JPS5996923U - Daylay line - Google Patents
Daylay lineInfo
- Publication number
- JPS5996923U JPS5996923U JP17803582U JP17803582U JPS5996923U JP S5996923 U JPS5996923 U JP S5996923U JP 17803582 U JP17803582 U JP 17803582U JP 17803582 U JP17803582 U JP 17803582U JP S5996923 U JPS5996923 U JP S5996923U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- delay line
- ground conductor
- inductor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Filters And Equalizers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のディレィラインの構造を概略的に示す図
、第２図は本考案に係るディレィラインの電気回路接続
図、第３図は本考案に係るディレィラインの正面部分断
面図、第４図は同じく側面部分断面図、第５図は同じく
外装樹脂を省略して ′示した平面図、第６図はＩＣパ
ッケージのピン配置構造を示す平面図、第７図はリード
フレームの配置構造を示す展開図である。
１３・・・・・・回路基板、１，４・・・・・・、イン
ダクタ、１５・・・・・・コンデンサ、 １７−−−−
−−接地導体パターン、 １８〜２３・・・・・
・ホット側の導体パターン。
ノ 、Fig. 1 is a diagram schematically showing the structure of a conventional delay line, Fig. 2 is an electric circuit connection diagram of the delay line according to the present invention, Fig. 3 is a front partial sectional view of the delay line according to the present invention, Figure 4 is a side partial sectional view, Figure 5 is a plan view with the exterior resin omitted, Figure 6 is a plan view showing the pin arrangement structure of the IC package, and Figure 7 is the lead frame arrangement structure. FIG. 13...Circuit board, 1,4...Inductor, 15...Capacitor, 17----
--Ground conductor pattern, 18-23...
・Hot side conductor pattern. of ,
Claims (2)
のディレィラインにおいて、回路基板の一面上の中間部
に接地導体パターンを形成すると共に、該接地導体パタ
ーンの両側にホットア導体パターンを形成し、前記イン
ダクタは前記後、 地導体パターンの両側の前記ホ
ット側導体パターン間に接続し、前記コンデンサは前記
接地導体パターンとその両側に配置された前記ホット側
の導体パターンの一つとの間に接続したことを特徴とす
るディレィライン。(1) In a lumped constant type delay line that combines a capacitor and an inductor, a ground conductor pattern is formed in the middle part on one surface of the circuit board, and hot conductor patterns are formed on both sides of the ground conductor pattern, and the The inductor is then connected between the hot-side conductor patterns on both sides of the ground conductor pattern, and the capacitor is connected between the ground conductor pattern and one of the hot-side conductor patterns disposed on both sides thereof. A delay line featuring
基板の相対する両端に端部電極を有するチップ部品で構
成したことを特徴とする実用新案登録請求の範囲第１項
に記載のディレィライン。(2) The delay line according to claim 1, wherein the inductor and the capacitor are formed of chip components having end electrodes at opposing ends of a flat substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17803582U JPS5996923U (en) | 1982-11-25 | 1982-11-25 | Daylay line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17803582U JPS5996923U (en) | 1982-11-25 | 1982-11-25 | Daylay line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5996923U true JPS5996923U (en) | 1984-06-30 |
Family
ID=30386639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17803582U Pending JPS5996923U (en) | 1982-11-25 | 1982-11-25 | Daylay line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5996923U (en) |
-
1982
- 1982-11-25 JP JP17803582U patent/JPS5996923U/en active Pending
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