JPS5946741A - Picture display device - Google Patents

Abstract

PURPOSE:To achieve wiring and parts mounting suitable for a flat-type thin picture display device by directly pasting or soldering the respective parts at the rear face or side face of a flat-type picture display element. CONSTITUTION:The section of a circuit block 21 is directly provided on the rear face of the externally sealing glass 23 of a flat-type thin picture display element 22. For this purpose, a required wiring pattern 24 is directly printed by a conductive paste. In addition, a print resistor 25 is provided by printing a resistor paste and a small capacity capacitor 26 is also created by printing, if necessary. Then, a chip-type capacitor 27 of large capacity, chip-type transistor 28, chip- type LSI 29 and the like are mounted on it by soldering. The wiring up to the input terminal 30 of the picture display element 22 from the circuit block 21 is also achieved by the wiring pattern 31 formed by the printing of the conductor paste in the same way. Finally, to prevent the adhesion of dirt and the deterioration caused by humidity, the entire surface is coated with synthetic resin.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides /I! B
'<Relating to a flat image display device.

Conventional configuration and its problems In conventional image display devices, circuit components are printed circuit boards.
The printed circuit board and the input terminals of each image display element were connected by electric wires.

However, with the circuit mounting method using printed circuit boards and electric wires,
Reducing the size of a circuit block beyond a certain level is regression, and therefore, when the circuit is mounted on an image display element, the overall thickness becomes to some extent. Furthermore, the wiring between the substrate and the image display element using electric wires becomes complicated, leading to an increase in the number of man-hours and furthermore, to an increase in cost.

Purpose of the Invention The present invention solves the two drawbacks of the mounting method using printed circuit boards as described above, and realizes wiring and component mounting suitable for a flat, thin image display device. The purpose is to provide a device that can

Structure of the Invention In the present invention, when mounting the drive and control circuits, the maximum size of the thin planar image display element is determined. 1. In order to avoid damaging the thinness of the image display element, wiring is provided directly on the back and side surfaces of the image display element by vapor deposition of aluminum or by printing on a base plate, etc. It connects components and chip components to integrate a circuit and an image display element.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

First, a thin planar image display element as shown in FIG. 1 is used.

This display element includes, in order from the back to the front, a back electrode 1, a line cathode 2 as an electron beam source, a vertical focusing electrode 3,
3. A vertical deflection electrode 4, an electron beam flow control electrode 6, a horizontal focusing electrode 6, a horizontal deflection electrode, an electron beam acceleration electrode 8, and a screen plate 9 are arranged, and these are arranged to form a flat Galanu bulb (not shown). The interior is housed in a vacuum.

A line cathode 2 serving as an electron beam source is stretched horizontally so as to generate an electron beam distributed linearly in the horizontal direction. In the figure, only four wires 2-2 are shown).

In this embodiment, it is assumed that 15 pieces are provided.

Let's say 2i~2yo. These line cathodes 2 are, for example, 10
An oxide cathode H material is applied to the surface of a tungsten wire of ~2oμφ. And as explained below,
It is controlled so that electron beams are emitted sequentially from the three line cathodes 2a for a fixed period of time.

The back electrode 1 creates a potential gradient with a vertical focusing electrode 3, which will be described later, to suppress the generation of electron beams from other line cathodes 2 other than the line cathode 2 which is controlled to emit electron beams for a certain period of time. It also functions to push the generated electron beam forward only. This back electrode 1 may be formed by a coating film of a conductive material adhered to the inner surface of the rear wall of the glass bulk. Further, instead of the back electrode 1 and the linear cathode 2, a planar electron beam emitting cathode may be used.

The vertical focusing electrode 3 is a conductive plate 11 having a horizontally long slit 1-10 facing each of the line cathodes 2i to 2yo, and extracts the electron beam emitted from the line cathode 2 through its slit 1o, and , vertically focused. The slits 10 may be provided with crosspieces at appropriate intervals in the middle, or may be substantially a row of through holes arranged horizontally at small intervals (nearly touching intervals). It may also be configured as a slit.

The vertical focusing electrode 3 is also similar.

A plurality of vertical deflection electrodes 4 are arranged horizontally in the middle of each of the sulins 10, and conductors 13, 13' are provided on the upper and lower surfaces of the insulating substrate 12, respectively.
It consists of a set of Then, a vertical deflection voltage is applied between the opposing conductors 13 and 13' to deflect the electron beam in the vertical direction. In this configuration example, one line cathode 2 is formed by a pair of conductors 13 and 13'.
The electron beam is deflected vertically to a position corresponding to 16 lines. Then, the 16 vertical deflection electrodes (4) constitute 16 pairs of conductors corresponding to each of the 16 wire cathodes 2, and in the end, the electronic vinyl is drawn so as to draw 240 horizontal lines on the Nuclean e. to deflect.

Next, the control electrodes 6 each include a conductive plate 15 having a vertically long slit 14, and a plurality of control electrodes 6 are arranged in parallel horizontally at a predetermined interval. In this configuration example, 320 control electrode conductive plates 16a to 15n are provided (only 10 are shown in FIG. t). Each of the control electrodes 5 separates and extracts the electron beam into one picture element in the horizontal direction, and controls the amount of electron beam passing therethrough in accordance with a video signal for displaying each picture element.

Therefore, if 32020 control electrodes 6 are provided, 320 picture elements can be displayed per horizontal line.

