JPS60141887A - Manufacture of electroformed precision parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for manufacturing precision electroformed parts,
This method is characterized by repeated use of plating photoresist.

[Prior art]

Recently, parts (metal encoder slit plate, metal encoder slit plate,
Meshes for cell fusion, shadow masks, fine pattern coils, etc.) are desired, and not only the dimensional accuracy of the plane but also the cross-sectional shape (as straight as possible) has become a problem. Of course, such thin film patterning is normally produced by chemical etching using an etching photoresist, but when etching isotropic materials such as metal plates, there is a problem of underetching, which makes it difficult to meet such demands. I can't answer it anymore. On the other hand, it is well known that a plating resist is formed using a photoresist and then electroformed. But I can't get it.

Considering that the cross-sectional shape of the 7-otoresist after development is gas traded, the limit of the aspect ratio is 1:1, and the limit is a thickness of 30 to 50 μm and a pattern width of 30 to 50 μm at most. For example, with a thickness of 50 to 200μ, 50 to 50
When the aspect ratio, such as the pattern width of μ, is 1:1 or more, electroforming cannot be performed even though photoresist can be used as a metal resist. Therefore, usually 20 to 5
The method used is to apply 0μ, expose and develop using a master mask, and repeat this process two or more times to form a resist pattern with a high aspect ratio. Exposure and development are extremely problematic in terms of alignment technology. Especially for large areas, aligners are not available. Therefore, the inventor of the present invention discovered that by exposing and developing a photoresist using his first electroformed pattern as a mask, an electroformed part having a cross-sectional shape with a high aspect ratio test rate could be produced, which led to the creation of the present invention. .

〔the purpose〕

However, the purpose of the present invention is to achieve a high aspect ratio (1:1 or more).
The object of the present invention is to obtain an electroformed part having a straight cross-sectional shape at a low cost.

〔overview〕

The present invention will be explained using FIG. (A) to (I() are process diagrams of the present invention. 1 is a transparent substrate, made of glass, ceramic, plastic film (polyester, polycarbonate, polyethersulfon, polysulfon, polyetherimide, etc.), 2 is a patterned photoresist, which becomes a metskire resist.

The images up to (a) are obtained by normal photolithography. 2 is a resist, which has a thickness of 5 μ to 60 μ depending on the resolution, and the thinner the resist, the straighter the cross section of the resist. In this step (A)), the maximum value of α:b is about 1:1 (even if parallel light is used and a high-resolution resist is used).

It is difficult to obtain a/b>1. (B) is a diagram in which a metal 6 is electroformed using 2 as a resist, and it is preferable that the thickness of 6 be electroformed to be approximately the same as the thickness b of 2 or a little thinner. If it becomes thicker than b, the straightness of the cross section will be lost and it will become mushroom-shaped. The metal of Party B may be any metal or alloy that can be plated electrolytically or electrolessly, but
i, Cu, (3°, etc.) are used.Since 1 is a transparent insulator, it goes without saying that at least the first plating must be electroless plating.(0) is a photoresist in the state of (B). It is a process diagram of coating No. 4. (D)
1 is an exposure step that is a feature of the present invention, in which 4 is exposed from the back side of 1 using 3 as a photomask. Through this process,
There is no need to consider the problem of the position of the mask and pattern 3 at all.0 It goes without saying that the photoresist used in step 4 must be negative type even in this process04
The thickness can be considered in exactly the same way as in 2 above. (Figure 1 shows the developed image, and (1') shows the result of electroforming by layering 5 on 3 using 4 as a metskiresist. With this method, 1 > a/b > 1/2 can be obtained. is obvious.If you want a larger ratio, you can repeat steps (0) to (F) many times.Depending on how you use the electroformed parts, you can leave resist 4 as a permanent resist, but usually Separate the parts as shown in G) and further separate them from the substrate 1 to obtain an electroformed part (H).

The above is an overview of the present invention. Next, the present invention will be explained in more detail with reference to Examples.

Example 1 As shown in FIG. 1, soda glass 1 was subjected to 5n-Pd catalyst treatment, and then coated with 30 μm of Titanon R9-400, a negative type photoresist made by Nippon Soda Mono, by curtain coating. Next, using a master mask, expose and develop the A
) got the figure. α=30μ, b=30μ. Next, using Metsukiresist 2, which is such a photoresist, N1-P plating (3
) was applied. Next, apply negative photoresist 4 in the same manner.
was coated with a thickness of 40μ using the curtain coating method (Figure a).

Next, use the primary electroformed surface 3 like a mask for exposure, (
Good luck!・) As shown in the figure, the substrate 1 was exposed to light from the back side and developed to obtain the figure E). Next, 40μ of N1-P No. 5 was electroformed.

Next, the resist was peeled off to obtain Figure (G).The metal parts (6 and 5) were then peeled off from the substrate. The aspect ratio!
It was 10μ near and 0μ near.

Also, the cross section of No. 5 was completely straight. Conventionally, it has been impossible to manufacture parts with such a straight cross section and an aspect ratio of 5 near.

This part was very useful as a mesh for cell fusion. Moreover, by changing Ni, -P to Cu, a flat pattern coil with a very good line area ratio was obtained.

In this case, the resists (2 and 4) must be peeled off from the substrate 1 in order to form an insulating part as a permanent resist. It has also been found that by repeating this process three or more times, electroformed parts with high aspect ratios such as 30μ:110μ and 30μ:150μ can be easily obtained. If such an exposure method from the back side of the substrate was not used, 3 and 5 would not overlap completely and a straight cross section could not be obtained.

The present invention is widely applicable to decorative items and functional parts.

[Brief explanation of drawings]

Figure 1 ANH...Process diagram of the present invention and above Applicant: Suwa Seikosha Co., Ltd. beginning < 0 0 convex W voice [phase]

Claims (1)

[Claims] In a method for manufacturing an electroformed part, 1) a step of forming a mesh resist pattern on one side of a transparent substrate using a 7-hole resist; 2) a step of forming a first electroforming resist pattern to approximately the same height as the mesh resist pattern in addition to the nodding resist pattern; Step 3) After the first electroforming is completed, a step of applying a negative type 7 tresist on the first electroformed surface 4) Applying the 1t tresist to the first electroforming butter? Step 5) of forming a second plating resist pattern by exposing and developing from the back side of the transparent substrate using / as a mask Steps 1) to 5) of performing second electroforming on the S portion other than the second plating resist pattern Precision electroformed parts manufacturing method 0 characterized by sequentially including