JPS5958896A - Multilayer circuit board - Google Patents
Multilayer circuit boardInfo
- Publication number
- JPS5958896A JPS5958896A JP17014482A JP17014482A JPS5958896A JP S5958896 A JPS5958896 A JP S5958896A JP 17014482 A JP17014482 A JP 17014482A JP 17014482 A JP17014482 A JP 17014482A JP S5958896 A JPS5958896 A JP S5958896A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- organic film
- thickness
- multilayer circuit
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000010354 integration Effects 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は耐熱性、放熱性のよいセラミック回路基板より
、電気信号を効率的に取り出す多層回路基板に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer circuit board that efficiently extracts electrical signals from a ceramic circuit board that has good heat resistance and heat dissipation.
従来例の構成とその問題点
従来、有機系回路基板に電気信号取出し用回路を形成し
た有機フィルムを接合したものがあったが、この構成で
は耐熱特性、熱伝導性が悪く汎用性がなかった。Conventional configurations and their problems Conventionally, an organic circuit board was bonded to an organic film on which an electrical signal extraction circuit was formed, but this configuration had poor heat resistance and thermal conductivity, and lacked versatility. .
発明の目的
本発明は上記欠点に鑑み、耐熱特性、熱伝導性が良好で
しかも集積度の向上が図れ用途が広い多層回路基板を提
供するものである。OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a multilayer circuit board that has good heat resistance and thermal conductivity, has an improved degree of integration, and has a wide range of uses.
発明の構成
上記目的を達成するだめに、本発明は電気回路を形成し
たアルミナセラミック基板まだはセラミックコンデンサ
材料を使用したセラミック基板と電気信号取出し用回路
を形成した有機フィルムとが交互に接合され多層構造を
なす構成としだものである。Structure of the Invention In order to achieve the above object, the present invention provides a multilayer structure in which an alumina ceramic substrate on which an electric circuit is formed, a ceramic substrate using a ceramic capacitor material, and an organic film on which an electric signal extraction circuit is alternately bonded. It is a structure that forms a structure.
アルミナセラミック基板またはセラミックコンデンサ材
料を使用したセラミック基板は熱伝導率が高いため耐熱
特性、熱伝導性が良好であり、また多層構造であるため
回路の集積度が大きく増す。An alumina ceramic substrate or a ceramic substrate using a ceramic capacitor material has high thermal conductivity, so it has good heat resistance characteristics and thermal conductivity, and also has a multilayer structure, which greatly increases the degree of circuit integration.
実施例の説明
以下本発明の一実施例における多層回路基板について説
明する。DESCRIPTION OF EMBODIMENTS A multilayer circuit board according to an embodiment of the present invention will be described below.
図に示すように、１は９９チＡｌ２Ｏ３のアルミナセラ
ミック基板、２はアルミナセラミック基板１上の電気回
路、３はＩＶＩ（ＪＯ−Ｔ ｉ Ｏ２のセラミックコン
デンサ材料を使用したセラミック基板、４は基板３上の
電気回路である。６は有機フィルム、７は有機フィルム
６上の電気信号取出し用回路である。８は有機系接着剤
であり、基板１または基板３と有機フィルム６とを交互
に接合する。As shown in the figure, 1 is a 99-chi Al2O3 alumina ceramic substrate, 2 is an electric circuit on the alumina ceramic substrate 1, 3 is a ceramic substrate using IVI (JO-T i O2 ceramic capacitor material), 4 is a substrate 3 6 is an organic film, 7 is an electric signal extraction circuit on the organic film 6. 8 is an organic adhesive, which alternately connects the substrate 1 or 3 and the organic film 6. do.
次に本実施例における多層回路基板の温度特性について
第１表に示す。第１表は本実施例における多層回路基板
と従来の多層回路基板とをそれぞれ２００Ｃ，２５０Ｃ
，３００ｔｌｌ”の温度の中に１゜分装置いた結果を示
すものである。Next, Table 1 shows the temperature characteristics of the multilayer circuit board in this example. Table 1 shows the multilayer circuit board in this embodiment and the conventional multilayer circuit board at 200C and 250C, respectively.
, 300 tll'' temperature for 1°.
第１表
第１表かられかるように、本実施例における多層回路基
板は、従来のものに比べて極めて耐熱性に優れている。As can be seen from Table 1, the multilayer circuit board of this example has extremely superior heat resistance compared to the conventional one.
次に第２表に示す試料番号１〜８の多層回路基板につい
て、第３表に接合強度、フィルム強度。Next, for the multilayer circuit boards of sample numbers 1 to 8 shown in Table 2, Table 3 shows the bonding strength and film strength.
消費電力を示す。Indicates power consumption.
以 下 余 白
第 ２ 表
第３表
第３表かられかるように、有機フィルムの厚さがＱ、０
１＋＋＋ｙｎ未満の場合試別番号Ｂのようにフィルム強
度が低下する。まだ有機アイ５＋レムの厚さカニ２順よ
り大きい場合は第３表に示さないカニコスト増となるだ
けで他に利点はない。As can be seen from Table 3, the thickness of the organic film is Q, 0.
When it is less than 1+++yn, the film strength decreases as shown in trial number B. If the thickness of organic eye 5 + rem is still larger than the order of crab 2, there is no other advantage other than an increase in crab cost which is not shown in Table 3.
