JPS60147143A - Ic package with cooling structure and manufacture thereof - Google Patents

Abstract

PURPOSE:To produce an IC package with a cooling structure by a method wherein a channel circulating cooling water or cooling medium is built inside an IC ceramic package to provide the surface of the package with inlet and outlet holes. CONSTITUTION:Green sheets are cut into specified dimension. Firstly a printing surface 33 (A) junctioning a cap with W or W-Mo base paste around a throughhole 32 into which IC elements are inserted, a printing wiring 36 (B) formed toward two sides of the sheet from another throughhole 35 into which IC elements are inserted and another printing surface 38 (C) whereon IC elements are mounted are respectively formed. Secondly a cut green sheet 39 (D) provided with a channel of cooling water or cooling medium and another cut green sheet 41 (E) provided with an inlet 42 and outlet holes 42a forming a printing surface around the holes on the backside are formed. Said green sheets (A)-(E) are laminated and bonded with one another and after side printing and resin removal, those sheets are sintered under reducing atmosphere and the metalized surface is plated with Ni and Kovar-made lead wire is junctioned to sides while either Kovar or copper tube is junctioned to inlet and outlet holes by means of soldering process etc. to finish the production.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention consists of 1. The present invention relates to a 1.C package including a cooling structure created by integrally providing a cooling structure inside a C ceramic package or a multilayer ceramic wiring board, and a method for manufacturing the same.

Conventional 1. A C ceramic package (hereinafter abbreviated as ``C package'') or a multilayer ceramic wiring board (hereinafter abbreviated as ``multilayer wiring board'') is designed to measure the amount of heat generated by the installed C strands, wiring parts, etc. Heat is dissipated to the outside through thermal conduction of the material 1.C package or multilayer wiring board.

However, the thermal conductivity of these materials, such as He1203 ceramics, is 0.040 Ca1/see − at 256C.
As a result, heat dissipation from the outside was insufficient even in devices with improved integration density and increased heat generation.

For this purpose, see 1 in Figure 1. As shown in the cross-sectional view of the C package.
, 1. A copper plate 5 with an excellent thermal conductivity of Q, 92Cal/5ec-den・℃ at 25°C is placed on the bottom of a 7-ramic 1 on which a C element 2 is mounted, sealed with a cap 3, and a lead 4 is attached to the side. Some were equipped with heat dissipation parts. Furthermore, as shown in the cross-sectional view of the LC package in Figure 2, the thermal conductivity of the ceramic 11 is 0.39 Cal/sec at 25°C.
1. cm · °C on the heat dissipation part of excellent beryllia porcelain 12.
There was one in which a C cord 13 was mounted on a tower, sealed with a cara 7'14, and a lead 15 was attached to the side of the ceramic 11.

These above-mentioned items are also available from Isuwa, for example, A1. In addition to P3 ceramic, copper plate, molybdenum plate, or Kovar plate, which is a pot metal material with excellent thermal conductivity, and IJ, which is a ceramic material.
It was used by joining IJA porcelain, etc.

However, Kowara's method had the following drawbacks. 1st
It is difficult to join metal plates with excellent thermal conductivity, as shown in the cross-sectional view in the figure, because the coefficient of thermal expansion is different from that of ceramic, and even if metal materials with similar coefficients of thermal expansion are used, The method is to metallize the ceramic and apply Ni to the top surface.
Joining was done using plating, solder, or silver brazing material, which hindered the heat dissipation of the brazing material itself, and also caused cavities between the brazing materials during round joints, which hindered heat conduction.

In addition, in the method shown in the cross-sectional view of Figure 2, the use of ceramic porcelain is naturally limited because it is toxic to the human body, and even if a metal plate is used, the use of porcelain is naturally limited.
．． The above-mentioned problems remained in the bonding of the C element and the bonding with the ceramic.

In addition to these problems, the processing cost required for joining increases, and the assembled structure becomes large, which is a problem when using the stent device.

The present invention has been made to solve the above-mentioned drawbacks, and its gist is 1. Inside the C ceramic package,
7. To provide an I-C package with a cooling structure, characterized in that a passage for circulating cooling water or a cooling medium is integrally provided, and an inlet pipe and an outlet pipe are provided on the outer surface of the passage. It is.

It also provides the manufacturing method of 1.C package equipped with this cooling structure, the gist of which is written on the green sheet.
Alternatively, several sheets printed with wiring circuits using W-Mo paste are laminated, and cooling is applied to the second layer sheet from the bottom when laminating without wiring circuits formed thereunder, or to areas that do not come into contact with the wiring circuits. A passage through which water or a cooling medium circulates is formed by punching, and holes or passages that serve as an inlet and an outlet for the cooling water or cooling medium are formed in the bottom sheet or at the side surface when stacked. These are laminated and bonded, and after the resin is removed, they are sintered in a reducing atmosphere, and a metal tube is bonded to the vent and the hole that will serve as the discharge port.

The main points of one invention will be described below.

