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JPS5972124A - Film condenser - Google Patents

Film condenser

Info

Publication number
JPS5972124A
JPS5972124A JP18314882A JP18314882A JPS5972124A JP S5972124 A JPS5972124 A JP S5972124A JP 18314882 A JP18314882 A JP 18314882A JP 18314882 A JP18314882 A JP 18314882A JP S5972124 A JPS5972124 A JP S5972124A
Authority
JP
Japan
Prior art keywords
film
aluminum foil
deposited
aluminum
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18314882A
Other languages
Japanese (ja)
Inventor
望月 秀晃
宗野 隆一
徹 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18314882A priority Critical patent/JPS5972124A/en
Publication of JPS5972124A publication Critical patent/JPS5972124A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、コーティングしたアルミニウム箔と、蒸着し
たフィルムとによって構成さnたフィルムコンデンサー
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a film capacitor constructed from a coated aluminum foil and a vapor deposited film.

従来例の構成とその問題点 電気、電子機器の小型化競争が激烈な今日、機器を構成
する各電子部品に対する小型化の要求は非常に強いもの
である。電子部品の高密度実装を行なうためには、部品
は小型であると同時に、実装時のハンダづけ温度に耐え
る高温安定性をも必要とさnる。今日の各種電子部品の
中で、小型化。
2. Description of the Related Art Conventional Structures and Their Problems Today, the competition for miniaturization of electric and electronic equipment is fierce, and there is a strong demand for miniaturization of each electronic component that constitutes the equipment. In order to perform high-density mounting of electronic components, the components need to be small and at the same time have high-temperature stability to withstand the soldering temperature during mounting. Among today's various electronic components, miniaturization.

耐熱化への対応がもっとも遅nているのは、プラスチッ
クフィルムコンデンサーといえよう。
It can be said that plastic film capacitors have been the slowest to respond to improvements in heat resistance.

従来のフィルムコンデンサーは、第1図に示すようにプ
ラスチックフィルム1,1′上にアルミニウムを蒸着し
て2,2′のような電極を形成し、こnら2枚の重すり
をわずかずつずらせで巻き取った上で、巻回したフィル
ムの両側面に金属溶射(以後、こn f、g)メタリコ
ンと呼ぶ)して、蒸着電極2,2′とメタIJコンによ
る電極3,3′とを接続し、こ扛にリード線4.4”i
接続するという構造か、モジくは、第1図の蒸着電極の
かわりに、2枚ノアルミニウム箔を用い、2枚のアルミ
ニウム箔と2枚のプラスチックフィルムと全交互に重ね
て巻き取ったような構造を有していた。
In conventional film capacitors, as shown in Figure 1, aluminum is vapor-deposited on plastic films 1 and 1' to form electrodes 2 and 2', and these two weights are slightly shifted. After winding up the film, metal spraying (hereinafter referred to as metallization) is applied to both sides of the wound film to form vapor-deposited electrodes 2 and 2' and metal IJ contact electrodes 3 and 3'. Connect the lead wire 4.4"i to this
The structure is similar to that of connecting, but instead of the vapor-deposited electrode in Figure 1, two sheets of aluminum foil are used, and two sheets of aluminum foil and two sheets of plastic film are overlapped alternately and rolled up. It had a structure.

上述した二種類の構造のうち、前者は高い電気容量の領
域では有効であるものの、10,000PI”以下の低
容量域では生産性が悪く量産化しにくいうえに、ハンダ
イ」け時の250〜260℃という高温では特性が著し
るしく劣化してしまう。そのため、低容量域においては
主おして後者のアルミニウム箔を用いたコンデンサーが
主流であった。
Of the two types of structures mentioned above, the former is effective in the high capacitance range, but in the low capacitance range of 10,000 PI" or less, the productivity is poor and it is difficult to mass produce, and the 250 to 260 At temperatures as high as ℃, the characteristics deteriorate significantly. Therefore, in the low capacity range, capacitors using the latter type of aluminum foil were the mainstream.

