JPS60126874A - Optical coupling semiconductor device - Google Patents

Abstract

PURPOSE:To improve the efficiency of optical transmission by forming a transparent insulating substrate shaping a ring-shaped electrode surrounding a light- emitting element between the light-emitting element and a light-receiving element and eact extending two kinds of resins having different characteristics up to the electrode so as to cover the light-emitting element. CONSTITUTION:A semiconductor light-emitting element 5 is fixed to a branched electrode section extending to the central section of a ring-shaped electrode in a first electrode 3 formed on a light-transmitting insulating board 1, and another electrode in a LED is connected to one part of a second electrode 4 by a bonding wire 6. The upper section of the LED5 assembled on the light-transmitting insulating board is covered with a light-transmitting resin 7. A section up to the ring-shaped electrode shaped to the first electrode 3 is covered. A lens shape is formed by selecting the quantity of the light-transmitting resin in a proper quantity. Accordingly, the upper section of the light-transmitting resin having an n1 refractive index is covered with a second resin 8 having an n2 refractive index through which beams from the LED are totally reflected, and the second resin is solidified similarly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to an optically coupled semiconductor device in which the light receiving surfaces of a light emitting element and a light receiving element face each other, and the light receiving element can be driven by an optical signal from the light emitting confectionery.

[Prior art and its moving points]

Recently, optically coupled semiconductor devices (hereinafter referred to as photocouplers), in which a semiconductor light-emitting element and a light-receiving element are optically and integrally coupled, have been attracting attention as a new solid-state device, and are widely used for solid-state relays, transmission line isolation, etc. It is used.

In particular, photocoupler arrays in which a plurality of photocouplers are arranged side by side on the same substrate, and circuit devices that combine photocouplers and integrated circuits (very effectively used in two-wheel circuits or communication circuits) are used.

In manufacturing this photocoupler, it is important to solve the following problems.

(1) The distance between the light emitting element and the light receiving element is 200 μm or more.

Separate the top and bottom to increase the dielectric strength between the two.

(2) In a plurality of light-receiving sensitivity regions, one optical signal should not affect the other light-receiving sensitivity region C and cause malfunction.

(31. The light transmission efficiency between the light emitting element and the light receiving element is low.

Conventionally, this type of photocoupler has a structure in which, for example, a light-emitting confectionery and a light-receiving element are arranged with their light-emitting and light-receiving surfaces facing each other, with a translucent resin or glass interposed between both surfaces. It becomes.

In a photocoupler with this structure, the light from the light emitting element is irradiated not only to the photosensitivity area of the photodetector, but also to other areas, so there is a risk of malfunction that may affect the photosensitivity areas of other photodetectors. Cause. Therefore, this arrangement was used to increase the integration density when producing photocouplers and integrated circuits with photocouplers. Furthermore, since more than half of the amount of light irradiated by the light emitting element leaks to the outside, there is a drawback that the optical coupling efficiency is low. Therefore, these drawbacks have been the biggest cause of lowering the mass production yield of photocouplers.

[Purpose of the invention]

It is an object of the present invention to provide an optically coupled semiconductor device which improves the above-mentioned drawbacks of the prior art and is highly reliable and can be mass-produced with low yield.

[Summary of the invention]

In order to achieve this object, the present invention is characterized by providing a transparent insulating substrate between a light emitting element and a light receiving element, forming a ring-shaped electrode surrounding the luminescent confectionery on this insulating plate, and forming a ring-shaped electrode surrounding the luminescent confectionery. 2N type resins with different sl and sl characteristics are each extended to a ring-shaped electrode.

[Embodiments of the invention]

The present invention will be described in detail with reference to Examples below.

1 to 3 show the manufacturing process of a photocoupler having two photosensitivity regions according to an embodiment of the present invention. Basic structure 5 consisting of this type of light-receiving element, a light-transmitting insulating plate, and a light-emitting element: FIG. 1 shows a light-transmitting insulating plate. For example, the transparent insulating plate (1) has a thickness of 250 μm.
m glass plate, one side ζ2AJ or Cr-A
U is formed by vapor deposition, and luminescent confectionery is electrically
1 & i3+ and (4) to connect 2 J? BP technology (
=Thus, it is formed. The electrode (3) has a ring shape with a width of about 100 μm, which is larger than the size of the light emitting element 7, and extends in a branch shape toward the center as one electrode of the light emitting confectionery. This first electrode (3) is also connected to a first electrode for an adjacent light emitting element, forming a common bonding butt for taking out the electrode. Second electrode (4) and (
The four electrodes are arranged so as to surround the first electrode (3) at a distance of 100 μm or more, and form respective bonding butts for taking out the electrodes. In other areas of the translucent insulating plate (1), an opening (2) for connecting the electrode of the light receiving element to an external terminal is formed by ultrasonic machining or etching. The shape is precisely cut with a blade cutter to the same size as the photodetector.

