JPS60157231A - Wafer loader - Google Patents
Wafer loaderInfo
- Publication number
- JPS60157231A JPS60157231A JP59011044A JP1104484A JPS60157231A JP S60157231 A JPS60157231 A JP S60157231A JP 59011044 A JP59011044 A JP 59011044A JP 1104484 A JP1104484 A JP 1104484A JP S60157231 A JPS60157231 A JP S60157231A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- vacuum
- arrow
- sheet
- urethane sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 abstract description 62
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 18
- 230000006835 compression Effects 0.000 abstract description 5
- 238000007906 compression Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000005187 foaming Methods 0.000 abstract 3
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 210000000080 chela (arthropods) Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、ウェーハを研磨装置の保持部に装着するだめ
のウェーハローダに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wafer loader for loading a wafer into a holder of a polishing apparatus.
一般に１例えば単結晶シリコンなどのウェーハを研磨加
工する場合のウェーハ保持方法として、ウェーハをワッ
クスなどを介して保持部に接着する方法と、ワックスを
用いずウェーハを保持部に密着させる方法とがある。後
者の方法における保持部は、保持基板に発泡ウレタンシ
ートを貼着し。Generally, there are two methods for holding a wafer when polishing a wafer such as single crystal silicon: one is to adhere the wafer to the holder via wax, and the other is to adhere the wafer to the holder without using wax. . In the latter method, the holding part is made by pasting a foamed urethane sheet on the holding substrate.
この発泡ウレタンシート上にウェーハが加工中飛散する
のを防止するためのキャリヤが固着されている。このキ
ャリヤには、ウェーハを保持するだめの丸穴が穿設され
ている。しかして、ウェーハは、発泡ウレタンシートに
水を介して押圧されることにより密着固定される。A carrier is fixed onto this foamed urethane sheet to prevent the wafer from scattering during processing. The carrier is provided with a round hole for holding the wafer. Thus, the wafer is tightly fixed by being pressed against the foamed urethane sheet through water.
しかるに、上記のような発泡ウレタンシートにウェーハ
を押圧することによりウェーハを保持させる方法を単純
に機械化した場合、ウェーハ表面を傷付けてしまう虞が
あった。However, if the method of holding the wafer by pressing the wafer against the urethane foam sheet as described above is simply mechanized, there is a risk that the surface of the wafer may be damaged.
本発明は、上記事情を参酌してなされたもので。 The present invention has been made in consideration of the above circumstances.
ウェーハ表面を傷つけることなくウェーハ研磨装置の保
持部に接着するウェーハローダを提供するととを目的と
する。An object of the present invention is to provide a wafer loader that can be bonded to a holding part of a wafer polishing apparatus without damaging the wafer surface.
ウェーハを真空吸着部により着脱自在に保持するととも
に、この真空吸着部により吸着され位置決め機構により
例えば発泡ウレタンシート上、に整載されたウェーハに
圧縮空気を噴射して押圧することにより、ウェーハを上
記発泡ウレタンシートに接着するようにしたものである
。The wafer is removably held by a vacuum suction unit, and compressed air is injected and pressed against the wafer, which is suctioned by the vacuum suction unit and placed on, for example, a foamed urethane sheet by a positioning mechanism. It is designed to be adhered to a foamed urethane sheet.
以下１本発明の一実施例を図面を参照して詳述する。 An embodiment of the present invention will be described below in detail with reference to the drawings.
第１図は、本実施例のウェーッ・ローダの斜視図であっ
て、このウェーハローダは１位置決め機構（１）と、こ
の位置決め機構（１）に取着されたウェーハ着脱機構（
２）と、図示せぬ真空源と、同じく図示せぬ圧縮空気源
とからなっている。上記位置決め機構（１）は、回転軸
（３）と、この回転軸（３）を矢印（４ａ）。FIG. 1 is a perspective view of the wafer loader of this embodiment, and this wafer loader includes a positioning mechanism (1) and a wafer attachment/detachment mechanism (
2), a vacuum source (not shown), and a compressed air source (also not shown). The positioning mechanism (1) has a rotating shaft (3), and this rotating shaft (3) is indicated by an arrow (4a).