しかしながら、アルミニウム箔を2枚と、フィルムを2
枚同時に巻き取る方法では小型化にも限度があり、かつ
、ハンダづけ時にはこのタイプでも大きな特性劣化は避
は難いものであった。
However, two pieces of aluminum foil and two pieces of film were used.
There is a limit to miniaturization with the method of winding up the sheets at the same time, and even with this type, it was difficult to avoid large characteristic deterioration during soldering.

発明の目的 本発明はこtCらの諸欠点全改善したもので、主として
低容量域において高性能のフィルムコンデンザーを提供
するものである。
OBJECTS OF THE INVENTION The present invention completely eliminates these drawbacks and provides a high-performance film capacitor mainly in the low capacity range.

発明の構成 本発明のフイルムコンデンザーは、一方の面に耐熱性プ
ラスチックの誘電体層を形成した短(It)状のアルミ
ニウム箔と、一方の面にアルミニウムを蒸着し、他方の
面には何も設けないかあるいは巾方向に一定の巾を残し
てアルミニウムを蒸着した短冊状の耐熱性プラスチック
フィルムとを、前記アルミニウム箔の他方の面と前記耐
熱性プラスチックの他方の面とが向い合うように、かつ
前記耐熱性プラスチックの他方の面の未蒸着部が露出す
るように重ね合わせて巻回し、得ら2′l、た巻回体の
両側面に金属電極層を形成したものである。
Structure of the Invention The film condenser of the present invention consists of a short (It)-shaped aluminum foil on which a heat-resistant plastic dielectric layer is formed on one surface, aluminum vapor-deposited on one surface, and a layer of aluminum foil on the other surface. A heat-resistant plastic film in the form of a rectangular heat-resistant plastic film with aluminum vapor-deposited, leaving a certain width in the width direction, is placed so that the other surface of the aluminum foil and the other surface of the heat-resistant plastic face each other. , and the heat-resistant plastic is wound so as to be overlapped so that the undeposited part on the other side is exposed, and metal electrode layers are formed on both sides of the resulting wound body.

実施例 以下、本発明の一実施例を図面を用いて説明する。第2
図には本発明の一実施例の展開斜視図を、また第3図に
は第2図中のA −A’の部分で切断した積層構造の断
面金示す。本発明のフイルムコンデンザーでは、アルミ
ニウム箔5の」二に誘電体層6をコーティングし、プラ
スチックフィルム7のアルミニウム箔5と接触しない側
には、フィルムの全面に電極となる金属を蒸着してアル
ミニウム箔に対向する電極8となす。一方、プラスチッ
クフィルム了のアルミニウム箔5と接触する側には、第
3図の断面図に示すようにアルミニウム箔5と重なりあ
う部分に蒸着アルミニウム電極8′を設ける場合と、第
4図の断面図に示すようにアルミニウムを蒸着しない場
合の二通りの構造があり、いず几も本発明に含″!、l
t′Lる。なお、第3図のようにプラスチックフィルム
の両面にアルミニラムラ蒸着する場合には、プラスチッ
クフィルムとアルミニウム箔との重なり部分以外は未蒸
着部分9が是非必要で、未蒸着部分9がないと巻回後に
側面から電極音引き出す際ショートしてし捷う。さて、
今、アルミニウム箔6上にコーティングした誘電体層6
による電気容量ヲCムとし、プラスチックフィルム了に
よる電気容量をC,とすると、本発明のフイルムコンデ
ンザーの一定、気容量Coは、Co−(1−k)・(C
ム+Cjp )で求めらnる。第3図のようにプラスチ
ックフィルムの両面に蒸着した場合には、k=oであり
、一方、第4図のように片面のみの蒸着ではkは0より
わずかに太キナ値となる。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. Second
The figure shows a developed perspective view of an embodiment of the present invention, and FIG. 3 shows a cross-section of the laminated structure taken along the line A-A' in FIG. In the film condenser of the present invention, a dielectric layer 6 is coated on the second side of the aluminum foil 5, and on the side of the plastic film 7 that does not come into contact with the aluminum foil 5, a metal serving as an electrode is deposited on the entire surface of the film to form an aluminum layer. An electrode 8 is formed facing the foil. On the other hand, on the side of the plastic film that contacts the aluminum foil 5, there are two cases in which a vapor-deposited aluminum electrode 8' is provided in a portion overlapping with the aluminum foil 5 as shown in the cross-sectional view of FIG. As shown in the figure, there are two types of structures in which aluminum is not vapor-deposited, both of which are included in the present invention.
t'Lru. In addition, when performing uneven aluminum vapor deposition on both sides of a plastic film as shown in Fig. 3, an undeposited part 9 is absolutely necessary except for the overlapped part of the plastic film and aluminum foil. Later, when I tried to extract the electrode sound from the side, I shorted it out and lost it. Now,
Now, the dielectric layer 6 coated on the aluminum foil 6
Let C be the electric capacitance of the plastic film, and C is the electric capacitance of the plastic film.
It can be found by (M+Cjp). When vapor deposition is performed on both sides of the plastic film as shown in FIG. 3, k=o, whereas when vapor deposition is performed on only one side as shown in FIG. 4, k becomes a kina value slightly larger than 0.