In addition, in order to display images in color, each picture element is R, G.
, B, and each control electrode 5
The R, G, and B video signals are sequentially added to the . In addition, 320 sets of video signals for one line are simultaneously applied to the 320 control electrodes 6, and the video for one line is displayed at one time.

The horizontal focusing electrode 6 is composed of a conductive plate 17 having a plurality of vertically long slits 16 (320 slits 16) facing the slits 14 of the control electrode 5, and collects electrons for each picture element divided in the horizontal direction. Each beam is focused horizontally into a narrow electron beam.

The horizontal deflection electrode 7 is composed of a plurality of conductive plates 18 arranged vertically in the middle of each nullit 16, and a horizontal deflection voltage is applied between each of the conductive plates 18 for each picture element. The electron beams are each deflected in the horizontal direction, and each of the R, G, and B phosphors is sequentially illuminated with a screen 9''.
(The deflection range is the width of one pixel for each electron beam in this embodiment.)

The acceleration electrode 8 is composed of a plurality of conductive plates 19 provided horizontally at the same position as the vertical deflection electrode 4.
The electron beam is accelerated to collide with the screen 9 with sufficient energy.

Nuclean 9 has a phosphor 20 that is emitted by the 11α agent of the electron beam applied to the back side of the glass plate 21, and is a moat.
A metal back layer (not shown) is added thereto. The phosphors 20 are provided with one pair of phosphors of three colors R2H and H for each beam 14 of the control electrode 5, that is, for each horizontally divided electron beam. It is applied in vertical stripes. In FIG. 1, the broken lines drawn on the screen 9 indicate divisions in the vertical direction corresponding to the width of the plurality of line cathodes 2, and the two-dot chain lines indicate the divisions of the plurality of control electrodes 5, respectively. Shows the horizontal divisions displayed corresponding to. As shown in the enlarged view in Figure 2, in one section partitioned by both, there are R, Cr, and B phosphors 2o for one pixel in the horizontal direction, and 16 lines in the vertical direction. It has a width of 30 minutes. The size of one section is, for example, 1πm in the horizontal direction and 16 m in the vertical direction.

Note that in FIG. 1, the length in the horizontal direction is greatly enlarged relative to the length in the vertical direction for clarity.

In addition, in this embodiment, only one pair of Ft, G, and B phosphors 2o is provided for one picture element for one control electrode 6, that is, one electron beam, but for two or more picture elements, Of course, two or more pairs of pixels may be provided, and in that case, R, G, and B video signals for two or more picture elements are sequentially applied to the control electrode 6, and horizontal deflection is performed in synchronization with the R, G, and B video signals for two or more picture elements. Ru.

FIG. 2 shows an embodiment in which components were mounted and wired using thick film printing technology for the thin flat image display device shown above.

The circuit block 21 is provided directly on the back surface of the outer envelope 23 of the planar image display element 22. Therefore, the necessary wiring pattern 24 is directly printed using the conductor base. A printed resistor 26 is provided by printing the base, and if necessary, a small capacitor 26 is also created by printing.

Next, a chip-shaped large capacity capacitor 27. - Chip-shaped transistor 28, chip-shaped LSI 29, etc. can be soldered onto this.

From the circuit block 21 to the input terminal 30 of the image display element 22
The wiring up to this point is similarly performed using a wiring pattern 31 printed on a conductor base.

Finally, the entire surface of the garbage (=1 shield) is coated with synthetic resin to prevent deterioration due to humidity.

In the example described in item 1, if there is a space of about 10 mm on the back surface of the image display element 2, the circuit can be mounted, and the whole becomes a thin flat image display device.

On the other hand, when the number of input terminals 3o is very large as in the thin planar image display element 21 used in this embodiment, wiring with the circuit block using electric wires requires too much man-hour. Although this is impossible, it can be easily realized using the present invention.

Furthermore, since the components are mounted directly on the surface of the outer envelope glass 22, which has a larger area, a certain degree of heat dissipation effect can be expected.

Effects of the Invention According to the present invention as described above, the following effects can be obtained.

First, each component is attached directly to the back or side surface of a flat image display element using a base plate or solder, and resistors and small capacitance capacitors are manufactured using thick film printing technology. In addition, by using chip components for semiconductor components and large-capacity capacitors, components can be mounted with high density, and the volume occupied by circuit blocks can be reduced by not using printed circuit boards that occupy a large volume. In addition, the circuit block can be accommodated by simply preparing a small space on the back or side of the image display element, making it possible to implement circuits that take advantage of the image display's thin design. Become.

Second, by wiring between the input terminal of the image display element and the circuit block by aluminum vapor deposition or conductor paste printing, it is possible to avoid the frequent wiring of electric wires between the image display element and the circuit block. .

As a result, the complicated electric wire wiring can be simplified and the number of man-hours can be reduced to 1], which also leads to a one-down reduction in the number of wires.

Furthermore, it can be achieved with fewer steps, so it is more trustworthy.”
I can hope for the second one.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of an image display element used in an image display device according to an embodiment of the present invention, and FIG. 2 is a perspective view of main parts of a mold device. 21...Circuit block, 22...Image display element, 23...Outer seal, 24...
...Wiring (turn, 26...Printed resistor, 26
...small capacity capacitor, 27...chip-shaped large-capacity capacitor, 2B...chip-shaped transistor, 29...chi,)b-shaped - LSI
, 3o...Input terminal, 31...Wiring no-turn.

Claims (1)

[Claims] An image display device characterized in that a wiring portion is provided directly on the back or side surface of a thin flat image display element by printing or vapor deposition, and printed components or chip components are mounted on the wiring portion.