（４ｂ）方向に回転駆動する回転駆動機構（図示せず）
と１回転軸（３）を軸方向である矢印（５ａ）、 （５
ｂ）方向に昇降駆動する昇降駆動機構（図示せず）と１
回転軸（３）の上端部横方向に連結された平板棒状の支
持体（６）とからなっている。この位置決め機構（１）
は。(4b) A rotational drive mechanism (not shown) that rotates in the direction
and arrow (5a), (5
b) a lifting drive mechanism (not shown) that moves up and down in the direction;
It consists of a flat bar-shaped support (6) connected laterally to the upper end of the rotating shaft (3). This positioning mechanism (1)
teeth.
ウェーハを研磨加工する研磨装置の一部をなすチャック
部（力に近接して設置されている。一方、ウェーハ着脱
機構（２）は、第２図及び第３図に示すように、支持体
（６）の先端下面に上下方向に固定された基軸（８）と
、この基軸（８）の下端部に同軸かつ開口側が下側とな
るように重設された椀状の保持体（９）と、この保持体
（９）の中空部（９ａ）に等配して収納される３個の真
空ビンセットαＯ）・・・とからなっている。The wafer attachment/detachment mechanism (2) is installed close to the chuck part (a part of the polishing apparatus for polishing wafers). A base shaft (8) fixed vertically to the lower surface of the tip of the base shaft (8), and a bowl-shaped holder (9) superimposed on the lower end of the base shaft (8) coaxially and with the opening side facing downward. , three vacuum bottle sets αO), which are housed in the hollow part (9a) of the holder (9) and are equally distributed.
これら３個の真空ピンセラ） （ＬＯ）・・・は、同一
構造であるので、このうちの一つについて説明すると。These three vacuum pincers) (LO)... have the same structure, so one of them will be explained.
真空ピンセラ） （１０）は、保持体（９）の中空部（
９ａ）底部に気密かつ摺動自在に貫装された排気管（１
１）と、この排気管（１１）の中空部（９ａ）側端部に
連結されたゴムなどの弾性体からなる吸着片（ｌ々と、
排気管（１１）に巻装された圧縮ばね（ｌ■とからなっ
ている。上記排気管ａυの吸着片（１２１と反対側の端
部は、保持体（９）の背部に突出していてストッパとな
る鍔（ｌｌａ）が形成されている。しかして、圧縮はね
（１３）は、外力が付加され々いときは、鍔（ｌｌａ）
が保持体（９）の背面に描接するまで吸着片（１２を矢
印Ｉ方向に付勢するようになっている。このときの吸着
片（１りの前面（１２ａ）は、保持体（９）の端面（２
）よりも外方に突出するように設定されている。さらに
、端面（１ツには複数の切欠（１５ａ）・・・が等配し
て設けられ、気体の流通路となるようになっている。ま
た、吸着片αりの内側には、ウェーハα６）を位置決め
するための吸着座（１７）が段差状に欠切して形成され
ている。この吸着座（【７）の主面には、排気管（ｌυ
の端面が面一に開口している。この排気管（１１）の鍔
（ｌｌａ）側の端部には、上記真空源に接続された可撓
性の導管（１枠が接続されている。一方、基軸（８）に
は１貫通孔（１ｇｌが同軸に穿設され、その一端部は、
保持体（９）の中空部（９ａ）に開り
口し、他端部１ｄ、１記圧縮空気源に接続されい可撓性
の導管（２０）に法鮭されている。なお、上記チャック
部（７）１は、基体（Ｉ！υと、この基体（２１）上に
固設された円柱状の支持台（２２と、この支持台（２２
上面に貼着された円板状の発泡ウレタンシー） Ｅｌと
、この発泡ウレタンシート（ハ）上に支持台０渇と同軸
に固着された円環状のキャリヤ（２）とからなっている
。このキャリヤ（２４１の内径は、ウェーハ（ｔ６）の
外径より大となるように設けられている。さらに、支持
体（６）の長さは１回転軸（３）が回転して、保持体（
９）と支持台（２湯とが同軸となるように設定されてい
る。vacuum pincers) (10) is the hollow part (
9a) An exhaust pipe (1
1), and an adsorption piece (l) made of an elastic body such as rubber connected to the end of the hollow part (9a) of this exhaust pipe (11).