このkは、巻回時のアルミニウム箔5とプラスチックフ
ィルム7との間にでさる空隙率である。
This k is the porosity created between the aluminum foil 5 and the plastic film 7 during winding.

本発明のフィルムコンデンサー全構成する材料は、アル
ミニウム箔、誘電体皮膜、耐熱性フィルム、溶射金属で
あり、以下にこ1.ら全説明する。
The materials constituting the entire film capacitor of the present invention are aluminum foil, dielectric film, heat-resistant film, and sprayed metal. I will explain everything.

アルミニウム箔は、誘電体層のベース材であり、かつ一
方の電極どもなりうる。暉さは素子の形状に直接関係す
るためできるだけ薄い方が好ましく、作業性のうえから
も40μか1以下が適している。
The aluminum foil is the base material of the dielectric layer and can also serve as one of the electrodes. Since the thickness is directly related to the shape of the element, it is preferable that the thickness be as thin as possible, and from the viewpoint of workability, a thickness of 40 μm or less is suitable.

誘電体層は、溶剤にとかして塗布するか、溶融押し出し
法によシアルミニウム箔上に形成するのがよく、拐料は
、ポリザルホン、ポリフェニレンオキシド、ポリエーテ
ルザルホン、ポリイミド、弗素系樹脂などの耐熱性熱可
塑付樹脂もしくは、エポキシ樹脂、ジアリルフタレート
樹脂、アクリル樹脂、架橋型ポリブタジェンなどの熱硬
化性樹脂のうちの一つもしくはこnらの組み合わせを用
いる。耐熱性フィルムとしては、上記した耐熱性熱可塑
性樹脂からなるフィルムを用いる。最後に、溶射する金
属材としては、導電性がよく溶射しゃすいAl、 Zn
、 Niなどのうちの一つもしくはそ几らの組み合わせ
を用いる。このようにして巻回さnたフィルムは、蒸着
していない耐熱性フィルムを数回巻き重ね、高温下に加
圧して自己融着させて巻きほぐfLを防止した上、リー
ド線を引き出して外装することにより本発明のフィルム
コンデンサーは完成する。
The dielectric layer is preferably formed on the sialuminum foil by dissolving it in a solvent or by melt extrusion. One or a combination of heat-resistant thermoplastic resins, thermosetting resins such as epoxy resins, diallyl phthalate resins, acrylic resins, and crosslinked polybutadienes is used. As the heat-resistant film, a film made of the above-mentioned heat-resistant thermoplastic resin is used. Finally, the metal materials to be thermally sprayed include Al and Zn, which have good conductivity and are easy to thermally spray.
, Ni, etc. or a combination thereof. The film wound in this way is made by wrapping a heat-resistant film that has not been vapor-deposited several times, applying pressure under high temperature to self-fuse to prevent unwinding, and then pulling out the lead wire. By packaging, the film capacitor of the present invention is completed.

本発明の特長を整理すると、ノ・ンダ耐熱テストに耐え
る素子ができる、巻き取りが容易であり生産性がn1る
、低容量域で素子の小型化が図nる、などである。
The features of the present invention can be summarized as follows: an element that can withstand the Nonda heat resistance test, easy winding and productivity, and miniaturization of the element in a low capacity range.

