JPS60164884A - Method for producing in card - Google Patents

Abstract

PURPOSE:To form a regular electrode on a card surface and to facilitate its production by providing an over sheet layer on both faces of a card substrate mounted with an IC module, forming it into a solid construction, providing a groove along the peripheral side of the module electrode and peeling the over sheet. CONSTITUTION:Similar bone white sheets 31 and 32 are provided in the laminated from on obverse and reverse sides of a bone white sheet 30 by a thermoplastic sheet to form a card base material. A required place on this base material is printed 33 with a required pattern and is drilled a hole 38 to mount an IC module 10, and the module 10 is inserted into the hole 38. On the obverse and reverse sides of the base material, thermoplastic transparent over sheets 34 and 35 are provided in the laminated form to form a card into a solid construction by thermofusion. A groove 41 along the outer peripheral line of the module 10 which is formed into a solid construction with the card is engraved by an engraving machine 40. An over sheet 34A of the part of the groove 41 is peeled to expose and electrode pattern 2 for connection and form a regular electrode with generating any crack.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an IC card with an IC chip mounted or built therein.

A chip card equipped with or built-in an IC chip such as a microcomputer or memory.

Research is being carried out on cards called memory cards, microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards). Because these IC cards have a greater memory capacity than conventional magnetic stripe cards, financial institutions are considering using them to store the history of deposits and savings in place of passbooks, and in the case of credit cards, to store the history of transactions such as shopping. There is. Such an IC card necessarily has connection electrodes for electrically and mechanically connecting the IC circuit and an external data processing device. Two methods are being considered: one method is to provide the card, and the other method is to provide it on the end face of the card. However, in the latter method, it is necessary to form a circuit pattern inside the card base material.
[How to install connection terminals in cards] Therefore, it is desirable to provide an electrode cloth for connection on the card surface.

In this way, even in an IC card in which connection terminals are provided on the card surface, the IC chip is completely buried in the card base material, the IC chip is completely surrounded by the card base material, and the IC chip is completely buried inside the card base. A card is being considered in which an electrode for connection with the outside and an IC chip are connected by forming a conductive pattern to take out the electrode. However, the reliability of the IC chip and the connection between the IC chip and the circuit pattern decreases due to the heat and pressure of the integral molding with the card base material, and the delamination strength of the card decreases when integral molding is not performed. This method is undesirable for the manufacture or structure of IC cards because of problems such as warping or warping of the card.

As a solution to the drawbacks of the conventional IC card manufacturing method, for example, an IC card such as JP-A-511-925
There are modules, IC cards, and manufacturing methods thereof. The IC module shown here has a structure as shown in Figures 1 and 2, and is printed with a 35g copper foil laminated to a glass epoxy film substrate approximately 0.1mm thick. A wiring film is etched to obtain a desired pattern, and then nickel and gold plating is performed to form electrode patterns 2 and circuit patterns 3 for connection with the outside, and then punched to a desired size.

The connection electrode pattern 2 and the circuit pattern 3 are electrically connected through through holes 4 at necessary locations. Then, the IC chip 5 is bonded to a predetermined position on the circuit pattern 3, and the electrodes 6 of the IC chip 5 and the circuit pattern 3 are connected by the conductor 7 by a lead bonding method, a wire bonding method, or the like. After making the necessary connections between the IC chip 5 and the circuit pattern 3, the potting frame 8 made of a glass epoxy board and hard polyvinyl chloride is used for the first flow when potting the epoxy resin, for example, using an epoxy or acrylic material. It is attached to a glass epoxy film substrate 1 with an adhesive or the like, and an epoxy resin 9 is poured in and molded.

Using the IC module IO obtained in this way, I
When manufacturing C cards, Japanese Patent Application Laid-Open No. 58-112597,
In the method shown in the above publication, the IC module embedding part of the card base is formed into four parts by counterboring with an engraving machine, and the IC module is fixed with adhesive.

The size of the four parts, the depth and the size of the IC module.

