JPS60174863A - Surface treatment of aluminum substrate for forming thin film - Google Patents
Surface treatment of aluminum substrate for forming thin filmInfo
- Publication number
- JPS60174863A JPS60174863A JP2783984A JP2783984A JPS60174863A JP S60174863 A JPS60174863 A JP S60174863A JP 2783984 A JP2783984 A JP 2783984A JP 2783984 A JP2783984 A JP 2783984A JP S60174863 A JPS60174863 A JP S60174863A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- film
- oxide film
- thin film
- aluminum base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 title claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 43
- 238000004381 surface treatment Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 title abstract description 7
- 239000010408 film Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 16
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 238000001312 dry etching Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 45
- 230000007547 defect Effects 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 13
- 238000005530 etching Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 4
- 238000010884 ion-beam technique Methods 0.000 abstract description 3
- 238000001020 plasma etching Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 108091008695 photoreceptors Proteins 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910001370 Se alloy Inorganic materials 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 235000012907 honey Nutrition 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910018110 Se—Te Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- VXAUWWUXCIMFIM-UHFFFAOYSA-M aluminum;oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Al+3] VXAUWWUXCIMFIM-UHFFFAOYSA-M 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 235000012438 extruded product Nutrition 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
- Formation Of Insulating Films (AREA)
- Photoreceptors In Electrophotography (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は薄膜形成用アルミニウム基材の表面処理方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for surface treatment of an aluminum base material for forming a thin film.
PVD法やCVD法を利用してアルミニウム基材の表面
に薄膜を形成して製造した製品としては、太陽電池(蒸
着物質:アモルファスSi)、電子写真用感光体(蒸着
物質:Seまたはその合金、アモルファス3iなど)、
ポリゴンミラー(蒸着物質:A/、3i 02 )など
がある。Products manufactured by forming a thin film on the surface of an aluminum base material using the PVD method or CVD method include solar cells (deposition material: amorphous Si), electrophotographic photoreceptors (deposition material: Se or its alloy, amorphous 3i, etc.),
There are polygon mirrors (deposited material: A/, 3i 02 ), etc.
このような薄膜は、躾質が均一でかつ基材との密着性が
すぐれていな【ノればならない。ところでこれらの製品
の製造工程において、蒸着薄膜の形成時に同WIJ膜の
表面に、脹れ、割れ、ピンホールなどの種々の表面欠陥
が生じることがあり、これが製品の品質上大きな問題と
なっていた。この点を電子写真用感光体について以下に
さらに詳しく説明する。電子写真技術を用いた複写機や
、レーザービームプリンタなどにおいては、アルミニウ
ム基材の表面にSeまたはSe −Te 、Se −T
e −As 、5e−AsなどのSe合金、アモルファ
ス81などの半導体、アモルファス金属、Zn 01C
d S、有機系半導体などの蒸着物質をPVD法、CV
D法などにより蒸着させて薄膜からなる感光層を形成し
、電子写真用感光体を製造しているが、この感光体の製
造工程において感光層形成時に感光層の表面に脹れ、割
れ、ピンホールなどの表面欠陥が生じ、これが電子写真
画像に悪影響を及ぼすという問題があった。このような
1illIの欠陥の原因としては、蒸着物質を真空中で
蒸着させる過程でアルミニウム基材が真空下に200〜
300℃に加熱された時に基材表面から放出されるガス
や、アルミニウム基材を押出加工、圧延加工、プレス加
工、切削加エタするさいに基材の表面に付着した加工油
などの汚染物質が大きく影響していると考えられる。そ
して、Willに上記のような欠陥が生じるのを防ぐた
めに1よ、アルミニウム基材の表面からの放出ガスを減
らすとと−もに薄膜形成前のアルミニウム基材表面の汚
染物質を除去しておくことが重要である。Such a thin film must have uniform texture and excellent adhesion to the substrate. However, in the manufacturing process of these products, various surface defects such as swelling, cracks, and pinholes may occur on the surface of the WIJ film during the formation of the vapor-deposited thin film, which poses a major problem in terms of product quality. Ta. This point will be explained in more detail below regarding the electrophotographic photoreceptor. In copying machines using electrophotographic technology, laser beam printers, etc., Se, Se-Te, Se-T is applied to the surface of the aluminum base material.
