JPS60150654A - Case for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the generation of an accident such as the leakage of a potting resin even when a thermal cycle is applied by forming a casting resin connecting section consisting of a groove or a projection to an inner circumferential surface. CONSTITUTION:A case 4 for a semiconductor device has a projection 4b (or a projecting strip) extending in the circumferential direction in a case inner circumferential wall surface 4a. Since the projection 4b is buried when a casting resin is injected into the case 4, the projection 4b is held in a cured casting resin layer after the casting resin cures, thus bringing the state in which the casting resin layer is coupled with the case inner circumferential wall surface 4a by a kind of a mechanical permanent joint. Accordingly, even when the casting resin layer and the case 4 repeat expansion and contraction by the sudden variation of an ambient temperature, combination between the casting resin layer and the case inner circumferential wall surface 4a is not disengaged, and no accident such as the leakage of a potting resin is generated.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a case for a semiconductor device, and in particular to an improved case for use in a cliff fA device that is free from the risk of accidents such as leakage of potting resin. It is open.

[Technical use of the invention] In the conventional semiconductor device, a hand-centered body Chizo is housed in a case 1 as shown in FIG. It is manufactured by filling the resin into a mold and sealing it without curing the casting resin.

[Cost and technology issues] In the conventional semiconductor device as described above, since the inner circumferential surface of the case 1 is a smooth surface, there is a drawback that the adhesion of the casting resin layer to the inner circumferential surface of the case 1 is small. . In other words, at room temperature, case 1 is as shown in Figure 2.
Although the inner circumferential surface 1a and the casting resin layer 2 of Due to the difference between the coefficient of thermal expansion of the resin layer 2 and the coefficient of thermal expansion j+ of the case 1, a gap is created between the adhesive surfaces of the casting resin layer 2 and the inner peripheral surface 1a of the case 1. Accidents such as leakage out of the resin layer 2 were likely to occur.For this reason, conventional semiconductor devices had low reliability under conditions of use where they were subject to thermal recycling.

[Object of the Invention] An object of the present invention is to provide a case for a semiconductor device that does not have the above-mentioned drawbacks.

[Summary of the Invention'g5] This invention provides chitostain ink (H-grease-containing portion) which is formed on the inner circumferential surface of the housing, in order to avoid increasing the mutual bonding force between the chitosting resin layer and the inner circumferential surface of the case. The formation of a 'Ti mark).

By forming grooves or protrusions on the inner peripheral surface of the case, a kind of mechanical joint is formed between the casting resin layer and the 9-λ1 peripheral part, so that the casting resin layer and the tunose peripheral wall are formed. The mutual bonding force with the parts is increased compared to that of the conventional device, and even if contraction and expansion are repeated due to heat → noise, they will not separate from each other. As a result, this invention's half i:Q 14
．． According to the device case, it is possible to obtain a semiconductor device which has significantly improved resistance to thermal cycles than the conventional semiconductor device (device A), and also to improve the yield rate of the semiconductor device.

[Embodiment of the Invention] An embodiment of the invention is not shown in FIG. The case 4 for a semiconductor device of the present invention shown in this embodiment has a protrusion 4b (or protrusion) extending in the circumferential direction on the inner peripheral wall surface 4a of the case in contact with the chitosting resin layer. Since this protrusion 41) is buried in the resin of the Chitosting resin layer in the case 4, the protrusion is held by the Chitosting resin layer, and as a result, the casting resin layer is attached to the inner peripheral wall surface 4a of the case in a kind of mechanical manner. J to permanent joint,
This results in a combined state. Therefore, even if the casting resin layer and the case repeatedly expand and contract due to drastic fluctuations in ambient temperature, the bond between the casting resin layer and the inner peripheral wall of the case will not come off, preventing accidents such as casting resin leakage. Does not occur.

FIGS. 4(a) to 4(d) show modified embodiments regarding the cross-sectional shape of the protrusion 4b, and in carrying out the present invention, the protrusion may be formed in any of the shapes shown in FIG. It's okay.

Instead of the protrusions, grooves 4C may be provided in the inner circumferential wall surface 4a of the case, as shown in FIGS. 5(a) to 5(d).

Even when a groove 4C as shown in FIG. 5 is provided on the inner circumferential wall of the case as a casting resin engagement portion for bonding the resin layer to the inner circumferential wall of the case 4a, the protrusion 4b is provided. A strong mechanical joint is formed between the casting resin layer and the inner circumferential wall of the case, and the same effect as when the C protrusion 4b is provided can be obtained.

In addition, although the following embodiments show examples of forming the most preferable kit/swing resin engaging portion, other methods may also be used, such as providing a large number of small protrusions on the inner circumferential wall of the case, or Four small recesses may be provided on the inner circumferential wall of the case (in other words, the inner circumferential wall of the case may be made into a rough surface), and these may be used as casting resin retaining portions.

A semiconductor device case 4 is provided with a protrusion 4b as shown in FIG.
and a semiconductor device case 4 provided with a groove 4C as shown in FIG.
(a) Low-temperature and high-temperature resistance = trial =
, (b) thermal shock 7 test, and (C) temperature cycle test, no accidents such as botting resin coming out occurred in any of the tests.

[Effects of the Invention] As is clear from the above explanation, according to the present invention, a case for a semiconductor device that does not cause accidents such as leakage of bodding resin even when subjected to thermal cycles is provided, and as a result, , the manufacturing yield and reliability of semiconductor devices can be improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional bus for semiconductor devices, FIG. 2 is a cross-sectional view of only a portion of a semiconductor device manufactured using the semiconductor device case shown in FIG. 1, and FIG.
4 is a partial sectional view showing a modified embodiment of the semiconductor device case of the present invention; FIG. 5 is a sectional view of a modified embodiment of the semiconductor device case of the present invention. . DESCRIPTION OF SYMBOLS 1... Semiconductor device case, 2... Casting resin layer, 3... Botting resin, 4...
・Semiconductor device case, 4a...inner peripheral wall surface, 4b
... protrusion, 4c...) bamboo. Figure 1 Figure 2 n Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] 1. A case for a semiconductor device, characterized in that a main 11-staining resin retaining portion consisting of a groove or a protrusion is formed on the inner circumferential surface.