Due to the mutual variation in thickness, there was no sense of unity between the IC module and the card base material, and the IC module tended to separate easily. In addition, as in Japanese Patent Application Laid-open No. 1SE-S3EO57, a plurality of layers of cartons forming a cartons (material sheets are laminated before laminating the IC module installation area) so that the electrode surface of the IC module and the card surface are on the same surface. A punched hole with approximately the same dimensions as the IC module is provided in the I
We have proposed an integration method using heat-pressure lamination after temporarily installing the C module, but with this method, the electrode surface of the IC module comes into direct contact with the metal plate for lamination during lamination, so it is easy to get scratches during manufacturing. Also, IC
The module was fixed with adhesive, which caused problems in terms of reliability and aesthetics of the IC card.

Further, when the IC card is bent, peeling occurs between the IC module and the card substrate, causing problems in terms of aesthetics and shape of the card. Therefore, an object of the present invention is to provide a manufacturing method that solves the problems of conventional IC cards as described above.

This invention will be explained below.

This invention relates to a method for manufacturing an IC card, in which a hole is drilled in the upper surface of a center core made of a single layer or multiple layers of bone white sheets, an external connection terminal is provided on the upper surface, and an adhesive sheet is provided on the lower surface. 1. As explained in attached FIGS. 1 and 2. The G module is installed, and a single layer and multiple layers of thermoplastic transparent oversheets are placed on the top and bottom surfaces of the sheet member on which the module is installed, and the sheets are sandwiched between metal mirror plates and heated and pressurized. After that, a transparent oversheet is engraved along the outer periphery of the IC module, and the transparent oversheet is peeled off in the engraved area to expose external connection terminals.

Next, to explain the present invention in JL format with reference to the drawings, as shown in FIG. A bone white sheet 30 and a similar plastic bone white sheet I having a thickness of about 0.1 mm are layered on the front and back sides of this bone white sheet 30.
・A card base material is formed with 31 and 32, and a necessary pattern is printed 33 at a required location on this card base material.

Then, as shown in FIG. 7(B), holes 38 for mounting the above-mentioned IC module IO are made in the required locations of the card base material using an engraving machine, an end mill, etc., or
．． 5ms + bone white sheet 30 and 0.1m intestinal white sheet 3
1 is punched or the like, and as shown in FIG. 1) Insert the IC module 10 Next, on the front and back sides of the card board on which this IC module 10 is installed,
As shown in Fig. 7 CD), thermoplastic transparent oversheets 34 and 35 of about 0.1 mm J'7 are layered and sandwiched between metal mirror plates at a temperature of +4Q to 150°C and a pressure of 25 kg/
C112, heated and pressurized for 20 minutes to integrate by heat fusion. That is, the PVC sheets are completely adhered to each other even without an adhesive, and the bottom surface of the IC module IO and the PVC sheet are completely adhered to each other with an epoxy adhesive (not shown).

Thereby, the IC module 10 is completely integrated with the card base material. In the case of a card with a magnetic stripe, the magnetic stripe 38 is attached to the transparent oversheet 3 in advance.
Fig. 7 (D) shows a state in which the material was processed by heat transfer, lamination, coating soil 1, etc., and embedded in the transparent oversea I-34 by the above-mentioned heat-pressing processing. After this, it is punched out according to the size of the IC card using a die cutting method or the like.

After that, as shown in FIG. 7(E), the position of the IC module 10 is aligned with the cut IC card from the card reference position, and the engraving machine 40 engraves it on the oversheet 34. A groove 41 is provided on the periphery. In addition, the appropriate groove width is 0.5 to 1.0 m+w,
The depth should be 0.1 intestine or 1 in. Therefore, the oversheet 34 is engraved along the outer periphery of the IC module IO, and grooves 41 and 42 shown in FIG. 7(F) are bored. In this state, by peeling off the oversheet 34A surrounded by the grooves 41 and 42 with a nail, metal fitting, etc., the oversheet 34A layered on the top surface of the IC module 1O is completely peeled off, and as shown in FIG. ) has the structure. 1C module IO is a connection electrode; The surface of the IC module 10, that is, the electrode pattern, becomes the surface of the card, and it is possible to make a card without damaging the electrodes when applying heat and pressure. I can do it.