Se alloys such as e-As and 5e-As, semiconductors such as amorphous 81, amorphous metals, Zn 01C
dS, organic semiconductors, and other vapor-deposited substances are deposited using the PVD method or CV
Electrophotographic photoreceptors are manufactured by forming a photosensitive layer consisting of a thin film by vapor deposition using the D method, etc., but during the manufacturing process of this photoreceptor, swelling, cracks, and pins may occur on the surface of the photosensitive layer during formation of the photosensitive layer. There is a problem in that surface defects such as holes occur, which adversely affect electrophotographic images. The cause of such 1illI defects is that the aluminum base material is exposed to 200 to
Contaminants such as gas released from the surface of the base material when heated to 300℃ and processing oil that adheres to the surface of the base material when extruding, rolling, pressing, and cutting aluminum base materials are It is thought that this has a large influence. In order to prevent the above-mentioned defects from occurring in Will, first, reduce the gas released from the surface of the aluminum base material and remove contaminants on the surface of the aluminum base material before forming the thin film. This is very important.
この点につき本発明者らは実m研究を重ねた結果、薄膜
を形成する前のアルミニウム基材の表面の皮膜状態が大
きく影響するものと考えるに至った。As a result of extensive research on this point, the present inventors have come to believe that the state of the film on the surface of the aluminum base material before forming the thin film has a large effect.
アルミニウムは周知のように、非常に酸化され易い金属
であり、酸素と触れると表面に酸化膜が形成される。ま
たアルミニウムが水、湿気などの水分の存在する環境下
に置かれると、その表面に水和酸化膜が生成する。そし
て水和酸化物の生成反応の温度が高い程水和酸化膜の成
長は著しく、高温環境ではアルミニウム表面にベーマイ
ト(擬ベーマイト)またはバイアライトなどの水和酸化
膜が形成される。このような水和酸化膜の膜質は、水分
の存在しない環境で形成されるアルミニウム酸化膜に較
べて非常に相で多孔質状でありかつその孔形態も複雑に
いり込んでいる。加えて膜厚も厚い。 −ところで、通
常の押出加工により成形されたアルミニウム材の表面に
は、成形時水分を含んだ大気(酸素)との接触により水
和酸化膜が生成され、しかもこの水和酸化膜は、成形筒
高温にさらされるため、水和酸化膜の生成反応が促進さ
れて厚膜となっている。この水和酸化膜の膜質は上述の
とおり多孔賀状であり、がっ厚膜であるために皮膜に多
くの水分が吸着する。しかも皮膜かちみつさに欠けるた
めに、成形後においても大気中に存在する水分、ハイド
ロカーボン、二酸化炭素および一酸化炭素などのガスが
皮膜に吸着する。また、加工油等の汚染物質も前記同様
皮膜に吸着する。しかもこれらは水和酸化膜が上記のよ
うなものであるために、皮膜内にいわば吸蔵された形態
になる。その結果これらの脱離が困難な状態となり、真
空引きを行なってもなかなか除去できない。したがって
、これがアルミニウム基材の表面に形成する薄膜に欠陥
が生じる原因になっていると思われる。As is well known, aluminum is a metal that is very easily oxidized, and when it comes into contact with oxygen, an oxide film is formed on the surface. Furthermore, when aluminum is placed in an environment containing moisture such as water or moisture, a hydrated oxide film is formed on its surface. The higher the temperature of the hydrated oxide production reaction, the more remarkable the growth of the hydrated oxide film, and in high-temperature environments, a hydrated oxide film of boehmite (pseudo-boehmite) or vialite is formed on the aluminum surface. The film quality of such a hydrated oxide film is extremely phased and porous compared to an aluminum oxide film formed in an environment without moisture, and its pore morphology is also complicated. In addition, the film thickness is also thick. -By the way, a hydrated oxide film is generated on the surface of aluminum material formed by ordinary extrusion processing due to contact with the moisture-containing atmosphere (oxygen) during molding, and this hydrated oxide film is Exposure to high temperatures accelerates the formation reaction of a hydrated oxide film, resulting in a thick film. The film quality of this hydrated oxide film is porous as described above, and since it is a thick film, a large amount of water is adsorbed to the film. Furthermore, because the film lacks firmness, gases such as moisture, hydrocarbons, carbon dioxide, and carbon monoxide present in the atmosphere are adsorbed to the film even after molding. In addition, contaminants such as processing oil are also adsorbed to the film as described above. Moreover, since these hydrated oxide films are as described above, they are occluded in the film. As a result, it becomes difficult to remove these particles, and even if vacuuming is performed, they cannot be easily removed. Therefore, this seems to be the cause of defects in the thin film formed on the surface of the aluminum base material.
