JPS60192401U - chip resistor - Google Patents
chip resistorInfo
- Publication number
- JPS60192401U JPS60192401U JP8164584U JP8164584U JPS60192401U JP S60192401 U JPS60192401 U JP S60192401U JP 8164584 U JP8164584 U JP 8164584U JP 8164584 U JP8164584 U JP 8164584U JP S60192401 U JPS60192401 U JP S60192401U
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- chip resistor
- plating film
- silver
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
° 第1図は本考案の実施例のチップ抵抗器の断面図
、第2図はその一部の拡大断面図、第3図は半田のメッ
キ膜層と部品相互の付着発生率の関係を示す特性図、第
4図は従来のチップ抵抗器の断面図である。
1・・・絶縁性基板、2・・・第1電極層、3・・・第
2電極層にニッケル)、4・・・第3電極層(錫)、5
・・・第4電極層(半田)。° Fig. 1 is a cross-sectional view of a chip resistor according to an embodiment of the present invention, Fig. 2 is an enlarged cross-sectional view of a part thereof, and Fig. 3 shows the relationship between the solder plating film layer and the rate of adhesion between components. The characteristic diagram, FIG. 4, is a cross-sectional view of a conventional chip resistor. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... First electrode layer, 3... Nickel on the second electrode layer), 4... Third electrode layer (tin), 5
...Fourth electrode layer (solder).
Claims (1)
る導電性ペーストにより形成された第1電極層の表面に
、ニッケルのメッキ膜にて第2電極層を形成し、この第
2電極層の表面に錫のメッキ膜にて第3電極層を形成し
、さらに第3電極層の表面に膜厚0.8〜1.2μmの
半田のメッキ膜よりなる第4電極層を形成したチップ抵
抗器。A second electrode layer is formed with a nickel plating film on the surface of the first electrode layer formed on the end of the insulating substrate with a conductive paste mainly composed of silver or palladium/silver. A chip resistor in which a third electrode layer is formed with a tin plating film on the surface of the chip resistor, and a fourth electrode layer made of a solder plating film with a film thickness of 0.8 to 1.2 μm is further formed on the surface of the third electrode layer. vessel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8164584U JPS60192401U (en) | 1984-05-31 | 1984-05-31 | chip resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8164584U JPS60192401U (en) | 1984-05-31 | 1984-05-31 | chip resistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60192401U true JPS60192401U (en) | 1985-12-20 |
JPH023601Y2 JPH023601Y2 (en) | 1990-01-29 |
Family
ID=30628617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8164584U Granted JPS60192401U (en) | 1984-05-31 | 1984-05-31 | chip resistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60192401U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62286204A (en) * | 1986-06-04 | 1987-12-12 | ロ−ム株式会社 | Manufacture of chip electronic parts |
JP2003045702A (en) * | 2001-07-31 | 2003-02-14 | Koa Corp | Chip resistor and manufacturing method therefor |
-
1984
- 1984-05-31 JP JP8164584U patent/JPS60192401U/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62286204A (en) * | 1986-06-04 | 1987-12-12 | ロ−ム株式会社 | Manufacture of chip electronic parts |
JP2003045702A (en) * | 2001-07-31 | 2003-02-14 | Koa Corp | Chip resistor and manufacturing method therefor |
JP4707890B2 (en) * | 2001-07-31 | 2011-06-22 | コーア株式会社 | Chip resistor and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH023601Y2 (en) | 1990-01-29 |
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