displayed by molding the package body, pushing the ejector turbine 4 upward to release the package body, and simultaneously pressing the cage body with the stamping body 5. .

As a result, for example, as shown in FIG. 2, the country of origin "JAPAN" can be displayed in the central part of the back surface of the package body 6, that is, in the engraved part 8.
Indicates the mode.

According to the present invention, since the stamping body 5 is provided on the tip surface of the ejector turbine 4, the molded package body 6 is released by the ejector turbine 4, and at the same time, the stamping body 5 is removed. The country of origin can be displayed by pressing. Therefore, it is possible to avoid blurring of the characters, which is the case with conventional rubber stamps or metal stamps using mark ink or the like. This effect can be obtained even if the molded product becomes smaller.

Moreover, since the country of origin ("JAPAN") can be displayed at the same time as the mold cage body 6 is released by the ejector turbine 4, work efficiency can be significantly improved compared to the conventional method.

In the above embodiments, a convex stamp is displayed on the Gucceso body at the same time as the resin molding as the stamp means, but the present invention is not limited to this. For example, it may be a concave stamp.

Further, in the above embodiment, a case has been described in which the country of origin is displayed as "JkPAN" on the stamped body, but the invention is not limited to this, and it goes without saying that other characters or the like may be displayed.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a semiconductor manufacturing apparatus that can perform stamping at the same time as forming a model of a molded product using an ejector turbine, and can thereby perform clear character display with good workability.

[Brief explanation of drawings]

FIG. 10) is a cross-sectional view of a semiconductor manufacturing apparatus according to an embodiment of the present invention, FIG. 1(b) is a plan view of FIG. 1(a), and FIG. FIG. 3 is a perspective view showing an example of a stamp for indicating the country of origin. DESCRIPTION OF SYMBOLS 1... Upper mold, 2... Lower mold, 3... Cavity, 4... Eject turbine, 5... Engraving body (engraving means), 6... 9 cage body, 7 ...Lead, 8
...The part to be engraved on the package body.

Claims (2)

[Claims] (1) An upper mold, a lower mold that is provided below the upper mold or is used integrally with the stopper mold for resin molding of semiconductor elements, and the upper mold or the lower mold. 1. A semiconductor manufacturing device comprising: an ejector pin provided on either one of the sides, and a means for marking a resin molded body on a tip end surface of the ejector pin. (2) The semiconductor manufacturing apparatus according to claim 1, wherein the marking means is a convex marking body that is stamped on the resin molded body at the same time as the resin molding.