JPS5946094A - Method of producing conductor circuit for printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The invention relates to the manufacturing ability of flint circuits for printed circuit boards, especially for flint circuit boards by full additive method of forming circuit patterns by air plating process. A method of manufacturing conductor circuits.

In recent years, copper-clad laminates have been widely used as a 4-piece 1-in-1 bonding method for printed circuits, such as the formation of circuit patterns by etching using the 7-piece rib tractive method, and the plating method. 11. Form the circuit pattern using the additive method 1 and 6 Manufacture by these conventional methods It is common to apply gold plating on copper, etc. by using plating.For this reason, a complete gold plating mask is used for finishing gold plating.
As for the turn of the pole, the turn is very sharp, (the final plating of the nail stand pattern is done by dry plating method, evaporated Mane Toma' [
2. It had a shortcoming in formation.

The present invention eliminates all of the above-mentioned drawbacks, and makes it possible to perform finishing gold plating of isolated patterns using electroplating, which is a wet plating method, instead of using dry plating.

An uninvented embodiment VC will be described in detail with reference to the drawings below.

Figure 1 shows partial finishing pot plating 1a in conventional manufacturing.
(This is a schematic diagram showing the 101st surface of a conductor circuit for printed circuit boards applied with i7. Figure 2 is a schematic diagram showing the 101st side of a conductor circuit for printed circuit boards applied with i7.
It is a schematic diagram showing a jf plane.

Even though it was uninvented! The method is to place the part that will become the circuit pattern on the metal plate, mask 1~ with a resist agent made of iW+all-insulating material on the outside surface, and then cover with a separately manufactured mask of a polymer film with holes, and then finish. Electrolytic plating V is formed on the gold plating 1b all over the gold Ml. Next, the polymer film mask is removed, and a copper pattern 2 is formed on the metal plate with the final gold plating 1b by vaporized copper plating. Next, use a roll coater to apply the adhesive 3 to the base substrate 4 made of a non-conductive molecular material, and after temporary drying, the adhesive 7n, h'+It t, * iu, is formed first. Place the steel pattern 2 101 on the base board 4, heat it 1~, finish the circuit pattern with gold plating 11) and place the copper pattern 2 on the base board 4.
Roll 7tf in contact with it and partially finish gold plating 1b in isolation.
It was possible to obtain a flint circuit J-th conductor circuit having i.

Since the invention is manufactured as described in detail above, the finishing of the isolated circuit pattern is done by wet plating, which makes mass production easier and reduces manufacturing costs.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram showing the concave surface of a 2H folding circuit for printed circuits with a gold plating 1a finish of 1915 minutes according to conventional manufacturing, and Fig. 2 shows a concave surface of a 2H folding circuit for printed circuits with a gold plating finish of 1a according to the present invention.
b Full power + j L, 11 No. 1 of the skin dedicated circuit for the printed circuit
FIG. +a, Ib...Finish gold plating 2...Gold plating pattern 6...(Afterwards burr 4
・・・・・・Base board

Claims (1)

[Claims] In manufacturing a printed circuit armor conductor circuit in which a circuit pattern is formed by electroplating, the surface of the 2# conductive metal other than the part that will become the circuit pattern is coated with an insulating material (T).
There is a process of masking with a certain resist agent, and then another masking material with holes selectively drilled with commercial molecular Neulum etc. is masked by tearing on the surface of the wound side of the resist masked with the resist agent. . Finishing plating such as gold is embroidered on the surface of the metal area of the trolley by electroplating only on the hole H41s, and conductive metal such as copper is applied to the metal 4 which has been plated with finish plating such as gold. After forming the general circuit pattern by FC turtle plating, 1 knot is formed.
A four-layer circuit for printed circuit boards, which includes the process of forming a circuit pattern on a polymeric material by applying an adhesive to the polymeric material that serves as the base of the circuit board! ! of creative power.