また、成形後のアルミニウム材の機械的強度を高めるた
めに、高温加熱後、水冷および空冷などの焼入れ処理や
、熱処理が行なわれるが、このさいにも成形時に形成さ
れた上述の水和酸化膜はさらに成長するとともにすでに
吸着されている薄膜表面に欠陥を生じさせる物質は皮膜
に内蔵される形となる。In addition, in order to increase the mechanical strength of the aluminum material after forming, quenching treatment such as water cooling and air cooling after high temperature heating, and heat treatment are performed. As the film grows further, substances that have already been adsorbed and which cause defects on the surface of the thin film become incorporated into the film.
また、圧延加工により成形されるアルミニウム基材の表
面には、汚染物質である圧延油が付着しているとともに
、圧延時および焼鈍時に多孔質状の水和酸化膜が生成し
ている。さらに、プレス加工により成形されるアルミニ
ウム基材にも汚染物質である加工油が付着しているとと
もに、水和酸化膜が生成している。Moreover, rolling oil, which is a contaminant, is attached to the surface of an aluminum base material formed by rolling, and a porous hydrated oxide film is formed during rolling and annealing. Furthermore, processing oil, which is a contaminant, is also attached to the aluminum base material formed by press working, and a hydrated oxide film is formed.
この発明は上記実情に鑑みてなされたものであって、上
記表面欠陥のない好適な薄膜を形成することのできる薄
膜形成用アルミニウム基材の表面処理方法を提供するこ
とにある。The present invention has been made in view of the above-mentioned circumstances, and it is an object of the present invention to provide a method for surface treatment of an aluminum base material for forming a thin film, which can form a suitable thin film free of the above-mentioned surface defects.
この発明による薄膜形成用アルミニウム基材の表面処理
方法は、アルミニウム基材の表面にドライエツチングを
施して清浄でかっ水和酸化膜が除去された乾燥面とした
後、このアルミニウム基材を水分を含んだ大気と接触し
ないような酸素含有ガス雰囲気中で加熱し、アルミニウ
ム基材の表面に酸化皮膜を形成することを特徴とするも
のである。The method of surface treatment of an aluminum base material for forming a thin film according to the present invention involves dry etching the surface of the aluminum base material to make it a clean, dry surface from which a hydrated oxide film has been removed, and then removing water from the aluminum base material. It is characterized by forming an oxide film on the surface of the aluminum base material by heating in an oxygen-containing gas atmosphere that does not come into contact with the atmosphere.
上記において、アルミニウム基材の代表例としては、電
子写真感光体の感光層を支持する基材があるが、その他
に太陽電池、ポリゴンミラー、半導体デバイスなどの蒸
着薄膜を支持する基材などがある。己れらは、押出成形
、圧延、プレス成形、切削加工などにより形成される。In the above, typical examples of aluminum base materials include base materials that support the photosensitive layer of electrophotographic photoreceptors, but there are also base materials that support vapor-deposited thin films such as solar cells, polygon mirrors, and semiconductor devices. . They are formed by extrusion molding, rolling, press molding, cutting, etc.
