JPS60189977U - Socket for thin IC - Google Patents
Socket for thin ICInfo
- Publication number
- JPS60189977U JPS60189977U JP7795884U JP7795884U JPS60189977U JP S60189977 U JPS60189977 U JP S60189977U JP 7795884 U JP7795884 U JP 7795884U JP 7795884 U JP7795884 U JP 7795884U JP S60189977 U JPS60189977 U JP S60189977U
- Authority
- JP
- Japan
- Prior art keywords
- thin
- socket
- socket base
- hinged
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の薄形ＩＣ用ソケットの１例の垂直断面図
、第２図は本考案の薄形ＩＣ用ソケット ゛の１実施例
の垂直断面を模式化して描いた説明図である。
１・・・ＩＣ，１ａ・・・リード、２，２′・・・ベー
ス、２ａ ””端子、３．３’−・・蓋、３ａ、３ｂ・
・・蓋、３ａ１．３ｂ−１””突起、３ ａ −２・・
・カム、４・・・軸、５・・・吸着ヘッド、６ａ、６ｂ
・・・シリンダ、６ａ１ ？ ６ ｂ １ ”田−
ラ、７ａｙ７ｂ・・・シリンダ、８・・・レバー、９・
・・枢支軸、１０・・・ブツシャ。FIG. 1 is a vertical sectional view of an example of a conventional thin IC socket, and FIG. 2 is a schematic vertical sectional view of an embodiment of the thin IC socket of the present invention. 1...IC, 1a...Lead, 2, 2'...Base, 2a "" terminal, 3.3'-...Lid, 3a, 3b...
・・Lid, 3a1.3b-1”” protrusion, 3a-2・・
・Cam, 4...axis, 5...suction head, 6a, 6b
...Cylinder, 6a1? 6 b 1” field
La, 7ay7b...Cylinder, 8...Lever, 9.
... Pivot axis, 10... Butsusha.
Claims (1)
設したソケットベースに、上記のリードを電極に向けて
押しつける蓋を蝶着した薄形ＩＣ用のソケットにおいて
、′前記の蓋を複数個に分割してそれぞれ分割した蓋を
ソケットベースに蝶着し、相互に独立して開閉し得るよ
うにし、かつ、前記ソケットベース上に載置した薄形Ｉ
Ｃを下方から押し上げるレバ一部材を設け、このレバ一
部材を前記の分割蓋の内の少なくともいずれか一つと連
動せしめる手段を設けたことを特徴とする薄形ＩＣ用の
ソケット。In a socket for a thin IC, a lid for pressing the above-mentioned leads toward the electrodes is hinged to a socket base in which a plurality of electrodes that contact the leads of the thin IC and are conductive are arranged in a row. A thin type I which is divided into a plurality of parts, each of which is hinged to a socket base so that they can be opened and closed independently of each other, and which is placed on the socket base.
1. A socket for a thin IC, comprising: a lever member for pushing up C from below; and means for interlocking the lever member with at least one of the split lids.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795884U JPS60189977U (en) | 1984-05-29 | 1984-05-29 | Socket for thin IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795884U JPS60189977U (en) | 1984-05-29 | 1984-05-29 | Socket for thin IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60189977U true JPS60189977U (en) | 1985-12-16 |
| JPH0116297Y2 JPH0116297Y2 (en) | 1989-05-15 |
Family
ID=30621499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7795884U Granted JPS60189977U (en) | 1984-05-29 | 1984-05-29 | Socket for thin IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189977U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017145656A1 (en) * | 2016-02-22 | 2017-08-31 | 山一電機株式会社 | Method for mounting and removing semiconductor device and device for mounting and removing semiconductor device using same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1094220B1 (en) * | 1998-06-19 | 2005-07-27 | Matsushita Electric Industrial Co., Ltd. | Air conditioner |
-
1984
- 1984-05-29 JP JP7795884U patent/JPS60189977U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017145656A1 (en) * | 2016-02-22 | 2017-08-31 | 山一電機株式会社 | Method for mounting and removing semiconductor device and device for mounting and removing semiconductor device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0116297Y2 (en) | 1989-05-15 |
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