JPS60121091A - Production of cut-out pattern by laser beam - Google Patents
Production of cut-out pattern by laser beamInfo
- Publication number
- JPS60121091A JPS60121091A JP58228216A JP22821683A JPS60121091A JP S60121091 A JPS60121091 A JP S60121091A JP 58228216 A JP58228216 A JP 58228216A JP 22821683 A JP22821683 A JP 22821683A JP S60121091 A JPS60121091 A JP S60121091A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- materials
- laser beam
- mask plate
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/007—Marks, e.g. trade marks
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、美術工芸的な切絵細工、あるいは染色絵句用
の何紙などの切抜きパターンの加工において、レーザー
光線を利用した切抜きパターンの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a cutout pattern using a laser beam in the processing of a cutout pattern of cutout paper for arts and crafts or dyed haiku paper.
近年、レーザー光線を利用して、機械的に且つ迅速に、
微細なパターンをカッティングする加工方法が実施され
ているが、紙又は、その他薄いイ3料を数枚重ね合わせ
、その上に金属製のパターンマスク板を置いて、マスク
板上側よりレーザー光線を走査して、材料を焼切って切
抜き加工する方法もその一方法である。この場合、マス
ク板と材料の確実な密着と固定が必要であり、重ね合わ
せたマスク板と材料とが、レーザー光線の走査中にズし
たり、あるいは、重ね合わせ材料の隙間より焼切りによ
り発生する煙が浸入しないようにする必要がある。In recent years, using laser beams, mechanical and rapid
A processing method has been implemented in which fine patterns are cut, but several sheets of paper or other thin materials are stacked together, a metal pattern mask plate is placed on top of the paper, and a laser beam is scanned from above the mask plate. One method is to burn out the material and cut it out. In this case, it is necessary to securely adhere and fix the mask plate and the material, and the overlapped mask plate and material may become misaligned during laser beam scanning, or burnout may occur from the gap between the stacked materials. It is necessary to prevent smoke from entering.
本発明は、マスク板を切抜き材料の上側と下側に重ね合
わせて、レーザー光線により切抜(加工方法であり、マ
スク板と材料とを確実に密着固定して切抜くことができ
、正確微細にして、品質の良い切抜きパターンを製造す
ることができるものである。The present invention is a processing method in which a mask plate is superimposed on the upper and lower sides of a cutout material and cut out using a laser beam.The mask plate and material can be securely fixed in close contact and cut out, and the cutout can be made accurately and finely. , it is possible to produce high-quality cutout patterns.
本発明は、紙又はその他薄い月利を所望のパターンに切
抜いたステンレス製の上下金属マスク板間に挾み、ビン
を前記マスク板の一端部に設けたピン穴に嵌合してマス
ク板の上下パターン見当を合わせて基盤面に載置固定し
、基盤下側に設けた電磁石の磁力により上側マスク板を
中間月利に圧着しながら、上側マスク板面にレーザー光
線を走査して、桐科面に微細パターンを切抜くことを特
徴とするレーザー光線による切抜きパターンの製造方法
である。The present invention involves inserting a piece of paper or other thin material into a desired pattern between upper and lower metal mask plates made of stainless steel, and fitting a bottle into a pin hole provided at one end of the mask plate. The upper and lower patterns are aligned and placed and fixed on the base surface, and while the upper mask plate is pressed to the intermediate position by the magnetic force of the electromagnet installed at the bottom of the base, a laser beam is scanned on the upper mask plate surface to form the Kirishina surface. This is a method for manufacturing a cutout pattern using a laser beam, which is characterized by cutting out a fine pattern.
本発明方法を更に詳細に説明すれば、第1図は、本発明
方法の一実施例の側面図であり、(1)は切抜きパター
ン製造基盤、(2)は上側金属マスク板、(3)は下側
金属マスク板、(4)は見当合わせビン、(5)は電磁
石、(6)は切抜き用洞料である。まず、予め所望の微
細パターンに形成された同じ型のステンレス金属マスク
板+21 、 (31(SUS403)の間に紙又はフ
ィルム等切抜き用材料(6)を適当枚数、例えば1枚乃
至複数枚挾み込み、該マスク板+21 、 G31のそ
れぞれ一端部に設けたビン穴+2(、L31に、見当合
わせ用ビン(4)を嵌合して、それぞれのマスク板(2
)。To explain the method of the present invention in more detail, FIG. 1 is a side view of an embodiment of the method of the present invention, in which (1) is a cutout pattern manufacturing base, (2) is an upper metal mask plate, and (3) is a cutout pattern manufacturing base. is the lower metal mask plate, (4) is the register bottle, (5) is the electromagnet, and (6) is the cutting material. First, an appropriate number of cutting materials (6), such as paper or film, are sandwiched between stainless metal mask plates of the same type (SUS403) that have been previously formed into a desired fine pattern, for example, one or more sheets. Insert the registration bottle (4) into the bottle hole +2 (L31) provided at one end of each of the mask plates +21 and G31.
).
