JPS60187394A - Processing method for chemical copper plating waste liquid - Google Patents
Processing method for chemical copper plating waste liquidInfo
- Publication number
- JPS60187394A JPS60187394A JP4127384A JP4127384A JPS60187394A JP S60187394 A JPS60187394 A JP S60187394A JP 4127384 A JP4127384 A JP 4127384A JP 4127384 A JP4127384 A JP 4127384A JP S60187394 A JPS60187394 A JP S60187394A
- Authority
- JP
- Japan
- Prior art keywords
- copper plating
- plating waste
- waste liquid
- chemical copper
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 24
- 229910052802 copper Inorganic materials 0.000 title claims description 24
- 239000010949 copper Substances 0.000 title claims description 24
- 239000007788 liquid Substances 0.000 title claims description 16
- 239000002699 waste material Substances 0.000 title claims description 15
- 238000007747 plating Methods 0.000 title claims description 12
- 239000000126 substance Substances 0.000 title claims description 12
- 238000003672 processing method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 239000000440 bentonite Substances 0.000 claims description 6
- 229910000278 bentonite Inorganic materials 0.000 claims description 6
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 239000011593 sulfur Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- GSFSVEDCYBDIGW-UHFFFAOYSA-N 2-(1,3-benzothiazol-2-yl)-6-chlorophenol Chemical compound OC1=C(Cl)C=CC=C1C1=NC2=CC=CC=C2S1 GSFSVEDCYBDIGW-UHFFFAOYSA-N 0.000 claims description 4
- YJIBHPVNTVUEPU-UHFFFAOYSA-N thorium(iv) sulfide Chemical compound S=[Th]=S YJIBHPVNTVUEPU-UHFFFAOYSA-N 0.000 claims description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- -1 conventionally Substances 0.000 description 1
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
- MZGNSEAPZQGJRB-UHFFFAOYSA-N dimethyldithiocarbamic acid Chemical compound CN(C)C(S)=S MZGNSEAPZQGJRB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Removal Of Specific Substances (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は化学銅めっき廃液の処理方法に係り、特に、Ｅ
ＤＴＡ及び銅を含む化学銅めっき廃液から銅を高度に除
去する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for treating chemical copper plating waste liquid, particularly
The present invention relates to a method for highly removing copper from a chemical copper plating waste solution containing DTA and copper.
化学銅めっき廃液中には多量のＥＤＴＡ及び銅が含まれ
ており、このような廃液を処理するには、従来、電解法
又はホルマリン還元法で銅を５■／β〜１０■／ｌまで
除去した後、硫酸でｐｏを１．８に調節してＥＤＴＡを
５００■／ｌ程度まで除去する方法が採用されている。Chemical copper plating waste liquid contains a large amount of EDTA and copper, and in order to treat such waste liquid, conventionally, copper is removed to 5μ/β to 10μ/l using electrolytic method or formalin reduction method. After that, a method is adopted in which the po is adjusted to 1.8 with sulfuric acid and EDTA is removed to about 500 μ/l.
この廃水を更に放流規準まで浄化処理するために、従来
、消石灰を過剰に添加してｐＨを１２以上に調節した後
、これに高分子凝集剤を添加し、固液分離を行っていた
。In order to further purify this wastewater to meet discharge standards, conventionally, slaked lime was added in excess to adjust the pH to 12 or higher, and then a polymer flocculant was added to perform solid-liquid separation.
しかし、この方法では処理水中の銅濃度を３■／ｌまで
しか低下できず、極めて処理効果が悪かった。However, with this method, the copper concentration in the treated water could only be reduced to 3 .mu./l, and the treatment effect was extremely poor.
本発明の目的は、化学銅メッキ廃液から銅を高い除去率
で除去する処理方法を提供することにある。この目的は
本発明によれば、銅を硫化銅として析出させ、遊離して
いるＥＤＴＡをアルミニウム塩とすることによって達成
される。An object of the present invention is to provide a treatment method for removing copper from chemical copper plating waste liquid at a high removal rate. This object is achieved according to the invention by precipitating the copper as copper sulphide and converting the free EDTA into an aluminum salt.