上記において、ドライエツチングの具体例としては、放
電洗浄、反応性ガスエツチング、プラズマエツチング、
反応性イオンエツチング、反応性イオンビーム・エツチ
ング、イオンビーム・エツチング、反応性レーザビーム
・エツチングなどをあげ・ることができる。ドライエツ
チングによりアルミニウム基材の表面を清浄でかつ水和
酸化膜が除去された乾燥面とする場合には、酸洗浄やア
ルカリ洗浄によって加工油を洗い流すとともに水和酸化
膜を除去する場合のように、・洗浄後の乾燥工程を必要
としない。In the above, specific examples of dry etching include discharge cleaning, reactive gas etching, plasma etching,
Examples include reactive ion etching, reactive ion beam etching, ion beam etching, and reactive laser beam etching. When using dry etching to make the surface of an aluminum base material clean and dry with the hydrated oxide film removed, it is necessary to wash away processing oil and remove the hydrated oxide film using acid or alkaline cleaning. ,・Does not require a drying process after washing.
上記において、アルミニウム基材の表面を清浄でかつ水
和酸化膜が除去された乾燥面とした後、このアルミニウ
ム基材を水分を含んだ大気と接触しないような酸素含有
ガス雰囲気中で加熱してその表面に酸化皮膜を形成する
方法としては、つぎの3つの方法をあげることができる
。In the above, after the surface of the aluminum base material is made into a clean and dry surface from which the hydrated oxide film has been removed, the aluminum base material is heated in an oxygen-containing gas atmosphere that does not come into contact with the moisture-containing atmosphere. The following three methods can be used to form an oxide film on the surface.
その1は、酸素0.5〜30vo1%とくに1〜10v
o/%を含み、残部不活性ガスまたはアルミニウムに対
して不活性なガスよりなる混合ガス雰囲気中で加熱する
方法である。不活性ガスとしては、アルゴンおよびヘリ
ウムが一般的である。アルミニウムに対して不活性なガ
スとしてはチッ素ガスが一般的である。Part 1 is oxygen 0.5-30vol 1%, especially 1-10v
This is a method of heating in a mixed gas atmosphere containing 0/% and the remainder consisting of an inert gas or a gas inert to aluminum. Argon and helium are common inert gases. Nitrogen gas is generally used as a gas inert to aluminum.
その2は、上記において、不活性ガス雰囲気中またはチ
ッ素ガス雰囲気中で加熱する方法である。市販の不活性
ガスおよびチッ素ガスまたは工業的に得られる不活性ガ
スおよびチッ素ガスには微量の酸素が含まれている。The second method is heating in an inert gas atmosphere or a nitrogen gas atmosphere. Commercially available inert gas and nitrogen gas or industrially obtained inert gas and nitrogen gas contain trace amounts of oxygen.
その3は、真空雰囲気中で加熱する方法である。真空雰
囲気中にも微量の酸素は含まれている。The third method is heating in a vacuum atmosphere. Even a vacuum atmosphere contains trace amounts of oxygen.
この3つの方法において、加熱温度を120〜500℃
とくに200〜300℃とし、加熱時間を0.1〜24
時間とくに0.5〜6時間とするのがよい。上記200
〜300℃の加熱処理は、熱処理用アルミニウム合金の
場合には時効処理を、非熱処理用アルミニウム合金の場
合には安定化処理を兼ねることができる。ちなみに、加
熱温度が120℃未満では酸化皮膜の形成がうまくいか
ず、500℃を越えると非結晶質皮膜の一部が結晶化し
て混在した状態となりちみつな皮膜が形成されなくなる
おそれがある。In these three methods, the heating temperature is 120 to 500℃.