Also, sculpture 1. '! In the drilling work along the outer periphery of the IC module 10 by 40, if the bone white sheet at and the IC module 10 are also drilled deeper than the oversheet 34, as shown in FIG. 8(A). , I.C.
The periphery of the module IO will also be engraved by the engraving machine 40. With such a structure, even when the IC card is bent, cracks are less likely to occur between the IC module 10 and the card board, and the integrity is solid and the appearance is excellent.

As described above, according to the manufacturing method of the present invention, after an IC module is attached to a card base material, an oversheet is layered on the front and back sides, and then the cards are integrated by heat fusion, and then the electrodes of the IC module are By engraving a groove along the outer circumferential surface of the card and peeling off the surrounding oversheet, regular electrodes can be formed on the card surface. is easy. That is, if a hole is made in the overseat before hot-pressing processing and then hot-pressing processing is performed, the thermoplastic sheet will deform and become shaped to close the hole.

In addition, in the above, a five-layer card base material was explained, but
It is also possible to have an arbitrary number of layered structures, such as three layers. IC
The module may be not only circular but also square, and the electrode pattern may be arbitrary.

[Brief explanation of drawings]

Fig. 1 is an external view showing an example of an IC module to which the present invention can be applied, Fig. 2 is a cross-sectional structural view thereof, and Figs. 3 and 4 are diagrams for explaining a conventional IC card manufacturing method. 5 is a plan view of the IC card, FIG. 6 is a cross-sectional structural diagram of ^-°^ of FIG. 5, and FIGS. 7(A) to ([3) are for explaining the manufacturing method of this invention. , and FIGS. 8(A) and 8(B) are diagrams for explaining another manufacturing method of the present invention. 1... Board, 2... Electrode pattern, 3... Circuit pattern! 0...IC module, 30-32...
Bone white sheet, 34.35...over sheet, 38.
...hole, 40...carving 1 Applicant's agent Yuzo Yasugata 2 JP-A-1-1 (li4884 (6) Tsuri 7 Inbo 6 Figure 6. Contents of amendment Procedure before amendment 1982 3711311, Invention Name of the IC card V Hiroshi Method 3, Person making the amendment Relationship with the case 4'F word Applicant Shinjuku 1, Tokyo 1'1 Chome Kaga-cho - Chome 112 (2
89) Dai 11 Printing Co., Ltd. 4, Agent 5, amend the scope of the patent claims to be amended as follows. ``Claims: External connection terminals are provided on the top surface of holes drilled in the top surface of the center core made of a TG layer or a plurality of layers of thermoplastic plastic bone white sheets. -1 of the sheet member with the module installed
- Layer a single layer or multiple layers of thermoplastic transparent oversheets from the bottom surface, sandwich them between metal mirror plates and heat and press them to integrate, and then apply the transparent oversheets along the outer periphery of the IC module. A method for manufacturing an IC card, comprising engraving a sheet and peeling off the transparent oversheet in the engraved area to expose the external connection terminals. ”

Claims (1)

[Claims] An IC module with external connection terminals provided on the top surface and an adhesive sheet affixed on the bottom surface is inserted into a hole drilled in the surface of a center core made of a single-layer or multi-layer thermoplastic plastic sheet. Then, a middle layer or multiple layers of transparent oversheets of thermoplastic plastic are layered from the lower surfaces of the sheet member on which the IC module is attached, and the sheets are sandwiched between metal mirror plates and heated to be integrated. The transparent IJI oversheet is then engraved along the outer periphery of the IC module, and the transparent oversheet is peeled off in the engraved area to expose the external connection terminals. IC card manufacturing method.