即ち、本発明による化学銅めっき廃液の処理方法は、化
学銅めっき廃液に硫化ナトリウム、ジメチルジチオカル
バミン酸ナトリウム等の硫黄を含む化合物を添加し、ｐ
Ｈを７に調節し、次いでポリ塩化アルミニウム、ベント
ナイト及び高分子凝集剤を添加した後、固液分離する、
ことを特徴とする。That is, the method for treating chemical copper plating waste liquid according to the present invention involves adding sulfur-containing compounds such as sodium sulfide and sodium dimethyldithiocarbamate to chemical copper plating waste liquid, and
Adjust H to 7, then add polyaluminum chloride, bentonite and a polymer flocculant, and then perform solid-liquid separation.
It is characterized by
本発明方法において、化学銅めっき廃液に硫化ナトリウ
ム、ジメチルジチオカルバミン酸等の硫黄含有化合物を
添加すると、これは廃液中に含まれていたＩＦ、 Ｄ
ＴＡ −Ｇｏと反応しテ遊離（７） ＲＤ Ｔ Ａ及び
硫化銅を生成する。次いで、アルカリ剤又は鉱酸を用い
て廃液のｐｌ＋を７に調節した後、ポリ塩化アルミニう
ムを添加して遊離のＥＤＴＡをＥ ｌ’）ＴＡ−Ａｎと
する。ポリ塩化アルミニウムの添加量は、通常、５０〜
５００■／Ｉｌで充分である。In the method of the present invention, when sulfur-containing compounds such as sodium sulfide and dimethyldithiocarbamic acid are added to the chemical copper plating waste solution, the IF and D contained in the waste solution are removed.
Reacts with TA-Go to produce free Te (7) RD T A and copper sulfide. Then, after adjusting the pl+ of the waste liquid to 7 using an alkaline agent or mineral acid, polyaluminum chloride is added to convert free EDTA to E1')TA-An. The amount of polyaluminum chloride added is usually 50~
500 .mu./Il is sufficient.
他方、硫化銅のフロックは微細で、軽いので、その沈降
性を増強するためにベントナイ］・を添加する。ベント
ナイトの添加量は２５０〜１０００■／ｌであるのが好
ましい。On the other hand, since copper sulfide flocs are fine and light, bentonite is added to enhance their settling properties. The amount of bentonite added is preferably 250 to 1000 μ/l.
生じた硫化銅とベントナイ］・のフロックを更に大きく
成長させ、沈降性を良くするために、高分子凝集剤を添
加する。高分子凝集剤の添加■は、通常、１〜５■／ρ
で充分である。A polymer flocculant is added to make the resulting flocs of copper sulfide and bentonite grow larger and to improve their settling properties. Addition of polymer flocculant ■ is usually 1 to 5 ■/ρ
is sufficient.
本発明方法によれば、化学銅めっき廃液から銅を極めて
高い除去率で除去することができる。According to the method of the present invention, copper can be removed from chemical copper plating waste liquid at an extremely high removal rate.
次に、実施例に基づいて本発明を詳述するが、本発明は
これに限定されるものではない。Next, the present invention will be described in detail based on Examples, but the present invention is not limited thereto.
実施例
ＣｏＤ３６００■／７！、銅１１■／β、ＥＤＴＡ４８
０■／β及びホルムアルデヒド２０■／Ｉｌを含むρ＋
１２の化学銅メッキ廃液１１を水酸化す１〜リウムでｐ
ｌ＋７に調節した後、ジメチルジチオカルバミン酸ナト
リウムを３００■／ｅ添加し、ジャーテスターで４０ｒ
ｐｍで１０分間攪拌した。次いで、ポリ塩化アルミニウ
ム５０■／ｌ及びベントナイト５００■／Ｃを添加し、
最終的にｐ）ｌを７に調節した後、高分子凝集剤として
ハイモロツク５Ｓ−１００を５■／７！添加し、固液分
離を行った。得られた処理水の銅濃度を測定したところ
、０、０５ ｗ／ ｅより低い濃度であった。Example CoD3600■/7! , copper 11■/β, EDTA48
ρ+ containing 0■/β and formaldehyde 20■/Il
12 Chemical copper plating waste liquid 11 is hydroxylated with 1~lium p
After adjusting the temperature to l+7, add 300μ/e of sodium dimethyldithiocarbamate and test it for 40r with a jar tester.
