JPS60160193A - Automatically soldering device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic soldering device for printed circuit boards.

As a conventional soldering device, the one shown in Figure 1 is To')
Ta.

In the figure, 1 is a solder tank, 2 is a solder liquid level in a molten state in the solder tank 1, 4 is a float floating in the solder tank 1 and moves up and down with the solder liquid level 2, and 5 is the solder liquid level in the solder tank 1. a sensor that detects the solder liquid level by flow) 4, 3
is an automatic solder supply device operated by the sensor 5;

A solder ingot 6 is supplied into the solder gi by the solder supply device 3.

Next, the operation will be explained.

When electronic components mounted on a printed circuit board or the like are soldered, the level of the solder liquid level 2 in the solder tank 1 decreases, and the level of the solder liquid level 2 in the fleet 4 also decreases in the same way. The downward movement of the float 4 turns on the seventh pin f-5, and the automatic soldering device 3 is operated by the processor 5 to lower the solder ingot 6. As a result, solder is supplied and the solder liquid level 20 rises.

When the level of solder liquid level 2 rises, sensor 5 turns OFF.
L, automatic solder supply device 3 stops.

As a result, the solder ingot 6 rises, and the supply of solder in the solder tank 1 is stopped.

Since the conventional automatic soldering device is configured as described above, it is possible to detect a drop in the solder liquid level, but it is dangerous to be able to detect if an excessive amount of solder is accidentally supplied.

In addition, liquid level control based on the amount of solder supplied has poor accuracy, and has the disadvantage that solder non-adhesion on the surface of the printed circuit board putter 7 and solder overflow on the surface of the board components are likely to occur.

The present invention has been made to solve the above-mentioned drawbacks.
The purpose of the present invention is to provide an automatic soldering device that can accurately and quickly control the solder immersion depth of a printed circuit board by raising and lowering a solder tank in addition to an automatic solder supply device.

, an embodiment of the present invention will be described based on FIG.

In FIG. 2, 1 is a solder tank, 2 is a solder liquid level in a molten state in the solder tank 1, 3 is an automatic solder supply device that supplies solder to the solder tank I, and 3 is an automatic solder supply device that supplies solder to the solder tank I. The automatic solder supply device 3 is fixed to a base 15. The base 15 is supported by a ball screw 16 passed through a nut 18, and moves up and down in accordance with the rotation of the pole screw 160.

Reference numeral 7 denotes a transmission means such as a chain or a timing belt that connects the plurality of ball screws 16 so that they rotate in the same direction and by the same amount. 8 is a stepping motor that generates a driving force for rotating the ball screw 16, and 9 is a controller for the stepping motor 80. Further, 14 is a brake of the ball screw 16, which allows the base 15 to be stopped at a desired position.

10 is an upper limit loop for detecting the upper limit of the solder liquid level 2; 11
12 is a lower limit probe that detects the lower limit of the solder liquid level 2, 12 is an upper limit sensor that detects the upper limit of the base 15, and 13 is a base 1
It is assumed that the lower limit probe 10 and the lower limit probe 11 for detecting the lower limit of the solder liquid level 2 can independently and simultaneously adjust the upper and lower flit1.

Next, the operation of the present invention will be explained.

First, set the lower ends of the upper and lower limit probes 1O211 for the solder liquid level 2 to the solder liquid level management level O range, and
k such that it exists between both probes 10.11.

When the solder liquid level 20 level decreases in this state 11K, the lower end of the solder liquid level lower limit loop 114D separates from the solder liquid level 2, and the electrical groove connected to the ground through the solder is turned off. In the O range until the base upper limit sensor 12 detects,
The controller 9 of the motor 8 receives the signal 0FFt) (No. 11 of the lower limit probe 11) and rotates the stepping motor 8 in the direction of raising the base 15. The ball screw 16 rotates due to the 80 rotations of the stepping motor. The solder tank 1 continues to rise, but the solder liquid level upper limit probe 10
When the lower end of the solder tank l (base 15
) is stopped and the brake 14 is applied.

As the solder liquid level 2 decreases, such operations are repeated until the base upper limit sensor 9j''12 detects it, and the height of the solder liquid level 2 from the ground is kept substantially constant.

When the base 12 detects the base 15, the base 15 descends until it is detected by the pace lower limit sensor 13, and upon receiving the signal from the descending sensor 13, the upper limit of the solder liquid level in the automatic solder supply device 3Y is detected. The solder liquid level 2 is raised by supplying solder with bt, which is detected by the probe 10.

At this time, if solder is over-supplied, the solder level upper limit probe 10 will continue to operate on the base 15 until the lower end of the solder level upper limit probe 10 separates from the solder level 2.
descends. As a result, the state becomes the same as the initial setting state, and the above-described operation is repeated.

In order to prevent over-supply of solder, preferably when the solder is supplied to the automatic solder supply device 3, the solder liquid level 2 is raised until it is detected by the lower limit probe 11, and then the solder liquid level upper limit probe 11 is detected. The base 15 may be raised until the lower end of the base 10 comes into contact with the solder liquid level 2.

As described above, according to the present invention, the level of the solder liquid from the ground is kept constant by vertical movement of the solder bath itself, so the level of the solder level can be accurately managed, and the printed circuit board Solder non-adhesion on the pattern surface and solder overflow on the board component surface no longer occur. Furthermore, the variation range of the solder liquid level 2 and the solder liquid level can be changed easily and in a short time by changing the settings between the two probes.

Furthermore, even if solder is oversupplied, the base descends, thereby making it possible to maintain a constant solder liquid level.

In the above embodiment, a stationary type solder tank is used, but a jet type or overflow type solder tank is used.

It can also be applied to other hot type soldering baths such as wave type.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a conventional automatic soldering device, and FIG. 2 is a diagram showing an embodiment of the present invention. 1...Solder tank 2...Solder liquid level 8...Stepping motor 9...Control unit 10...Solder liquid level upper limit probe 11...Solder liquid level lower limit probe 12...Base upper limit sensor 13...Base lower limit cent 15...Base patent applicant Figure 2

Claims (1)

[Claims] a detection means for detecting the liquid level of the solder bath; a driving means for moving the solder bath up and down in order to keep the solder liquid level substantially constant by the detection means; An automatic soldering device characterized in that it is intertwined with a solder supply means that supplies solder when the solder is applied.