JPS60113655U

JPS60113655U - Multi-color light emitting semiconductor device

Info

Publication number: JPS60113655U
Application number: JP56484U
Authority: JP
Inventors: 根来　立彦; 進武田
Original assignee: Stanley Electric Co Ltd
Current assignee: Stanley Electric Co Ltd
Priority date: 1984-01-09
Filing date: 1984-01-09
Publication date: 1985-08-01

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

′　　第１図は従来の発光半導体装置の一例を示すもの
でイは側面図、口は平面図、ハは回路図、第２図は同じ
く他の例を示しイは側面図、口は平面図、ハは回路図、
第３図はリードフレームにレンズ部をモールドした状態
を示す一部平面略図、第４図は複数色発光半導体装置の
第１の実施例の中　　−心部拡大平面図、第５図は同じ
く側面図、第６図は同じく回路図、第７図は第２の実施
例を示す中心部拡大平面図、第８図は同じく回路図、第
９図は第３の実施例を示す中心部拡大平面図、第１．、
ｊ１図は同じく回路図、第１１図は上記各実施例の装置
を示す斜視図である。６・・・レンズ部、２１・・・リードフレーム、２２゜
２３．２４，２５・・・リード端子、２２ａ、２３ａ？
　　２４　ａ、　　２５　ａ・・・チップ載置面、２６
，２？、２８．２９・・・発光チップ、２６ａｗ２７ａ
＊２８ａ、２９ａ・・・表面電極。 □１−' Figure 1 shows an example of a conventional light emitting semiconductor device, where A is a side view, the opening is a plan view, and C is a circuit diagram, and Figure 2 is another example, where A is a side view and the opening is a plan view. , C is the circuit diagram,
Fig. 3 is a partially schematic plan view showing a state in which a lens part is molded onto a lead frame, Fig. 4 is an enlarged plan view of the center part of the first embodiment of a multi-color light emitting semiconductor device, and Fig. 5 is a side view of the same. 6 is a circuit diagram, FIG. 7 is an enlarged plan view of the center showing the second embodiment, FIG. 8 is an enlarged plan view of the center showing the third embodiment, and FIG. 9 is an enlarged plan view of the center showing the third embodiment. Figure 1. ,
FIG. j1 is a circuit diagram as well, and FIG. 11 is a perspective view showing the apparatus of each of the above embodiments. 6... Lens portion, 21... Lead frame, 22°23.24, 25... Lead terminal, 22a, 23a?
24 a, 25 a...chip mounting surface, 26
,2? , 28.29...Light emitting chip, 26aw27a
*28a, 29a... surface electrodes. □1-

Claims

[Scope of utility model registration request]

Two pairs of leads having a chip mounting surface at the tip, the chip mounting surfaces being located on the same plane, and one chip mounting surface and the other chip mounting surface facing each other. A multi-color light emitting semiconductor device comprising a frame, four chips emitting light of different colors on each of the chip mounting surfaces, and a light emitting part formed by integrally molding a lens part with a translucent resin.