Stirred at pm for 10 minutes. Next, 50 μ/l of polyaluminum chloride and 500 μ/C of bentonite were added,
Finally, after adjusting p)l to 7, Himoroku 5S-100 was added as a polymer flocculant to 5/7! and solid-liquid separation was performed. When the copper concentration of the obtained treated water was measured, it was found to be lower than 0.05 w/e.
従来法によれば、前記のように３ ｗ ／ Ｉｔ程度ま
でしか銅を除去できなかったので、本発明方法によって
達成される銅の除去率は極めて高く、本発明方法は従来
法に比較して格別優れた処理法である。According to the conventional method, copper could only be removed to about 3 w/It as mentioned above, so the copper removal rate achieved by the method of the present invention is extremely high, and the method of the present invention is superior to the conventional method. This is an especially excellent treatment method.
なお、前記の実施例では硫黄を含む化合物としてジメチ
ルジチオカルバミン酸ナトリウムを使用したが、他の硫
黄含有化合物、例えば硫化すトリウムを使用しても同様
に良好な結果が得られる。In the above examples, sodium dimethyldithiocarbamate was used as the sulfur-containing compound, but similarly good results can be obtained by using other sulfur-containing compounds, such as thorium sulfide.
特許出願人 日立プラント建設株式会社patent applicant Hitachi Plant Construction Co., Ltd.
Claims (2)
チオカルバミン酸す１・りうム等の硫黄を含む化合物を
添加し、ｐＨを７に調節し、次いでポリ塩化アルミニウ
ム、ヘントナイト及び高分子凝集剤を添加した後、固液
分離することを特徴とする化学銅めっき廃液の処理方法
。(1) Add sulfur-containing compounds such as thorium sulfide and sodium dimethyldithiocarbamate to the chemical copper plating waste solution, adjust the pH to 7, and then add polyaluminum chloride, hentonite, and a polymer flocculant. A method for treating chemical copper plating waste liquid, which is characterized by solid-liquid separation after solid-liquid separation.
トナイト２５０〜１０００■／７！、高分子凝集剤１〜
５■／ρを添加する特許請求の範囲第１項記載の方法。(2) Polyaluminum chloride 50-500 ■/1, bentonite 250-1000 ■/7! , polymer flocculant 1~
5. The method according to claim 1, wherein 5.times./.rho. is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127384A JPS60187394A (en) | 1984-03-06 | 1984-03-06 | Processing method for chemical copper plating waste liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127384A JPS60187394A (en) | 1984-03-06 | 1984-03-06 | Processing method for chemical copper plating waste liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60187394A true JPS60187394A (en) | 1985-09-24 |
| JPH0122830B2 JPH0122830B2 (en) | 1989-04-27 |
Family
ID=12603830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4127384A Granted JPS60187394A (en) | 1984-03-06 | 1984-03-06 | Processing method for chemical copper plating waste liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60187394A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5190683A (en) * | 1990-06-19 | 1993-03-02 | Baker Hughes Incorporated | Water clarification composition containing a water clarifier component and a floc modifier component |
| JP2017035678A (en) * | 2015-08-07 | 2017-02-16 | 東ソー株式会社 | Method for purifying zinc-containing aqueous solution |
| CN106915812A (en) * | 2015-12-28 | 2017-07-04 | 沈阳中科环境工程科技开发有限公司 | A kind of chemical nickle-plating wastewater inorganic agent and preparation method thereof |
-
1984
- 1984-03-06 JP JP4127384A patent/JPS60187394A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5190683A (en) * | 1990-06-19 | 1993-03-02 | Baker Hughes Incorporated | Water clarification composition containing a water clarifier component and a floc modifier component |
| US5302296A (en) * | 1990-06-19 | 1994-04-12 | Baker Hughes Incorporated | Water clarification using compositions containing a water clarifier component and a floc modifier component |
| JP2017035678A (en) * | 2015-08-07 | 2017-02-16 | 東ソー株式会社 | Method for purifying zinc-containing aqueous solution |
| CN106915812A (en) * | 2015-12-28 | 2017-07-04 | 沈阳中科环境工程科技开发有限公司 | A kind of chemical nickle-plating wastewater inorganic agent and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0122830B2 (en) | 1989-04-27 |
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