Figure 4 is an oblique view A of a green sheet cut to a certain size and processed, and the figure A shows W or W-M around the through window 32 into which the 1.C element is inserted.

A printing surface 33 to which a cap (not shown) is bonded is formed using a paste made of a resin. Figure B is 1. The printed wiring 36 is formed on two sides from the through window 35 into which the C element is inserted, and Figure 0 is 1. A printed surface 38 is formed on which the C cord is placed, and 1 or more are the conventional 1. This is the same manufacturing method as the C package. Figure D shows a cut green sheet 39 with passages 40 through which cooling water or a cooling medium flows.
FIG. 8 shows a cut green sheet 41 with holes 42 and 428 that serve as an inlet and an outlet for cooling water or a cooling medium, and a printed surface is formed around the holes on side F (not shown). After gluing the above and printing on the side surface, remove the resin, sinter it in a reducing atmosphere at 1500 to 1550' (j), apply N1 plating to the outer metallized surface, and add Kovar lead wires and introduction holes on the side surface. And a Kovar tube or an AiII tube is connected to the discharge hole with silver low phase or solder.

A perspective view of this completed part is shown in Figure 3, and 43 and 43a in Figure 1.
are the inlet pipe and the outlet pipe, respectively. FIG. 6 is a perspective view of the process of another embodiment, and FIG. 5 is a partially completed perspective view of the same, in which an inlet pipe and an outlet pipe for cooling water or a cooling medium are installed on the side surface.

The above is 1. Did I mention an example of a C package?
This can also be applied to multilayer wiring boards.

1. To the 1.C package or 5 multilayer wiring board created above. When using the C element and other parts installed, cooling water or a cooling medium such as methanol that enters from the inlet pipe exits from the discharge pipe to be cooled and is circulated back to the inlet pipe.1. C) The main cage cools the multilayer wiring board.

The present invention is as described above.1. A cooling structure is installed integrally inside the cage or multilayer wiring board, and the manufacturing cost is lower than that of the conventional cooling structure. It was cheaper to manufacture than a C package or a multilayer wiring board, and its external dimensions were the same as those of conventional products without a cooling structure.

In this way, the external dimensions are not large, so G.

It is easy to attach to equipment, and can be used with all equipment without being subject to restrictions on mounting area.

In addition, the cooling structure of the present invention has a cooling structure of about 10 to 1
5 times the cooling effect was observed.

And compared to the durability damage of the joint with the cooling metal of the conventional product, 1
The product of the present invention showed excellent surface 4-kyuu, and the effect was strong.

Examples will be described below, but the present invention is not limited thereto within the scope of the claims.

Example I A1p 392% and CaO, MgO, Si02 (total D amount 8
Ethyl cellulose, dibutyl phthalate, trichlene, a dispersant, etc. were added to a mixed powder of 100% gruel and stirred to form a slurry, and a green sheet with a thickness of 0.7 tm was produced using the doctor blade method.

Cut this sheet into 30x20m dimensions to make 5 pieces.
It was processed into the shape shown in the perspective view of FIG. Figure A is C)3
1 to 1. Punching the through window 32 into which the C cord is inserted into a size of 18 x 10 layers? and around it 1.2 rrt
It was formed by screen printing 33 using a paste prepared from W powder in [irr i].

This becomes the bonding surface of the cap to the sintered layer. Figure B: 1. Penetration window 35 into which the C element is inserted
A hole with dimensions of 12 x 6 mm was made, and printed wiring 36 was formed using the same paste as above from the window 35 toward the outside on two sides. Figure 0 shows 1. on sheet 37. The printed surface 38 on which the C element is placed and bonded is formed with the same paste as above, and A, B, and C are the same as the conventional 1. This is the same manufacturing method as the C package. In Figure D, a passage 40 through which cooling water or a cooling medium flows is formed by punching in the sheet 39 in a U-shaped continuous shape with a medium size. Figure E shows 2 holes 4 with 2 holes in the seat 41 that serve as an inlet and an outlet for cooling water or a cooling medium.
2. Two holes 42a are provided on the bottom surface (not shown).
The same W paste as above was printed around 428° with a width of 1.2 ran.

The five sheets processed above were laminated and pressure bonded in the order shown, with the sheet shown in Figure E as the bottom layer. At this time, an adhesive was applied between each sheet, and a heating pressure machine at a temperature of 60 DEG C. and a pressure of 80 DEG C. was used.

Each of the above-mentioned processes has been explained for a single unit, but the actual process is performed by machining 50 to 100 pieces.

After lamination and crimping, it is separated into individual pieces.

Printed pads for connecting lead wires were formed using W paste on both sides of the laminated and press-bonded structure, and after removing the resin at 270°C, sintering was performed at 1520''C in a mixed atmosphere of hydrogen and nitrogen. The metallized surface of the sintered body is plated with 3 μm of Ni, and a thin silver plate is placed on top.