In particular, the heating time should be 200-300℃ and 0.1-24℃.
The time is preferably 0.5 to 6 hours. 200 above
The heat treatment at ~300° C. can also serve as aging treatment in the case of an aluminum alloy for heat treatment, and can also serve as stabilization treatment in the case of an aluminum alloy for non-heat treatment. Incidentally, if the heating temperature is less than 120°C, the formation of the oxide film will not be successful, and if it exceeds 500°C, a part of the amorphous film will crystallize and become mixed, which may prevent the formation of a honeyed film.
上記3つのいずれの方法でも、アルミニウム基材の表面
が水分を含んだ大気と接触することが防がれるので、そ
の表面に水和酸化膜が生成することはない。そして、こ
れらの方法では活性なアルミニウム表面にらみって薄い
酸化膜が生成する。第1の方法では、酸化膜の厚さは2
0〜60人程度のものが得られ、第2の方法ではこれよ
りも膜厚は薄くなる。なお、第3の方法では、露点管理
が困難であるため、第1および第2の方法が好ましい。In any of the three methods described above, the surface of the aluminum base material is prevented from coming into contact with the atmosphere containing moisture, so that no hydrated oxide film is formed on the surface. In these methods, a thin oxide film is formed on the active aluminum surface. In the first method, the thickness of the oxide film is 2
A film with a thickness of about 0 to 60 can be obtained, and in the second method, the film thickness is thinner than this. Note that in the third method, it is difficult to control the dew point, so the first and second methods are preferable.
こうしてこの発明の方法によって表面処理が施されたア
ルミニウム基材の表面に、PVD法やCVD法などの常
法により薄膜が形成される。In this way, a thin film is formed on the surface of the aluminum base material which has been surface-treated by the method of the present invention by a conventional method such as a PVD method or a CVD method.
蒸着物質、すなわち薄膜を構成する物質は、電子写真用
感光体では3eまたは5e−T、elSe −Te −
As 、3e−AsなどのSe合金、アモルファス81
などの半導体、アモルファス金属、Zn O,Cd S
、有機系半導体などであり、太陽電池ではアモルファス
Si1ポリゴンミラーではA/、5iChなどである。The vapor deposited substance, that is, the substance constituting the thin film, is 3e or 5e-T, elSe -Te - for electrophotographic photoreceptors.
Se alloys such as As, 3e-As, amorphous 81
Semiconductors such as amorphous metals, ZnO, CdS
, organic semiconductors, etc., and for solar cells, A/, 5iCh, etc. for amorphous Si1 polygon mirrors.
この発明による薄膜形成用アルミニウム基材の表面処理
方法は、アルミニウム基材の表面にドライエツチングを
施して清浄でかつ水和酸化膜が除去された乾燥面とした
後、このアルミニウム基材を水分を含んだ大気と接触し
ないような酸素含有ガス雰囲気中で加熱し、アルミニウ
ム基材の表面に酸化皮膜を形成するものであるから、ア
ルミニウム基材表面に問題のある水和峡
酸化やが生成せず、代わりにちみつな酸化皮膜が形成せ
られているため、水和酸化膜に較べてガスや汚染物質の
吸着、吸蔵は著しく少なく、かつ吸着、吸蔵されていて
も脱ガス処理により簡単にこれを除去することができる
。したがって、汚染物質の聞が少なくなり、しかも真空
中での蒸着のさいに表面に放出されるガス量が非常に少
なくなり、形成される薄膜に欠陥が生じるのを防ぐこと
ができるし、従来のように表面欠陥が生じるのを防ぐた
めの面倒な作業を省略ないし軽減することができる。ま
た、アルミニウム基材の表面にはちみつな酸化皮膜が形
成されているため、その後の工程で大気と接触したとし
ても、薄膜の表面に欠陥を生じさせる物質の吸着を防止
するとともに、水和酸化膜の生成を抑制することができ
る。The method of surface treatment of an aluminum base material for forming a thin film according to the present invention is to perform dry etching on the surface of the aluminum base material to make it a clean and dry surface from which a hydrated oxide film has been removed, and then remove moisture from the aluminum base material. Since it is heated in an oxygen-containing gas atmosphere that does not come into contact with the atmosphere containing oxygen and forms an oxide film on the surface of the aluminum base material, problematic hydration oxidation does not occur on the surface of the aluminum base material. Instead, a honey oxide film is formed, so gases and pollutants are absorbed and occluded significantly less than a hydrated oxide film, and even if they are adsorbed or occluded, they can be easily removed by degassing. Can be removed. Therefore, the amount of contaminants is reduced, and the amount of gas released to the surface during vacuum deposition is also very small, which prevents defects in the formed thin film and prevents the formation of defects compared to conventional methods. Thus, the troublesome work to prevent surface defects from occurring can be omitted or reduced. In addition, since a honey oxide film is formed on the surface of the aluminum base material, even if it comes into contact with the atmosphere in subsequent processes, it prevents the adsorption of substances that would cause defects on the surface of the thin film, and the hydrated oxide film The generation of can be suppressed.