(3)の切抜きパターン部(2a)と(3a)の重ね合
わぜ見当を合わせて、切抜き用基盤(1)上に載せ、見
当合わせ用ピン(4)の下側先端部を基盤(1)の嵌合
孔(白に嵌め込み固定する。Align the overlapping registration of the cutout pattern parts (2a) and (3a) in (3), place them on the cutout base (1), and insert the lower tip of the registration pin (4) onto the base (1). Fit into the fitting hole (white) and secure.
次に、基盤(1)下側の電磁石(5)を動作させて、そ
の磁力(破線)により上側マスク板(2)を下方に月−
着し、該マスク板(2)と林料(6)と下側マスク板(
:3)を密着させ、基盤(1)面に固定する。次に、第
2図レーザー光線を上側マスク板(2)面に対し矢印方
向に垂直下方に照射して、材料(6)を切抜きノ(ター
ンγ11z(2a)に同じ形状に切抜き、パターンを形
成する。Next, operate the electromagnet (5) on the lower side of the base (1) and use its magnetic force (dashed line) to move the upper mask plate (2) downward.
The mask plate (2), the forest material (6) and the lower mask plate (
:3) and fix it on the base (1) surface. Next, the laser beam shown in FIG. 2 is irradiated vertically downward in the direction of the arrow to the surface of the upper mask plate (2), and the material (6) is cut out in the same shape as the cutout (turn γ11z (2a)) to form a pattern. .
本発明方法は、切抜き用基盤(1)の下側に電磁石(5
)を取付け、上側マスク板(2)と月利((5)とを確
実に密着させることができ、上側マスク板(2)の細か
いパターンのステンレス製のマスク部分は、物理的に重
力によって押圧することな(、磁力によって均一に材料
面に圧着させることができるため、密着が正確であり、
操作が容易であるため、紙などの材料に品質の良い微細
な切抜き)くターンを多敬迅速に製造でき、金属マスク
板にレーザー光線を照射して形成する切抜きパターンの
製造顕著なる効果を発揮する。In the method of the present invention, an electromagnet (5
) can be attached to ensure that the upper mask plate (2) and the monthly rate (5) are in close contact, and the finely patterned stainless steel mask part of the upper mask plate (2) is physically pressed by gravity. (It is possible to press the material evenly to the material surface by magnetic force, so the adhesion is accurate,
Because it is easy to operate, it is possible to quickly produce high-quality fine cutouts on materials such as paper, and it is extremely effective in producing cutout patterns formed by irradiating laser beams onto metal mask plates. .
第1図及び第2図は、本発明方法の実施例側面である。 特許出願人 凸版印刷株式会社 代表者 鈴 木 和 夫。 、I’ 、、’l。 1、 2ノ 1 and 2 are side views of an embodiment of the method of the present invention. patent applicant Toppan Printing Co., Ltd. Representative Kazuo Suzuki. ,I',,'l. 1, 2 no
Claims (1)
ンレス製の上下金属マスク板間に挾み込み、ピンを前記
マスク板の一端部に設けたビン穴に嵌合してマスク板の
上下パターン見当を合わせて基盤面に載置固定し、基盤
下側に設けた電磁石の磁力により上側マスク板を中間材
料に圧着しながら、上側マスク板面にレーザー光線を走
査して、!A利面に微細パターンを切抜くことを特徴と
するレーザー光線による切抜きパターンの製造方法。Paper or other thin material is inserted between upper and lower stainless steel metal mask plates cut out in the desired pattern, and a pin is fitted into a pin hole provided at one end of the mask plate to register the upper and lower patterns of the mask plate. The upper mask plate is placed and fixed on the substrate surface, and while the upper mask plate is pressed onto the intermediate material by the magnetic force of the electromagnet installed on the underside of the substrate, a laser beam is scanned on the upper mask plate surface. A method for producing a cutout pattern using a laser beam, which is characterized by cutting out a fine pattern on the advantageous side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58228216A JPS60121091A (en) | 1983-12-02 | 1983-12-02 | Production of cut-out pattern by laser beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58228216A JPS60121091A (en) | 1983-12-02 | 1983-12-02 | Production of cut-out pattern by laser beam |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60121091A true JPS60121091A (en) | 1985-06-28 |
Family
ID=16872997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58228216A Pending JPS60121091A (en) | 1983-12-02 | 1983-12-02 | Production of cut-out pattern by laser beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60121091A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02299792A (en) * | 1989-05-12 | 1990-12-12 | Amada Co Ltd | Laser beam machining method and laser beam machine |
US6144011A (en) * | 1996-02-23 | 2000-11-07 | Spectrum Technologies Limited | Laser marking apparatus and methods |
WO2004114387A1 (en) * | 2003-06-20 | 2004-12-29 | Sumitomo Electric Industries, Ltd. | Method for producing semiconductor single crystal wafer and laser processing device used therefor |
-
1983
- 1983-12-02 JP JP58228216A patent/JPS60121091A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02299792A (en) * | 1989-05-12 | 1990-12-12 | Amada Co Ltd | Laser beam machining method and laser beam machine |
US6144011A (en) * | 1996-02-23 | 2000-11-07 | Spectrum Technologies Limited | Laser marking apparatus and methods |
WO2004114387A1 (en) * | 2003-06-20 | 2004-12-29 | Sumitomo Electric Industries, Ltd. | Method for producing semiconductor single crystal wafer and laser processing device used therefor |
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