以下、本発明の更に具体的な実施例を示す。More specific examples of the present invention will be shown below.

(実施例1) 12μのアルミニウム箔上に、ポリエーテルスルホンを
2μの厚みにコーティングし、こ扛を6朋巾で10t1
π長の短冊状に切り出した。一方、ポリエーテルスルホ
ンの3μ厚で巾6朋のフィルムの片面には、全面にアル
ミニウムを200〜500人蒸着し、もう一方の面には
、−辺に1Mの巾のマージン部を形成しつつ、4朋巾に
200〜500人蒸着し、こIf”L’1i11c1n
長の短冊状に切り出した。
(Example 1) Polyether sulfone was coated on a 12μ aluminum foil to a thickness of 2μ, and the foil was coated with a thickness of 6 mm and 10t1.
It was cut into a strip of π length. On the other hand, on one side of a polyether sulfone film with a thickness of 3 μm and a width of 6 mm, 200 to 500 aluminum was vapor-deposited on the entire surface, and on the other side, a margin part with a width of 1 M was formed on the - side. , 200 to 500 people were deposited in a 4-width area.
Cut it into long strips.

次に第3図に示すように、プラスチックフィルム7とア
ルミニウム箔5とが4間の巾でかつアルミニウム箔の塗
布さnていない面とマージン部ヲ有するフィルム面とが
向き合って重なり合うように各1間づつずらせつつ、巻
き始めの端面をそろえて巻回した。巻回後、未蒸着のポ
リエーテルスルホン膜を2〜3回巻き、加熱したコテで
膜同志を自己融着させた。巻き上ったコイルの両側面に
亜鉛とニッケルの合金を溶射し、さらにその上から2本
のリード線を溶接し、そnぞnアルミニウム箔、蒸着電
極とに接続し、エポキシ樹脂で外装した。そのようにし
て出来上った素子の特性を後掲の表のAIK示す。
Next, as shown in FIG. 3, the plastic film 7 and the aluminum foil 5 are placed one on top of the other with a width of 4 mm, and the surface on which the aluminum foil is not coated and the surface of the film with the margin part face each other. The winding was performed by shifting the length of the winding, aligning the end faces at the beginning of the winding. After winding, the undeposited polyether sulfone film was wound two to three times, and the films were self-fused together using a heated iron. A zinc and nickel alloy was sprayed on both sides of the wound coil, and two lead wires were welded on top of that, connected to aluminum foil and vapor-deposited electrodes, and then covered with epoxy resin. . The characteristics of the device thus produced are shown in the AIK table below.

(実施例2) イ餉例1において、片面のみ全面に蒸着したポリエーテ
ルスルホンの3μの膜を用い、アルミニウム箔の塗布さ
nていない面と、プラスチックフィルムの蒸着さnてい
ない面が向きあうようにし、実施例1と同じ手法で、同
一寸法のアルミニウム箔、プラスチックフィルムを用い
た素子を製造した。その特性を表の52に示す。
(Example 2) In Example 1, a 3 μm film of polyether sulfone was deposited on only one side, and the surface on which the aluminum foil was not coated and the surface on which the plastic film was not deposited faced each other. Using the same method as in Example 1, an element using aluminum foil and plastic film of the same dimensions was manufactured. Its characteristics are shown in Table 52.

(実施例3) 12μのアルミ−ラム苗土に、ポリフェニレンオキシド
を2μの厚さにコーティングし、一方、3μ厚のポリフ
ェニレンオキシドのフィルムラ用い、実施例1と同様の
手法で素子を製造した。その特性を表の53に示す。
(Example 3) A device was manufactured in the same manner as in Example 1 by coating polyphenylene oxide to a thickness of 2μ on 12μ aluminum-lamb seedling soil, and using a polyphenylene oxide film layer having a thickness of 3μ. Its characteristics are shown in Table 53.