It consists of a compression spring (l) wrapped around the exhaust pipe (11).The end of the exhaust pipe aυ opposite to the suction piece (121) protrudes from the back of the holder (9) and serves as a stopper. Therefore, when the compression spring (13) is subjected to too much external force, the tsuba (lla) is formed.
The suction piece (12) is urged in the direction of arrow I until it comes into contact with the back surface of the holder (9).At this time, the front surface (12a) of the suction piece (1) The end face of (2
) is set to protrude outward. Furthermore, a plurality of notches (15a) are provided at equal intervals on one end surface to serve as a gas flow path.Furthermore, on the inside of the suction piece α, a wafer α6 ) is formed with a stepped cutout for positioning the suction seat (17). The exhaust pipe (lυ
The end face of is open flush. A flexible conduit (one frame) connected to the vacuum source is connected to the end of the exhaust pipe (11) on the flange (lla) side.On the other hand, the base shaft (8) has one through hole. (1gl is drilled coaxially, one end of which is
It opens into the hollow part (9a) of the holder (9), and the other end 1d is connected to a flexible conduit (20) connected to the compressed air source. The chuck part (7) 1 consists of a base (I!υ), a cylindrical support base (22) fixed on this base body (21), and
It consists of a disk-shaped urethane foam sheet (El) adhered to the upper surface, and an annular carrier (2) fixed coaxially with the support base on the foamed urethane sheet (C). The inner diameter of this carrier (241) is set to be larger than the outer diameter of the wafer (t6).Furthermore, the length of the support (6) is such that the rotation shaft (3) rotates once and the holder (
9) and the support stand (2 hot water) are set to be coaxial.
上記構成のウェーハローダにおいては、まず真空源を作
動させて、真空ビンセットθ０）・・・により。In the wafer loader having the above configuration, the vacuum source is first activated, and the vacuum bin set θ0)...
ウェーハ（ＩＱをその吸着座ａη・・・Ｋ保持させる。Hold the wafer (IQ) on its suction seats aη...K.
すなわち、回転軸（３）を、矢印（４ａ）方向に回転さ
せるとともに、矢印（５ｂ）方向に下降させ、さらに導
管鱈・・・及び排気管ａ→・・・を介して排気すること
により、図示せぬ載置台上の所定位置に置がれているウ
ェ−−−Ｈをウェーハ着脱機構（２）に保持させる。こ
のときウェーハ０６）の下面は、端面ｏ９より下方に位
置している。ついで、回転軸（３）を矢印（５ａ）方向
に−Ｆ昇させるとともに、矢印（４ｂ）方向に回転させ
、ウェーハ（ｔ６）を発泡ウレタンシート（２３＋直上
位Ｔｉ“に位置決めする。しかして、保持体（９）を矢
印（５ｂ）方向に下降させて、ウェーハ卸を発泡ウレタ
ンシート（ハ）に、ウェーハ（［６）の下面が圧縮ばね
（１りの付勢力に抗して端面ａ５１にキャリヤ（財）が
当接する位置に後退するまで押圧する。したがって、ウ
ェーハ（国は圧縮ばねα四により発泡ウレタンシート（
ハ）に加圧されている。ついで、真空吸着を停止した後
、導管１２０）及び貫通孔（１９１を経由して、圧縮空
気源より圧縮空気をウェーハ（ｆωに噴射し、このウェ
ーハ（ｔ６）を発泡ウレタンシート（ハ）に対して静圧
的に押圧する。かくて、ウェーハ（１６）は、発泡つＶ
タンシー） （２３）に固着される。ついで、圧縮空気
の噴射を停止し、保持体（９）を矢印（５ａ）方向に上
昇させて原位置に復帰させる。That is, by rotating the rotating shaft (3) in the direction of the arrow (4a) and lowering it in the direction of the arrow (5b), and further exhausting through the conduit cod and the exhaust pipe a, A wafer attachment/detachment mechanism (2) holds a wafer H placed at a predetermined position on a mounting table (not shown). At this time, the lower surface of the wafer 06 is located below the end surface o9. Next, the rotating shaft (3) is raised by -F in the direction of the arrow (5a) and rotated in the direction of the arrow (4b) to position the wafer (t6) on the foamed urethane sheet (23 + Ti" directly above it. The holder (9) is lowered in the direction of the arrow (5b), and the wafer is placed on the foamed urethane sheet (c), and the lower surface of the wafer ([6) is pressed against the biasing force of the compression spring (1) against the end surface a51. Press the carrier (goods) until it retreats to the abutting position. Therefore, the wafer (country) is compressed by compression spring α4 to press the urethane foam sheet (
C) is pressurized. Next, after stopping the vacuum suction, compressed air is injected from the compressed air source to the wafer (fω) via the conduit 120) and the through hole (191), and this wafer (t6) is placed against the foamed urethane sheet (c). The wafer (16) is then pressed statically with the foamed V.
