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JPS60144985U - 浴槽湯面浮遊物除去装置 - Google Patents

浴槽湯面浮遊物除去装置

Info

Publication number
JPS60144985U
JPS60144985U JP3171784U JP3171784U JPS60144985U JP S60144985 U JPS60144985 U JP S60144985U JP 3171784 U JP3171784 U JP 3171784U JP 3171784 U JP3171784 U JP 3171784U JP S60144985 U JPS60144985 U JP S60144985U
Authority
JP
Japan
Prior art keywords
hot water
floating
pump
water surface
removal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3171784U
Other languages
English (en)
Inventor
十文字　邦治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3171784U priority Critical patent/JPS60144985U/ja
Publication of JPS60144985U publication Critical patent/JPS60144985U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Removal Of Floating Material (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案に係る浴槽湯面浮遊物除去装置の縦断面
図で、第２図は浮き漏斗の中心を通る縦断面図で、第３
図は調節錘りの斜視図である。 １・・・・・・縦型汲上ポンプ、２・・・・・・ケーシ
ング、４・・・・・・排水管、７・・・・・・電池、８
・・・・・・スイッチ、１０・・・・・・浮き漏斗、１
１・・・・・・中空室、１２・・・・・・流入縁、１３
・・・・・・トラップ金具、１７・・・・・・調節錘り
、１８・・・・・・フレキシブルチューブ、１９・・・
・・・支持部材、２０−−−−−−スライドストッパー
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 浴槽側壁に脱着自在に取付けられ、ポンプ上端部に排水
    管を設けた縦型電動汲上ポンプの円筒形ケーシングに、
    周縁を流入縁とし、中央部に湯面上に突出した環状浮力
    部を設け、かつ前記流入縁を湯面より若干沈むよう浮力
    調節可能とした浮き漏斗を前記環状浮力部の円筒孔を通
    して遊嵌させ、前記浮き漏斗の排水口と前記汲上ポンプ
    底部の吸水口を、前記浮き漏斗が湯面に応じ移動できる
    長さのフレキシブルチューブで連結したことを７　　特
    徴とする浴槽湯面浮遊物除去装置。
JP3171784U 1984-03-07 1984-03-07 浴槽湯面浮遊物除去装置 Pending JPS60144985U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3171784U JPS60144985U (ja) 1984-03-07 1984-03-07 浴槽湯面浮遊物除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3171784U JPS60144985U (ja) 1984-03-07 1984-03-07 浴槽湯面浮遊物除去装置

Publications (1)

Publication Number Publication Date
JPS60144985U true JPS60144985U (ja) 1985-09-26

Family

ID=30532569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3171784U Pending JPS60144985U (ja) 1984-03-07 1984-03-07 浴槽湯面浮遊物除去装置

Country Status (1)

Country Link
JP (1) JPS60144985U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

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