JPS60181066U - flexible printed circuit board - Google Patents
flexible printed circuit boardInfo
- Publication number
- JPS60181066U JPS60181066U JP4846485U JP4846485U JPS60181066U JP S60181066 U JPS60181066 U JP S60181066U JP 4846485 U JP4846485 U JP 4846485U JP 4846485 U JP4846485 U JP 4846485U JP S60181066 U JPS60181066 U JP S60181066U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- insulating coating
- flexible printed
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは、従来の回路基板の平面図。第１図すは、第
１図ａのＩ−Ｉ線断面図。第２図ａは、本考案実施例の
第１の絶縁被覆をした状態のプリント回路基板の平面図
。第２図すは、第２図ａの■−■線断面図。第３図ａは
、第２の絶縁被覆をした状態のプリント回路基板の平面
図。第３図すは、第３図ａのｍ−ｍ線断面図。
１・・・・・・ベースフィルム、２・・・・・・銅箔部
、２ａ・・・・・・ランド部、４・・・・・・保護用フ
ィルム、４ｂ・・・・・・開口部、５・・・・・・被覆
用インク。FIG. 1a is a plan view of a conventional circuit board. FIG. 1 is a sectional view taken along line I--I in FIG. 1a. FIG. 2a is a plan view of the printed circuit board with the first insulating coating according to the embodiment of the present invention. FIG. 2 is a sectional view taken along the line ■-■ of FIG. 2a. FIG. 3a is a plan view of the printed circuit board with the second insulating coating applied. FIG. 3 is a sectional view taken along line m-m in FIG. 3a. 1...Base film, 2...Copper foil part, 2a...Land part, 4...Protection film, 4b...Opening Part 5: Coating ink.
Claims (1)
定する複数のランド部を有する電気導体層を形成し、さ
らに前記電気導体層上に絶縁被覆層を形成したプリント
回路基板において、少なくとも前記絶縁被覆層は、複数
個の前記ランド部を１つの開口にて露出する開口部を設
けて被覆形成した第１の絶縁被覆層と、前記開口部の各
ランド部間の開口領域に該ランド部を露出させて被覆形
成した第２の絶縁被覆層と、を有することを特徴とする
プリント回路基板。A printed circuit board in which an electrically conductive layer having a plurality of lands for fixing circuit components is formed on the surface of the base of the printed circuit board, and an insulating coating layer is further formed on the electrically conductive layer, at least the insulating coating. The layer includes a first insulating coating layer formed by providing an opening that exposes a plurality of the land portions through one opening, and a first insulating coating layer that exposes the land portion in an opening area between each land portion of the opening portion. and a second insulating coating layer formed by coating the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4846485U JPS60181066U (en) | 1985-04-01 | 1985-04-01 | flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4846485U JPS60181066U (en) | 1985-04-01 | 1985-04-01 | flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60181066U true JPS60181066U (en) | 1985-12-02 |
| JPH0140204Y2 JPH0140204Y2 (en) | 1989-12-01 |
Family
ID=30564745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4846485U Granted JPS60181066U (en) | 1985-04-01 | 1985-04-01 | flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60181066U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058981U (en) * | 1991-07-12 | 1993-02-05 | アルプス電気株式会社 | Flexible circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386567U (en) * | 1976-12-20 | 1978-07-17 | ||
| JPS5568374U (en) * | 1978-11-02 | 1980-05-10 |
-
1985
- 1985-04-01 JP JP4846485U patent/JPS60181066U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5386567U (en) * | 1976-12-20 | 1978-07-17 | ||
| JPS5568374U (en) * | 1978-11-02 | 1980-05-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058981U (en) * | 1991-07-12 | 1993-02-05 | アルプス電気株式会社 | Flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0140204Y2 (en) | 1989-12-01 |
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