つぎに、この発明の実施例について説明する。Next, embodiments of the invention will be described.
A3003合金の溶湯を鋳造した後、これを外径90I
llI111肉厚8IIllIlのパイプ状に押出した
。After casting the molten metal of A3003 alloy, the outer diameter of the molten metal is 90I.
It was extruded into a pipe shape with a wall thickness of 8IIllIl.
得られた押出品に引抜き加工および表面切削加工を施し
て、外径8Qmm、肉厚5IllI111長さ300I
III11のドラム状のアルミニウム]Jを得た。この
ドラム状基材にアルゴンガスを用いた放電洗浄(グロー
放電)を施して、基材の表面を清浄でかつ水和酸化膜が
除去された乾燥面とした。The obtained extruded product was subjected to drawing processing and surface cutting to obtain an outer diameter of 8Qmm, a wall thickness of 5IllI111, and a length of 300I.
A drum-shaped aluminum]J of III11 was obtained. This drum-shaped base material was subjected to discharge cleaning (glow discharge) using argon gas to make the surface of the base material a clean and dry surface from which the hydrated oxide film was removed.
その後、酸素20vO1%、残部アルゴンからなる混合
ガス雰囲気中で、270℃で4時間加熱した。Thereafter, it was heated at 270° C. for 4 hours in a mixed gas atmosphere consisting of 20 vO 1% oxygen and the balance argon.
このドラム状基材の表面には厚さ約40人のちみつな酸
化膜が形成されていた。A honey oxide film with a thickness of approximately 40 mm was formed on the surface of this drum-shaped base material.
ついで、ドラム状アルミニウム基材の表面に、Se合金
を真空蒸着して薄膜、すなわち感光層を形成した。得ら
れた電子写真′用感光体の感光層表面を光学顕微鏡およ
びSEMで観察したところ、脹れ、割れ、ピンホールな
どの表面欠陥は全く認められず、平坦で極めて良好な感
光層が形成されていることがM1認された。Next, a Se alloy was vacuum deposited on the surface of the drum-shaped aluminum base material to form a thin film, that is, a photosensitive layer. When the surface of the photosensitive layer of the obtained photoreceptor for electrophotography was observed using an optical microscope and SEM, no surface defects such as swelling, cracks, or pinholes were observed, and a flat and extremely good photosensitive layer was formed. It was confirmed that M1
以 上 外4名that's all 4 other people
Claims (1)
浄でかつ水和酸化膜が除去された乾燥面とした後、この
アルミニウム基材を水分を含んだ大気と接触しないよう
な酸素含有ガス雰囲気中で加熱し、アルミニウム基材の
表面に酸化皮膜を形成することを特徴とする薄膜形成用
アルミニウム基材の表面処理方法。After performing dry etching on the surface of the aluminum base material to make it a clean and dry surface from which the hydrated oxide film has been removed, the aluminum base material is heated in an oxygen-containing gas atmosphere that does not come into contact with the moisture-containing atmosphere. A method for surface treatment of an aluminum base material for forming a thin film, the method comprising: forming an oxide film on the surface of the aluminum base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2783984A JPS60174863A (en) | 1984-02-15 | 1984-02-15 | Surface treatment of aluminum substrate for forming thin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2783984A JPS60174863A (en) | 1984-02-15 | 1984-02-15 | Surface treatment of aluminum substrate for forming thin film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60174863A true JPS60174863A (en) | 1985-09-09 |
