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JPS60132327U - prepreg material - Google Patents

prepreg material

Info

Publication number
JPS60132327U
JPS60132327U JP1917684U JP1917684U JPS60132327U JP S60132327 U JPS60132327 U JP S60132327U JP 1917684 U JP1917684 U JP 1917684U JP 1917684 U JP1917684 U JP 1917684U JP S60132327 U JPS60132327 U JP S60132327U
Authority
JP
Japan
Prior art keywords
prepreg material
prepreg
sheet
utility
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1917684U
Other languages
Japanese (ja)
Inventor
秀雄 秋山
前田　治征
小田原　弘之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP1917684U priority Critical patent/JPS60132327U/en
Publication of JPS60132327U publication Critical patent/JPS60132327U/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は、この考案のプリプレグ材料の一実施態様を示す
概略横断面図である。 １ニブリプレグ、２：剥離シート、３：紙基材、４：易
剥離性剥離剤の塗布層、５：難剥離性剥離剤の塗布層。The drawing is a schematic cross-sectional view showing one embodiment of the prepreg material of this invention. Reference numeral 1: Nibli Preg, 2: Release sheet, 3: Paper base material, 4: Coating layer of easily peelable release agent, 5: Coating layer of difficult to peel release agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一面の剥離力が他面の剥離力の０．１〜０．８倍である
剥離シートの前記他面に、補強繊維にＢ−ステージの熱
硬化性樹脂を含浸してなるシート状プリプレグを担持し
でなることを特徴とす四プリプレグ材料。A sheet prepreg formed by impregnating reinforcing fibers with a B-stage thermosetting resin is carried on the other side of the release sheet, the peeling force of which is 0.1 to 0.8 times that of the other side. Four prepreg materials characterized by:
JP1917684U 1984-02-15 1984-02-15 prepreg material Pending JPS60132327U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1917684U JPS60132327U (en) 1984-02-15 1984-02-15 prepreg material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1917684U JPS60132327U (en) 1984-02-15 1984-02-15 prepreg material

Publications (1)

Publication Number Publication Date
JPS60132327U true JPS60132327U (en) 1985-09-04

Family

ID=30508507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1917684U Pending JPS60132327U (en) 1984-02-15 1984-02-15 prepreg material

Country Status (1)

Country Link
JP (1) JPS60132327U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171719A (en) * 2010-01-22 2011-09-01 Sumitomo Bakelite Co Ltd Method for laminating prepreg, method for producing printed wiring board, and prepreg roll
JP2014017503A (en) * 2007-09-11 2014-01-30 Ajinomoto Co Inc Multilayer printed wiring board manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017503A (en) * 2007-09-11 2014-01-30 Ajinomoto Co Inc Multilayer printed wiring board manufacturing method
JP5465530B2 (en) * 2007-09-11 2014-04-09 味の素株式会社 Manufacturing method of multilayer printed wiring board
JP2014112708A (en) * 2007-09-11 2014-06-19 Ajinomoto Co Inc Multilayer printed wiring board manufacturing method
JP2015005758A (en) * 2007-09-11 2015-01-08 味の素株式会社 Multilayer printed wiring board manufacturing method
JP2011171719A (en) * 2010-01-22 2011-09-01 Sumitomo Bakelite Co Ltd Method for laminating prepreg, method for producing printed wiring board, and prepreg roll

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