(実施例4) 12μのアルミニウム箔上に、ジアリルフタレートを2
μ厚に塗布し、一方、3μ厚のポリスルホンのフィルム
を用い、実施例1と同一の手法で素子を製造した。その
特性を表の蔦4に示す。
(Example 4) Diaryl phthalate was placed on a 12μ aluminum foil for 2 hours.
A device was manufactured in the same manner as in Example 1 using a polysulfone film having a thickness of 3 μm. Its characteristics are shown in Table 4.

(実施例5) 12μのアルミニウム箔上に環化ポリブタジェン(日本
合成ゴム■、商品名CBR−Mcao1)を2μ厚に塗
布し、こf″Lを紫外線の照射により硬化させた。一方
、ポリスルホンの3μ厚のフィルムを用い実施例1と同
一の手法で素子を製造した。その特性を表のf5に示す
(Example 5) Cyclized polybutadiene (Japan Synthetic Rubber ■, trade name CBR-Mcao1) was applied to a thickness of 2 μm on a 12 μm aluminum foil, and the film f″L was cured by irradiation with ultraviolet rays. A device was manufactured using a 3μ thick film in the same manner as in Example 1. Its characteristics are shown in f5 in the table.

(従来例) 12μのアルミニウム箔を5朋巾、IQrJn長に2枚
切り出し、一方、ポリエチレンテレフタレートの厚さ4
μ、巾6朋、長さ11cmのフィルムを同じく2枚切り
出した。こ几らを第5図に示すようにアルミニウム箔1
0+  フィルム11.アルミニウム箔10’、  フ
ィルム11′のようにアルミニウム箔1oと10′とを
1Mずつづらせて重ね合わせ、4枚同時に巻きとったの
ち、巻回コイルの両側面に金属溶射し、アルミニウム箔
10.10’に対して別々に電気的接続をとったうえで
、そnぞnにリード線を溶接し、外装した。その従来例
の素子の特性を表に示す。
(Conventional example) Two pieces of 12μ aluminum foil are cut out to a width of 5mm and a length of IQrJn, and on the other hand, a piece of polyethylene terephthalate with a thickness of 4mm is cut out.
Two pieces of film each having a width of 6 mm and a length of 11 cm were cut out. As shown in Figure 5, the aluminum foil 1
0+ Film 11. Aluminum foils 1o and 10' are stacked one on top of the other in a 1M stack, like aluminum foil 10' and film 11', and the four sheets are wound at the same time. Metal spraying is applied to both sides of the wound coil to form aluminum foil 10. 10', and then welded lead wires to each of them and covered them. The characteristics of the conventional device are shown in the table.

(参考例) 胃へ3u、由5篇肩^ボ11スルホンのw面F−A闘の
1]でアルミニウムを蒸着1長さ10αのフィルムを2
枚切り出した。ζ五らを第1図に示すように、1問づつ
ずらせながら巻き取った。両側面に金属を溶射してのち
リード線を引き出し外装した。このようにして製造した
素子の特性を表に示す。
(Reference example) 3 u to the stomach, 1 to the shoulder, 1 to the w surface of 11 sulfones, and 1 to 1 of the sulfone w surface.
I cut it out. As shown in Figure 1, the ζ5, etc. were rolled up while shifting one question at a time. After spraying metal on both sides, the lead wires were pulled out and packaged. The characteristics of the device thus manufactured are shown in the table.

なお、表に掲載のノ・ンダ酬熱テストは、270℃のノ
・ンダ浴中に10秒間浸漬することによって行なった。
In addition, the heat exchange test listed in the table was conducted by immersing the sample in a 270° C. bath for 10 seconds.