Tansy) (23). Then, the injection of compressed air is stopped, and the holding body (9) is raised in the direction of the arrow (5a) to return to its original position.
このように、本実施例のウェーハローダは、ウェーハ鱈
の発泡ウレタンシート（２湯への押圧を圧縮空気傾より
行っているので、ウェーッー （ｌ［９表面を傷付ける
ことがない。また、ウェーハａυの着脱を真空チャック
（１０）・・・により行っていることもウェーハαｅの
表面の保護に役立っている。これら二つの効果が相俟っ
て１発泡ウレタンシート（２階へのウェーハαｅへの自
動化された接着作業の信頼性が高まり。In this way, the wafer loader of this embodiment presses the wafer cod onto the foamed urethane sheet (2) using a compressed air tilt, so the surface of the wafer is not damaged. The use of a vacuum chuck (10) to attach and detach the wafer αe also helps to protect the surface of the wafer αe.These two effects work together to prevent the urethane foam sheet from being attached to the wafer αe on the second floor. Increased reliability of automated bonding operations.
ウェーハα６）の品質向上及び製造価格低減に寄与する
ことができる。This can contribute to improving the quality of the wafer α6) and reducing the manufacturing cost.
なお、上記実施例における圧縮空気の代りに窒素、アル
ゴン（Ａｒ）、二酸化炭素（ＣＯ２）等を用いてもよい
。また、真空ピンセット（ｊＯ）・・・の代りに１円環
状吸着板の一端面に真空源に接続された１１、空吸着孔
を等配して開口させ、ウェーハを光鋭自在に保持するよ
うにしてもよい。さらにまた、位置決め機構は、上記実
施例に限ることなく５例えばロボットのアームに取付け
てもよい。さらに、圧縮気体は、貫通孔０旬でなく１本
又は複数本のノズルから噴射させるようにしてもよい。Note that nitrogen, argon (Ar), carbon dioxide (CO2), etc. may be used instead of the compressed air in the above embodiments. In addition, instead of vacuum tweezers (jO)..., a ring-shaped suction plate 11 connected to a vacuum source is opened on one end surface of the suction plate, and empty suction holes are evenly distributed to hold the wafer in an optically sharp manner. You can also do this. Furthermore, the positioning mechanism is not limited to the above embodiments, and may be attached to, for example, an arm of a robot. Furthermore, the compressed gas may be injected from one or more nozzles instead of the through-hole.
本が糊のウェーハローダは１例えば発泡ウレタンシート
などに接着されるウェーハの押圧を圧縮気体の噴射によ
り行い、なおかつウェーハの着脱を真空吸着を利用して
行うようにしているので、接着時にウェーハ表面を傷付
けることがない。とのことＫより、ウェーハ接着のだめ
の自動化作業の信頼性が高まり、ウェーハの品質向上及
び製造価格低減に寄与することができる。The wafer loader with glue uses 1 to press the wafer to be adhered to, for example, a foamed urethane sheet, by jetting compressed gas, and also to attach and detach the wafer using vacuum suction. It won't hurt. As a result, the reliability of automated wafer bonding work can be improved, contributing to improved wafer quality and lower manufacturing costs.
