JPS60163755U - Cooling equipment for semiconductors, etc. - Google Patents
Cooling equipment for semiconductors, etc.Info
- Publication number
- JPS60163755U JPS60163755U JP4968384U JP4968384U JPS60163755U JP S60163755 U JPS60163755 U JP S60163755U JP 4968384 U JP4968384 U JP 4968384U JP 4968384 U JP4968384 U JP 4968384U JP S60163755 U JPS60163755 U JP S60163755U
- Authority
- JP
- Japan
- Prior art keywords
- air passage
- passage cover
- fan unit
- cooling
- slide guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例の側断面図、第2図は本考案の一実施例
の構成図でaは側断面図、bはaのA −A′&!に沿
う正断面図、第3図は本考案の効果を表わす各部の温度
上昇特性図、第4図は本考案の他の実施例の構成図でa
は全体の側断面図、bは通風窓等の斜視図、Cは封止板
等の斜視図、dはファンユニット等の斜視図、第5図は
本考案の別の実施例の構成図でaは通風窓等の斜視図、
bはファンユニットを装着したときの斜視図、Cはファ
ンユニットを通風カバーに螺着したときの斜視図、dは
その螺着要部の側断面図である。
1・・・平形フィン、2・・・風路カバー、3・・・通
風路、4・・・フィン、5・・・冷却風、6・・・半導
体、7・・・発熱量の多い半導体、8・・・ファンユニ
ット、9・・・風向板、10・・・通風窓1.11・・
・ファン(フアシス ゛ニット用)、12・・・取付板
、13・・・冷却風、14・・・封止板、15・・・ス
ライド爪、16・・・スライドガイド、17・・・突起
、18・・・螺子。Fig. 1 is a side sectional view of a conventional example, and Fig. 2 is a configuration diagram of an embodiment of the present invention, where a is a side sectional view and b is A-A'&! of a. 3 is a temperature rise characteristic diagram of each part showing the effect of the present invention, and FIG. 4 is a configuration diagram of another embodiment of the present invention.
is a side sectional view of the whole, b is a perspective view of a ventilation window, etc., C is a perspective view of a sealing plate, etc., d is a perspective view of a fan unit, etc., and FIG. 5 is a configuration diagram of another embodiment of the present invention. a is a perspective view of ventilation windows, etc.;
b is a perspective view when the fan unit is installed, C is a perspective view when the fan unit is screwed onto the ventilation cover, and d is a side sectional view of the main part of the screwed part. 1... Flat fin, 2... Air duct cover, 3... Ventilation duct, 4... Fin, 5... Cooling air, 6... Semiconductor, 7... Semiconductor with a large amount of heat generation , 8... Fan unit, 9... Wind direction plate, 10... Ventilation window 1.11...
・Fan (for fasis knit), 12...Mounting plate, 13...Cooling air, 14...Sealing plate, 15...Slide claw, 16...Slide guide, 17...Protrusion , 18...Screw.
Claims (1)
ィンとそれを覆う風路カバーとで形成した通風路の一端
にファンを設は他端を開放し、ファンの駆動により冷却
風をフィンに平行に通風させる冷却装置において1 、 フィン基板と対向する風路カバーの一面に取付窓を
あけが風向板をそなえたファンユニットを設けたことを
特徴とする半導体等の冷却装置。 2 ファンユニットを装着する風路カバーの一つあるい
は複数個の取付窓にスライドガイドをそなえ、ファンユ
ニットにスライドガイドと係合するスライド爪を設けた
実用新案登録請求の範囲第1項記載の半導体等の冷却装
置。 3 スライドガイドにスライド爪が摺動停止する定位置
の風路カバー通風窓の一辺に突起をそなえた実用新案登
録請求の範囲第2項記載の半導体等の冷却装置。
−[Claims for Utility Model Registration] 1. A fan is installed at one end of an air passage formed by a flat fin in which a plurality of fins are screened on a fin board and an air passage cover that covers it, and the other end is left open. 1. A cooling device for blowing cooling air parallel to the fins by driving the semiconductor device, etc., characterized in that: (1) a fan unit is provided with a mounting window and a wind direction plate on one side of the air passage cover facing the fin board; cooling system. 2. The semiconductor according to claim 1 of the utility model registration claim, in which a slide guide is provided in one or more mounting windows of an air passage cover to which a fan unit is attached, and a slide claw that engages with the slide guide is provided in the fan unit. etc. cooling equipment. 3. A cooling device for semiconductors, etc., as set forth in claim 2, wherein a projection is provided on one side of an air passage cover ventilation window in a fixed position where a slide claw slides and stops on a slide guide.
−
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4968384U JPS60163755U (en) | 1984-04-06 | 1984-04-06 | Cooling equipment for semiconductors, etc. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4968384U JPS60163755U (en) | 1984-04-06 | 1984-04-06 | Cooling equipment for semiconductors, etc. |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60163755U true JPS60163755U (en) | 1985-10-30 |
Family
ID=30567103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4968384U Pending JPS60163755U (en) | 1984-04-06 | 1984-04-06 | Cooling equipment for semiconductors, etc. |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60163755U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
JP2018022868A (en) * | 2016-07-26 | 2018-02-08 | 三菱電機株式会社 | Electronic apparatus cooler |
-
1984
- 1984-04-06 JP JP4968384U patent/JPS60163755U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162497A (en) * | 1990-10-24 | 1992-06-05 | Hitachi Ltd | Cooling device for electronic apparatus |
JP2018022868A (en) * | 2016-07-26 | 2018-02-08 | 三菱電機株式会社 | Electronic apparatus cooler |
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