(月、下46) 発明の効果 上記表から明らかなように、本発明のフィルムコンデン
サーは、従来例よりも単位容積当りの容量が大きく、素
子の小型化が図ら几ている。同時に、・・ンダ配熱テス
トの前後で容積の変化することがなく、寸だショート状
態になることもないなど、従来のものに比してきわめて
優nf?:、特徴を有している。
(Monday, 2013-46) Effects of the Invention As is clear from the above table, the film capacitor of the present invention has a larger capacity per unit volume than the conventional example, and the device is more compact. At the same time, the volume does not change before and after the heat distribution test, and there is no short circuit, making it extremely superior to conventional products. :, has the characteristics.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のフィルムコンデンサーの斜視図、第2図
は本発明のフィルムコンデンサーの一実施例の展開斜視
図、第3図はプラスチックフィルムの両面にアルミニウ
ムを蒸着した一実施例を示す断面図、第4図はプラスチ
ックフィルムの片面にアルミニウムを蒸着した一実施例
を示す断面図、第5図は従来のフィルムコンデンサーの
断面図である。 3・・・・・・溶射金属電極、6・・・・・・アルミニ
ウム箔、6・・・・・・誘電体層、了・・・・・・プラ
スチックフィルム、8.8′・・・・・・蒸着電極。
Fig. 1 is a perspective view of a conventional film capacitor, Fig. 2 is a developed perspective view of an embodiment of the film capacitor of the present invention, and Fig. 3 is a sectional view showing an embodiment in which aluminum is vapor-deposited on both sides of a plastic film. 4 is a sectional view showing an embodiment in which aluminum is vapor-deposited on one side of a plastic film, and FIG. 5 is a sectional view of a conventional film capacitor. 3...Sprayed metal electrode, 6...Aluminum foil, 6...Dielectric layer, End...Plastic film, 8.8'... ...Vapour-deposited electrode.

Claims (2)

【特許請求の範囲】[Claims] (1)一方の面に耐熱性プラスチックの誘電体層を形成
した短冊状のアルミニウム箔と、一方の面にアルミニウ
ムを蒸着し、他方の面には何も設けないかあるいは巾方
向に一定の巾を残してアルミニウムを蒸着した短冊状の
耐熱性プラスチックフィルムとを、前記アルミニウム箔
の他方の面と前記耐熱性プラスチックフィルムの他方の
面とが向い合うように、かつ前記耐熱性プラスチックフ
ィルムの他方の面の未蒸着部が露出するように重ね合わ
せて巻回し、得らnた巻回体の両側面に金属電極層を形
成したことを特徴トスるフィルムコンデンサー。
(1) A strip of aluminum foil with a heat-resistant plastic dielectric layer formed on one side, and one side with aluminum vapor-deposited and the other side with nothing or a constant width in the width direction. A strip-shaped heat-resistant plastic film on which aluminum has been vapor-deposited, leaving a A film capacitor characterized in that the film capacitors are stacked and wound so that the undeposited portions of the surfaces are exposed, and metal electrode layers are formed on both sides of the resulting wound body.
(2)耐熱性プラスチックが、ポリサルホン、ポリエー
テルザルホン、ポリイミド、弗素系樹脂。 エポキシ樹脂、ジアリルフタレート樹脂、熱硬化型アク
リル樹脂、架橋型ポリブタジェンのうちの一つもしくは
そnらの組み合わせであることを特徴とする特許請求の
範囲第(1)項記載のフィルムコンデンサー。
(2) Heat-resistant plastics include polysulfone, polyethersulfone, polyimide, and fluorine resin. The film capacitor according to claim 1, characterized in that it is one or a combination of epoxy resin, diallyl phthalate resin, thermosetting acrylic resin, and crosslinked polybutadiene.
JP18314882A 1982-10-18 1982-10-18 Film condenser Pending JPS5972124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18314882A JPS5972124A (en) 1982-10-18 1982-10-18 Film condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18314882A JPS5972124A (en) 1982-10-18 1982-10-18 Film condenser

Publications (1)

Publication Number Publication Date
JPS5972124A true JPS5972124A (en) 1984-04-24

Family

ID=16130636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18314882A Pending JPS5972124A (en) 1982-10-18 1982-10-18 Film condenser

Country Status (1)

Country Link
JP (1) JPS5972124A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469467A (en) * 1993-10-15 1995-11-21 At&T Corp. Method for synchronizing the reference frequency oscillator of a metallic-based microcell to a master oscillator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469467A (en) * 1993-10-15 1995-11-21 At&T Corp. Method for synchronizing the reference frequency oscillator of a metallic-based microcell to a master oscillator

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