導電体層の厚さが０．１μｍ未満の場合は試料番号６の
ように回路抵抗値が犬きくなシ、消費電力カニ増加する
。まだ導電体層の厚さ７％ ２０μｍより大きい場合は
試料番号７のように有機フィルムと基板との接合強度が
極端に低下する。When the thickness of the conductor layer is less than 0.1 μm, as in sample number 6, the circuit resistance value becomes sharper and the power consumption increases significantly. If the thickness of the conductor layer is still larger than 7% or 20 μm, as in sample number 7, the bonding strength between the organic film and the substrate is extremely reduced.
ところが試料番号１〜６のように有機フィルムの厚さが
０．０１ａ〜２晒であり、力・つ導電体層カニ０．１μ
ｍ〜２０μｍである場合は、接合強度、フィルム強度が
ともに優れ、消費電力も少ない。However, as in sample numbers 1 to 6, the thickness of the organic film is 0.01 μm to 2 μm, and the thickness of the conductor layer is 0.1 μm.
m to 20 μm, both bonding strength and film strength are excellent, and power consumption is low.
なお本実施例においてはＡｌ２０３）占４反と”ｋＡｑ
○−ＴｉＯ基板を用いたが、フォルステライト、ムライ
ト、−コージライト基板を用いた場合も同様の効果を有
する。In addition, in this example, Al203) 4-tan and "kAq
Although a -TiO substrate was used, similar effects can be obtained when forsterite, mullite, or -cordierite substrates are used.
発明の効果
以上のように本発明は、電気回路を形成したアルミナセ
ラミック基板捷たはセラミックコンデンサ刺針を使用し
たセラミック基板と電気信号取出し用回路を形成した有
機フィルムとを交互に結合し、多層構造となすことによ
り、耐熱性、熱伝導性が良好でしかも集積度が向上する
ものであり、有機フィルムの厚さがｏ、０１１ｒｒｆｎ
〜２瑞でその有機フィルムの導電体層の厚さが０．１μ
ｍ〜２０μｍの場合、強度もよく消費電力も少なくなる
。Effects of the Invention As described above, the present invention creates a multilayer structure by alternately bonding alumina ceramic substrates on which electric circuits are formed or ceramic substrates using ceramic capacitor needles and organic films on which electric signal extraction circuits are formed. By doing so, the heat resistance and thermal conductivity are good, and the degree of integration is improved, and the thickness of the organic film is o, 011rrfn.
~2 Rui, the thickness of the conductor layer of the organic film is 0.1μ
m to 20 μm, the strength is good and the power consumption is low.
図は本発明の一実施例における多層回路基板の断面図で
ある。
１．３・・・・・・基板、２，４・・・・・・電気回路
、５・・・・・・有機フィルム、６・・・・・・電気信
号取出し用回路、７・・・・・・接着剤。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名４１The figure is a sectional view of a multilayer circuit board according to an embodiment of the present invention. 1.3...Substrate, 2,4...Electric circuit, 5...Organic film, 6...Electric signal extraction circuit, 7... ···glue. Name of agent: Patent attorney Toshio Nakao and 1 other person 41
Claims (4)
はセラミックコンデンサ斜材を使用したセラミック基板
と電気信号取出し用回路を形成した有機フィルムとを交
互に接合し、多層構造とした多層回路基板。(1) A multilayer circuit board with a multilayer structure in which an alumina ceramic substrate on which an electric circuit is formed or a ceramic substrate using a ceramic capacitor diagonal material is alternately bonded to an organic film on which an electric signal extraction circuit is formed.
ｒｕｎとした特許請求の範囲第１項記載の多層回路基板
。(2) The thickness of the organic film is 0.011 nm to 2r.
A multilayer circuit board according to claim 1, in which the term "run" is used.
が厚さｏ、ｉμｍ〜２０ 、ＩＪ ！’ｎの導電体層か
ら成る特許請求の範囲第１項記載の多層回路基板。(3) The electric signal extraction circuit formed on the organic film has a thickness of o, iμm~20, IJ! 2. The multilayer circuit board according to claim 1, comprising 'n conductor layers.
り、前記有機フィルムに形成された電気信号取出し用回
路が厚さｏ、ｉμｍ〜２ｏμｍの導電体層から成る特許
請求の範囲第１項記載の多層回路基板。(4) The organic film has a thickness of 0.01 mm to 2 μm, and the electric signal extraction circuit formed on the organic film is comprised of a conductive layer with a thickness of o, i μm to 2 μm. The multilayer circuit board according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17014482A JPS5958896A (en) | 1982-09-28 | 1982-09-28 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17014482A JPS5958896A (en) | 1982-09-28 | 1982-09-28 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5958896A true JPS5958896A (en) | 1984-04-04 |
Family
ID=15899481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17014482A Pending JPS5958896A (en) | 1982-09-28 | 1982-09-28 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958896A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5410970A (en) * | 1977-06-27 | 1979-01-26 | Nippon Mektron Kk | Hybrid multiilayer circuit board and method of manufacturing same |
| JPS5444764A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
-
1982
- 1982-09-28 JP JP17014482A patent/JPS5958896A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5410970A (en) * | 1977-06-27 | 1979-01-26 | Nippon Mektron Kk | Hybrid multiilayer circuit board and method of manufacturing same |
| JPS5444764A (en) * | 1977-09-16 | 1979-04-09 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
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