第１図は本おり７の一実施例のウェーハロータノ斜視図
、第２図は第１図における保持体の下面図。
第３図は第２図におけるＡＯＡ’線断面図である。
（１）：位置決め機構。
（２）：ウェーハ着脱機構。
ａ１＝真空ビンセット（真空吸着部）。
（ｔｅ ：ウエーハ。
（１俤：貫通孔（噴射加圧部）
代理人 弁理士 則 近 憲 佑
（ほか１名）FIG. 1 is a perspective view of the wafer rotor of an embodiment of the book cage 7, and FIG. 2 is a bottom view of the holder in FIG. 1. FIG. 3 is a sectional view taken along the line AOA' in FIG. 2. (1): Positioning mechanism. (2): Wafer attachment/detachment mechanism. a1=vacuum bottle set (vacuum suction part). (te: wafer. (1 yen: through hole (injection pressurizing part) Agent: Patent attorney Noriyuki Chika (and 1 other person)
Claims (1)
空吸着部及びこの真空吸着部に近接して設けられ上記ウ
ェーハの一方の主面に圧縮気体を噴射して加圧する噴射
加圧部を有するウェーハ着脱機構と、このウェーハ着脱
機構を保持して所定位置に位置決めする位置決め機構と
、上記真空吸着部に接続された真空源と、上記噴射加圧
部に接続された圧縮気体源とを具備することを特徴とす
るウェーハローダ。A vacuum suction unit that holds a part of one main surface of the wafer by vacuum suction, and an injection pressurization unit that is provided close to the vacuum suction unit and injects compressed gas to pressurize one of the main surfaces of the wafer. a wafer attachment/detachment mechanism having a wafer attachment/detachment mechanism; a positioning mechanism for holding and positioning the wafer attachment/detachment mechanism at a predetermined position; a vacuum source connected to the vacuum adsorption section; and a compressed gas source connected to the injection pressurization section. A wafer loader comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (en) | 1984-01-26 | 1984-01-26 | Wafer loader |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59011044A JPS60157231A (en) | 1984-01-26 | 1984-01-26 | Wafer loader |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157231A true JPS60157231A (en) | 1985-08-17 |
| JPH0129063B2 JPH0129063B2 (en) | 1989-06-07 |
Family
ID=11767041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59011044A Granted JPS60157231A (en) | 1984-01-26 | 1984-01-26 | Wafer loader |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60157231A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445567A (en) * | 1987-08-10 | 1989-02-20 | Sumitomo Electric Industries | Semiconductor wafer applying method and device |
| US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
| KR100967222B1 (en) | 2008-06-16 | 2010-07-05 | 정진황 | Transfer chamber and substrate transfer method |
| WO2011033724A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社Sumco | Polishing method and polishing device |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| CN106826510A (en) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | A kind of chip clears off technique |
-
1984
- 1984-01-26 JP JP59011044A patent/JPS60157231A/en active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445567A (en) * | 1987-08-10 | 1989-02-20 | Sumitomo Electric Industries | Semiconductor wafer applying method and device |
| US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
| US5527209A (en) * | 1993-09-09 | 1996-06-18 | Cybeq Systems, Inc. | Wafer polisher head adapted for easy removal of wafers |
| KR100967222B1 (en) | 2008-06-16 | 2010-07-05 | 정진황 | Transfer chamber and substrate transfer method |
| WO2011033724A1 (en) * | 2009-09-18 | 2011-03-24 | 株式会社Sumco | Polishing method and polishing device |
| JP2011062789A (en) * | 2009-09-18 | 2011-03-31 | Sumco Corp | Polishing method and polishing device |
| US8870627B2 (en) | 2009-09-18 | 2014-10-28 | Sumco Corporation | Polishing method and polishing apparatus |
| CN104690641A (en) * | 2013-12-04 | 2015-06-10 | 台湾积体电路制造股份有限公司 | Transfer Module for Bowed Wafers |
| CN106826510A (en) * | 2016-12-30 | 2017-06-13 | 郑州晶润光电技术有限公司 | A kind of chip clears off technique |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129063B2 (en) | 1989-06-07 |
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