JPS60122151A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a method for manufacturing a laminate.

[Technical Background of the Invention and Problems Therewith J With the increasing demand for electronic devices, the demand for laminates as substrates for printed circuit boards 1 to wiring boards is increasing.

Conventionally, laminates are glass non-woven A11J, Una JJ.
J, is manufactured by laminating the specified number of sheets of prepreg made by impregnating +, i with a thermosetting synthetic resin composition and drying it to a semi-cured state, heating and pressing it and molding it into C. .

However, this method has the problem that since many voids are included in the prepreg, voids remain inside the formed laminate, resulting in insufficient electrical and mechanical properties. Ta.

(1) The control surface properties of the prepreg were insufficient.In addition to being easy to break, resin powder and glass 4J&l (l) were easily damaged.

Rough prepreg child 1] Because the compact is small and bulky, the number of sheets that can be charged between hot platens for laminate forming is small, making forming workability poor, and the thermal conductivity during forming is poor. There was a problem that the molding process was slow and took a long time.

[Objective of the Invention] The present invention has been made to solve these problems, and it is a method for efficiently producing a void-free laminate with good characteristics in a short time (manufacturing of a VI laminate that can be cut easily). It is our aim to provide a method.

[Summary of the Invention] That is, the method for manufacturing a laminate of the present invention is to compress a prepreg obtained by impregnating a base material with a thermosetting synthetic resin composition and drying it to a semi-cured state under heating through a heated L-less roll. After that, the required number of sheets are laminated and heated and pressed to form an integral carving.

Examples of the base material used in the present invention include glass vapor, glass nonwoven fabrics such as glass mats, paper, and the like.

The thermosetting synthetic resin composition to be impregnated into such a base material is mainly composed of thermosetting resins such as epoxy 4H resin, 71nol resin, polybutadiene resin, and polycoastyl resin. It is made by adding additives, fillers, pigments, flame retardants, etc., and further adding an organic solvent to dilute it to an appropriate viscosity.

In the present invention, C is obtained by applying these thermosetting synthetic resin compositions to a base material using a coating device, impregnating the base material, heating and drying at a temperature of 150 to 170°C until it becomes a semi-cured state, and then The obtained prepreg is compressed by passing through at least one pair of heated press rolls.

The heated press roll used in the present invention uses a heat source such as high-temperature steam, high-drought water, or high-frequency induction heating.
It is desirable to use a heated press roll heated and maintained at a temperature of 60 to 250°C.

Although only one pair of heating press rolls may be used, it is preferable to arrange a cooling roll at the subsequent stage and use the heating roll and cooling roll as a set. In particular, it is better to use these sets in multiple stages. desirable. The temperature of the cooling roll is preferably room temperature.

The prepreg compressed by hot press rolls has good flexibility and is difficult to break, and also has a high density and low bulk, so it can be moved between the hot plates during hot press molding more than before. Now you can load the number of sheets,
It is possible to efficiently produce a laminate with good properties and no voids.

Furthermore, since there are no voids inside the prepreg, the prepreg has good thermal conductivity and the time required for heating and pressure molding can be shortened.

[Embodiments of the invention] Examples of the present invention will be described below.

Example First, 4 parts of dicyandiamide and 0 parts of benzyldimethylamine were added to 100 parts by weight of Epicoat 1001 (hereinafter referred to as "parts").
．． An epoxy resin composition for impregnation was prepared by blending 2 parts of dimethylformamide and adding arene until it reached a suitable viscosity.

The density of this epoxy resin composition is 0.75! J/ai
! A glass non-woven fabric was impregnated with 70% by weight of resin gold, and then heated at 165°C for 2 hours. After drying in an oven for 6 minutes, the resulting prepreg was compressed through a pair of hot presses heated to a temperature of 0.+-.10 DEG C. The properties of the compressed prepreg thus obtained were measured. Next, 10 sets of 8 sheets of prepreg and copper foil with a thickness of 35μ on both sides were stacked, and these were placed between press hot plates at 170°C and 40
The material was heated and pressed for 90 minutes under the conditions of kg/cd and molded into a single piece, yielding a copper-clad laminate with a thickness of 1.6 mm.

Comparative Example 1 The properties of uncompressed Silipreg obtained in the same manner as in Example were measured, and then 10 sets of 8 sheets of this prepreg and 35 μm thick copper foil layered on both sides were stacked. It was sandwiched between press hot platens and heated and pressed under the same conditions as in the example to obtain a copper clad laminate having a thickness of 1.6 u.

Comparative Example 2 A prepreg obtained in the same manner as in Example was compressed through a cooling press roll maintained at a temperature of 25°C. After measuring the properties of the compressed prepreg obtained in this way, 8 sheets of this prepreg were stacked and copper foil with a thickness of 35 μm was layered on both sides to form a navy blue color. 10 sets of these were stacked and placed between press hot plates. A copper clad laminate of #1.6 was obtained by heating oil under the same conditions as in the example.

Next, the number of sheets of copper-clad laminates produced by 4F7 in Example, Comparative Example I Jj and Comparative Example 2 per 10 sheets dj J
The results of examining the number of prepreg sheets containing voids are shown in the table below, along with the measurement results of the characteristics of the prepregs mentioned above. In the table, the flexibility of the prepreg is expressed as the minimum winding diameter fJ at which no bending or damage occurs when a test piece cut to a size of 15 x 300 nm is wound.

(The following is a margin) [Effect of brightening] As is clear from the above examples, according to the present invention, a prepreg that is sufficiently compressed in the thickness direction, has no voids, and has high flexibility and strong mechanical strength. This makes it possible to efficiently produce a laminate with no voids and good properties.

Representative Patent Attorney Suyama (/[−

Claims (4)

[Claims] (1) A prepreg obtained by impregnating base 4A with a thermosetting synthetic resin composition and drying it to a semi-cured state is compressed under heat through a heated press roll, and then the required number of sheets are laminated and heated and pressed. Manufacture of laminates characterized by integral molding. (2) A method for manufacturing a six-layer board as set forth in claim 1, wherein the heated stone of the heated press roll has a temperature of 60 to 250°C. (3) Pass the press leg passed through the heated press roll through the cooling press roll.
- A method for manufacturing a laminate according to claim 1. (4) A method for producing a laminate according to item 3, in which the prepreg is heated and compressed by passing the prepreg through a cooling roll and heating rolls arranged in number t9.