FIG. 2 is an enlarged sectional view of the section A-A' in FIG. 1. In the same figure, a first
A semiconductor light emitting device (5) (12 is referred to as the lower LfiD) is fixed to the branch-like electrode part extending toward the center of the ring-like electrode of the electrode (3) using silver paste, etc. Connect the electrode to a part of the second electrode (4) to the bonding wire (6).
) to connect.

A transparent resin (7) is covered over the LED (51) assembled on a transparent insulating board in this way.The transparent resin (7) has a relatively low viscosity, so it flows laterally, and the first When it reaches the ring-shaped electrode formed on the electrode (3), the flow stops due to surface tension. By selecting the appropriate amount of this translucent resin, a lens-like shape as shown in the figure can be created. The thus formed translucent resin having a refractive index n! is cured once at, for example, 120°C to 150°C, and then the refractive index of the above-mentioned translucent resin that totally reflects the light from the LED is cured. A second resin (8) with a lower n is covered and similarly solidified.

The resin for the text box 2 may be a resin that is opaque to the wavelength of the LED.

FIG. 3 shows the transparent insulating plate and the light receiving element facing each other and fixed onto the mounting stem.

A light receiving element (10) having a light receiving region α1) including a PN junction formed by a diffusion method or the like on a portion of the surface of a silicon substrate is prepared. Naturally, this light-receiving area is arranged at a position facing the light-emitting confectionery of the translucent insulating plate.

The light-receiving element (1 (II) is fixed onto the stem metallized on metal or ceramics using solder or the like.

Above ≦2 A translucent insulating plate with the same external shape as the light-receiving sweets (
A jig (1) for stacking 1) and fixing the outer periphery with precision.
At the same time as fitting 21, it is adhesive and 150℃
An example of something that is stable before and after is silicone resin (two translucent insulating plates are fixed).

In the same figure, (2) is an opening provided in the insulating plate (1), and below this, bonding pads for taking out the electrodes of the light-receiving element are lined up several meters long. Electrically (two connections are made. Similarly, the light emitting element side is connected to the insulating plate (1) (two LE
Electrical connection is made from the bonding pad D to the external electrode lead terminal using a bonding wire (14).

[Other embodiments of the invention]

In the above embodiment, a photocoupler that combines a light-receiving element with two PN junctions and a light-emitting confectionery was explained, but a photocoupler that combines photodiodes, phototransistors, thyristors, MOSs, GTOs, etc. It goes without saying that even devices are part of this technology.

Furthermore, in the embodiment of the present invention, the ring-shaped electrode formed to surround the luminescent confectionery formed on the first electrode can be formed in accordance with the intended shape of the light-receiving sensitivity region of the light-receiving element. Therefore, the shape of the translucent resin covering the LID can be made in the same way.

〔Effect of the invention〕

According to the present invention, the following excellent effects can be obtained.

(1) The light from the light-emitting element can be effectively guided to the light-receiving sensitivity region, and the light transmission efficiency is improved because the light is optically coupled sufficiently tightly.

(2) The accuracy of alignment between the light emitting element and the light receiving element can be improved, and mass productivity is good.

(3) The influence of adjacent light emitting elements can be reduced,
Orders due to malfunctions will be delayed.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a translucent insulating plate according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line A-A' in Fig. 1, and Fig. 3 is a photocoupler according to an embodiment of the present invention. It is a sectional view when it is mounted. 1 Transparent insulating substrate, 2 Transparent insulating substrate (two openings, 3 first electrode, 4 second electrode, 5 LED, 6 bonding wire, 7 first transparent resin, 8 second resin film, 9 stem, 10 light-receiving element, 11 light-receiving sensitivity area of light-receiving element, 12 fixing jig, 13.14 bonding wire, agent patent attorney Kensuke Chika (1 idiot)

Claims (1)

[Scope of Claims] (1) A semiconductor light-receiving element having a photosensitive area on a part of its surface, and an upper part of the semiconductor light-receiving element 4: A laminated light-transmitting insulating substrate, and a top of the light-transmitting insulating substrate. and a semiconductor light-emitting confectionery disposed opposite to the semiconductor light-receiving element, an electrode of the light-emitting element is formed on the light-transmitting insulating plate, and a first electrode is formed of a semiconductor light-emitting element. Metal wires are connected to second electrodes arranged so as to surround the light emitting element and electrically connected at the central part ζ2 thereof, and the electrodes at the bottom of the semiconductor light emitting element are arranged so as to surround them. transparent ml to the inside of the first electrode.
1. An optically coupled semiconductor device, characterized in that a resin is formed to cover a semiconductor light emitting element, and further, a second resin covers the second electrode. -+21 The optically coupled semiconductor device according to claim 1, wherein the first electrode is shared with one electrode of a plurality of semiconductor light-emitting confections. (3) The semiconductor photodetector element (4) is attached to a part of the translucent insulating plate.
The optically coupled semiconductor according to claim 1, wherein both the fixed light-transmitting insulating plate and the semiconductor light-receiving element are fixed using a jig having a common size. Device.