JPS5990546A - Endoscope - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This invention provides solid 11Ii8! Endoscopes using elements (related to this).

An endoscope generally takes a direct view of the subject through an image guide using an optical m-dark bundle or the like. ! However, endoscopes have also been developed that use solid-state imaging devices to obtain images of objects without using such image guides.

Of the direct-view types that use conventional solid-state image sensors? 1 mirror has a structure in which light guides, air and water pipes, and conduit paths for forceps and treatment tools run around the outer periphery of the package that holds the solid-state image sensor, which is arranged perpendicularly to the longitudinal direction of the endoscope tip. Ta.

However, it is difficult to miniaturize the package that holds the solid-state 1Iiii image element and the solid-state 1IiI image element in one minute using current technology, and the structure in which various tubes pass around the outer periphery of the package means that the tip of the package as a whole is The diameter of the tube had become too large, causing pain to the patient during insertion.

SUMMARY OF THE INVENTION An object of the present invention is to provide an endoscope using a solid element 18 whose tip has a small outer diameter.

Embodiments of the present invention will be described below with reference to the drawings. In the figure, 1 is an endoscope, 2 is the insertion part of the endoscope 1, and 3 is the distal end. Also, 4 is a light guide using optical fiber etc., and this light guide 4 is connected via a connector 5. Light source @6
It is designed to be connected to. 7 is a light source lamp.

In the distal end portion 3, a package 8 made of an X-ray shielding material such as a lead alloy is supported inside a sheath 3' serving as the outermost wall. This package 8 has a mounting hole 9 for inserting and fixing the tip of the light guide 4, and also has an imaging hole 10 parallel to the mounting hole 9.

An objective lens group 11 is attached to the front of the imaging hole 10. 12 is a spacer ring, and 13 is a mounting ring. A solid-state thermal imaging element 14 is housed at the imaging position of the objective lens group 11. This solid-state thermal imaging element 14 is fixed between an insulating plate 15 and an annular holding plate 16.

17 is an output signal line, and the outside of this signal line 17 is covered with a shield line 18.

The shield 11!1B is electrically connected to the package 8.

Further, the output signal @ line 17 is connected to an image reproducing circuit 19 provided on the operating side of the insertion section 2. 20 is a thermal imager circuit, and 211 is an upper cathode ray tube monitor.

In the endoscope configured as described above, illumination light from the light source lamp 7 travels through the lights 1 to 4 and is led out from the output end of the distal end portion 3 to illuminate a subject within the body cavity. The image of the object Δ is then transmitted to the solid-state thermal imaging element 14 via the objective lens group 11.
The image is sequentially scanned by the image element control circuit 20, converted into pixel signals, and sent to the image reproduction circuit 19 via the output signal line 17. And image reproduction circuit 1
Then, horizontal and vertical synchronization signals for the CRT monitor 21 are generated by signals from the 11atip element control circuit 20, and pixel signals are input to the CRT monitor 21 as brightness signals to display the image of the subject. Reproduce.

In the endoscope according to the present invention, since the light guide is inserted into the package of the solid-state Ifi imager, the light guide is inserted into the outer periphery of the package. The diameter can be made smaller. Further, since the pan cage itself also serves as a holding member for the lie 1 and the lie 1, the internal structure is simplified.

Well, since the package is made up of X-ray radiation,
When using an X-ray imaging device, the operation of the solid-state thermal imaging device is not hindered. Furthermore, the shielding effect of the shield wire 18 that covers the output line 11 17 eliminates the noise electric field generated by the X-ray imaging device, so that even under X-ray fluoroscopy, the inside image is always clear. 4IA mirror image is obtained.

[Brief explanation of the drawing]

The fruit of this invention fM lsi from the drawing t! 1 is a schematic illustration of an endoscope. 1... Endoscope, 2... Insertion section, 8... X-ray illumination
lli body, 14... Solid-state imaging probe, 17... Output signal @ line, 18... Sea J red line, A... 1 subject.

Claims (1)

[Claims] A sheath as the outermost wall at the distal end of the endoscope; an image optical system having an optical axis substantially parallel to the longitudinal direction of the sheath; a package supported inside the sheath and accommodating the solid-state image sensor; and a hole communicating with the end face of the package from one end face to the end face of the package. and a guide having an end that is inserted through the mounting hole and reaches the end surface of the sheath indicated by L.