JPS60153542U - semiconductor package - Google Patents
semiconductor packageInfo
- Publication number
- JPS60153542U JPS60153542U JP4127684U JP4127684U JPS60153542U JP S60153542 U JPS60153542 U JP S60153542U JP 4127684 U JP4127684 U JP 4127684U JP 4127684 U JP4127684 U JP 4127684U JP S60153542 U JPS60153542 U JP S60153542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- lead terminal
- bend
- utility
- shaped cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す側面図、第２図は第１
図の実施例におけるリード端子の一例を示すＡ−Ａ断面
図、第３図は本考案の実装状態の一例を示す部分断面図
である。
１・・・・・・半導体パッケージ、２・・・・・・リー
ド端子、３・・・・・・印刷配線板、４・・・・・・ス
ルーホール。 。Fig. 1 is a side view showing one embodiment of the present invention, and Fig. 2 is a side view showing an embodiment of the present invention.
FIG. 3 is a partial sectional view showing an example of the mounting state of the present invention. 1...Semiconductor package, 2...Lead terminal, 3...Printed wiring board, 4...Through hole. .
Claims (1)
リード端子の断面構造をＶ字型にしたことを特徴とする
半導体パッケージ。Bend the lead terminal tips of the semiconductor package inward and
A semiconductor package characterized by a lead terminal having a V-shaped cross-sectional structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127684U JPS60153542U (en) | 1984-03-23 | 1984-03-23 | semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4127684U JPS60153542U (en) | 1984-03-23 | 1984-03-23 | semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60153542U true JPS60153542U (en) | 1985-10-12 |
Family
ID=30550950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4127684U Pending JPS60153542U (en) | 1984-03-23 | 1984-03-23 | semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60153542U (en) |
-
1984
- 1984-03-23 JP JP4127684U patent/JPS60153542U/en active Pending
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