On top of that is a Kovar lead plate and an introduction and discharge Kovar pipe 3.
The 2φ×2.0φ theory was set and bonding was carried out in a mixed atmosphere of hydrogen and nitrogen at 700℃.

A perspective view of this completed product is shown in FIG. 3, where 43° 432 is an inlet pipe, an outlet pipe, and 44 is a lead wire. Apply 1.5 μm of An plating on the N1 plating in this central recess,
1. The C element is joined, and the connection between this element and the wiring part is bonded.

A glass cap was bonded to the top surface to seal it.

Connect DC5V to Kone and perform an actual machine test.

Cooling water at 10°C was forcibly introduced from the inlet pipe.

Even after 5 hours had passed, the package side wall temperature did not rise above 18°C. Conventional 1. without installing a cooling device. The C package rose to 58°C after 30 minutes. In this test, when an LC package with a large temperature rise is used, its cooling effect becomes clear.

Example 2 Using the same base material and method as in Example 1.

A green sheet with a thickness of 0.7 and 1.4 twn was obtained. Cut the dough to the same dimensions as in Example 1 to make four 0.7 mm sheets and one 1.4 mm sheet.

Example 1 The machining of Figures 8, B, and 0 shown in the perspective view of Figure 6 was carried out in Example 1.
It was produced in the same way. In Figure D, passages 58 through which cooling water or a cooling medium flows are punched out into a 1.4 tm sheet 57 in the shape of a 6-shape facing each other with a width of 2#I. At this time, an inlet 58a and an outlet 58b were provided on the side of the sheet. Figure E shows a 0.7tmJn sheet 60 that has not been processed.

Next, the sheet shown in Fig. E is used as the bottom layer, and the outer frame portion and inner frame portion 59 shown in Fig. D are pasted together with adhesive on top of it, and then the sheet shown in Fig. 0 and the sheet shown in Fig. B are placed on top of it in order. - The sheets shown in Figure A were pasted together and laminated and bonded in the same manner as in Example 1.

Printed surfaces for connecting lead wires were formed on both sides of the laminated and bonded layers using a paste made of W powder.

In addition, the same paste was printed around the two holes on the side surface to a width of 1.2 Tn1n, and after removing the resin at 270°C, it was heated to 152°C in a mixed atmosphere of hydrogen and nitrogen. and sintered. The metallized surface of the sintered body was plated with Nl to a thickness of 3 μm, a thin silver solder plate was placed on top of that, a Kovar lead plate was introduced, and a discharge Kovar pipe of 3.2φ x 2.0φ was set.
Bonding was carried out in a mixed atmosphere of hydrogen and nitrogen at 00'''C. A perspective view of this finished product is shown in Figure 5, and 61 and 61 in Figure 1.
62 is a lead wire.

Thereafter, 1. C element, wiring.

When the cap was attached and tested on an actual machine, the same cooling effect as in Example 1 was exhibited.

1.C package equipped with the cooling structure of the present invention? The higher the integration density and the higher the amount of heat generated by a multilayer wiring board, the better its cooling effect and durability will be.

In the above embodiment, 1. Although the decoal inline type of C package has been described, the lamination method can be applied to flat, plug-in, and chip carriers.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of a 1 and C package equipped with a conventional cooling structure, FIG. 3 is a completed perspective view of an embodiment of the present invention, and FIG. 4 is a perspective view of its manufacturing process. FIG. 5 is a completed perspective view of another embodiment, and FIG. 6 is a perspective view of its manufacturing process. 31.34.37,39,41,51,57゜60...
...cut green sea), 32, 35, 52゜54 ... punched window + s3, 36, 38.5
3,55゜56...printed surface, 40.58...punching that becomes the curved cooling water passage! Deletion H, 42, 4za, 58a
, 58b, . ...Inlet and outlet 0.43, 43a, 61, 61a-
...Introduction and discharge metal pipe, 44.62...Curved lead wire Fig. 3 Fig. 4 Fig. 5 Fig. 6

Claims (1)

[Claims] 1.1. 1. A cooling structure characterized in that a passage for circulating cooling water or a cooling medium is integrally provided inside the ceramic package, and an inlet pipe and an outlet pipe are provided on the outer surface of the passage. C package. 2. A wiring circuit was printed on a green sheet using a paste made of W or W-Mo, and the printed circuit was laminated and bonded and sintered to form a single body. 1. In the manufacturing method of a C ceramic package, the above printed circuit was formed. When several green sheets and green sheets are laminated without wiring circuits, holes are punched into the second layer sheet from the bottom or in areas that do not contact wiring circuits, through which cooling water or a cooling medium flows and circulates. In addition, holes or passages that serve as the inlet and outlet for cooling water or a cooling medium are provided in the lowermost sheet or at the side surface when laminated. 1.C equipped with a cooling structure characterized by laminating and bonding these processed sheets, sintering them in a reducing atmosphere after removing the resin, and joining metal pipes to the holes that serve as the inlet and outlet. How the package is manufactured.