JPH0461068B2 JPH0461068B2 (en) | 1992-09-29 |
Family
ID=12232093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2783984A Granted JPS60174863A (en) | 1984-02-15 | 1984-02-15 | Surface treatment of aluminum substrate for forming thin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60174863A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283953U (en) * | 1985-11-12 | 1987-05-28 | ||
JPS63301051A (en) * | 1987-06-01 | 1988-12-08 | Fujitsu Ltd | Manufacture of photosensitive body |
JPS6479755A (en) * | 1987-09-21 | 1989-03-24 | Furukawa Aluminium | Drum of photosensitive body for laser beam printer and manufacture of same |
JPH02275467A (en) * | 1989-04-17 | 1990-11-09 | Fuji Electric Co Ltd | Manufacturing method of electrophotographic photoreceptor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56278A (en) * | 1979-06-13 | 1981-01-06 | Matsushita Electronics Corp | Method and apparatus for plasma ethcing of aluminum |
JPS57147644A (en) * | 1981-03-10 | 1982-09-11 | Ricoh Co Ltd | Photoreceptor for electrophotography |
JPS57161067A (en) * | 1981-03-27 | 1982-10-04 | Mitsubishi Electric Corp | Dry etching method for aluminum film |
JPS5811944A (en) * | 1981-07-16 | 1983-01-22 | Ricoh Co Ltd | Production of photosensitive element for electrophotography |
JPS5815239A (en) * | 1981-07-21 | 1983-01-28 | Ricoh Co Ltd | Semiconductor element |
JPS5860747A (en) * | 1981-10-07 | 1983-04-11 | Oki Electric Ind Co Ltd | Electrophotographic receptor |
-
1984
- 1984-02-15 JP JP2783984A patent/JPS60174863A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56278A (en) * | 1979-06-13 | 1981-01-06 | Matsushita Electronics Corp | Method and apparatus for plasma ethcing of aluminum |
JPS57147644A (en) * | 1981-03-10 | 1982-09-11 | Ricoh Co Ltd | Photoreceptor for electrophotography |
JPS57161067A (en) * | 1981-03-27 | 1982-10-04 | Mitsubishi Electric Corp | Dry etching method for aluminum film |
JPS5811944A (en) * | 1981-07-16 | 1983-01-22 | Ricoh Co Ltd | Production of photosensitive element for electrophotography |
JPS5815239A (en) * | 1981-07-21 | 1983-01-28 | Ricoh Co Ltd | Semiconductor element |
JPS5860747A (en) * | 1981-10-07 | 1983-04-11 | Oki Electric Ind Co Ltd | Electrophotographic receptor |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6283953U (en) * | 1985-11-12 | 1987-05-28 | ||
JPS63301051A (en) * | 1987-06-01 | 1988-12-08 | Fujitsu Ltd | Manufacture of photosensitive body |
JPS6479755A (en) * | 1987-09-21 | 1989-03-24 | Furukawa Aluminium | Drum of photosensitive body for laser beam printer and manufacture of same |
JPH02275467A (en) * | 1989-04-17 | 1990-11-09 | Fuji Electric Co Ltd | Manufacturing method of electrophotographic photoreceptor |
Also Published As
Publication number | Publication date |
---|---|
JPH0461068B2 (en) | 1992-09-29 |
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