JPS5938244A - Electromagnetic wave shielding synthetic resin molding material - Google Patents
Electromagnetic wave shielding synthetic resin molding materialInfo
- Publication number
- JPS5938244A JPS5938244A JP57148516A JP14851682A JPS5938244A JP S5938244 A JPS5938244 A JP S5938244A JP 57148516 A JP57148516 A JP 57148516A JP 14851682 A JP14851682 A JP 14851682A JP S5938244 A JPS5938244 A JP S5938244A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- electromagnetic wave
- molding material
- wave shielding
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003002 synthetic resin Polymers 0.000 title claims description 18
- 239000000057 synthetic resin Substances 0.000 title claims description 18
- 239000012778 molding material Substances 0.000 title claims description 15
- 239000005300 metallic glass Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000011888 foil Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、マイクロコンピュータのような電気機器のキ
ャビネットの成形材料として好適な電磁波遮蔽性合成樹
脂成形材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an electromagnetic wave shielding synthetic resin molding material suitable as a molding material for cabinets of electrical equipment such as microcomputers.
近年、マイクロコンピュータの普及にはめざましいもの
があり、゛ます゛ます広い分野に用いられつつあるが、
高周波発振器を内蔵しているためここから発振された高
周波電波がテレビや各種通信機器等の他の電波機器へ妨
害を与えるという問題があり、この問題が各国で大きく
採り上げられている。In recent years, the spread of microcomputers has been remarkable, and they are being used in an increasingly wide range of fields.
Because they have a built-in high-frequency oscillator, there is a problem in that the high-frequency radio waves oscillated by this device can interfere with other radio wave devices such as televisions and various communication devices, and this problem has been widely discussed in various countries.
一方、マイクロコンピュータの多くは可搬式であり、ど
こにでも運搬および設置することができるが、設置され
る場所によっては周囲の機器等から発生する火花放電等
の強いパルスにマイクロコンピュータ自体がさらされる
危険がある。On the other hand, many microcomputers are portable and can be transported and installed anywhere; however, depending on where they are installed, there is a risk that the microcomputer itself may be exposed to strong pulses such as spark discharges generated from surrounding equipment. There is.
これらの問題は、マイクロコンピュータ管包囲するキャ
ビネットに電磁波遮蔽効果を持たせることにより解決す
ることができる。These problems can be solved by providing an electromagnetic wave shielding effect to the cabinet surrounding the microcomputer tube.
しか竪のようなキャビネットとしては、量産性、意匠性
、経済性、軽量性等の観点から合成樹脂製のものが多く
用いられており、これに電磁波遮蔽性を付与する方法ど
して以下に記載するような種々の方法が採られていた。However, vertical cabinets are often made of synthetic resin from the viewpoints of mass production, design, economy, and lightness. Various methods were used as described below.
α） メッキ、塗装、溶射、重接着等の方法で合成樹脂
製キャビネットの外表面に金属質の電磁波遮蔽層を設け
る。α) A metallic electromagnetic shielding layer is provided on the outer surface of the synthetic resin cabinet by plating, painting, thermal spraying, heavy adhesion, etc.
（２）金属粉、カーボン粉、金属箔、金属繊維、カーボ
ン繊維等の導電性物質を混和した熱可塑性樹脂によりキ
ャビネッ）ｋ成形する。(2) A cabinet is molded using a thermoplastic resin mixed with a conductive substance such as metal powder, carbon powder, metal foil, metal fiber, or carbon fiber.
しかしながらこれらの方法のうち（１）の方法において
は、落下による衝撃や熱サイクル等により電磁波遮蔽層
が剥離したり脱落したりするおそれがあり、その剥離片
が万一マイクロ、コンピュータの電気回路上に落下した
場合には、短絡や発火等の重大事故につながり易いとい
う問題があった。However, in method (1) of these methods, there is a risk that the electromagnetic shielding layer may peel off or fall off due to impact from dropping or thermal cycles, and if the peeled pieces accidentally come off the electrical circuit of the micro or computer. There is a problem in that if the device falls, it can easily lead to serious accidents such as short circuits and fires.
・また（２）の方法においては、導電性物質の剥離脱落
の心配はないが、導電性物質を合成樹脂に均一に混和し
キャビネット全体として高い電磁波遮蔽効果を持たせる
ことは離しいという問題があった。-Also, with method (2), there is no worry about the conductive material peeling off or falling off, but there is the problem that it is difficult to uniformly mix the conductive material into the synthetic resin and provide a high electromagnetic wave shielding effect for the cabinet as a whole. there were.
すなわち電磁波遮蔽の効果全表わす指数Ａ（ｄＢ）は次
式で表わされる。That is, the index A (dB) representing the entire effect of shielding electromagnetic waves is expressed by the following equation.
Ａ＝３．ａｔ４語■Ｔ
但し Ｇ：銅に対する比導電率
Ｌ：厚み （ｆｆ）
μ：透磁率
ｆ：周波数 （ＭＨｚ）
Ａ：吸収損失 （ｄＢ）
電磁波遮蔽効果を高めるためには、電気抵抗値を低くし
て電気伝導度を向上させることが必要となるが、この方
法で金属粉やカーボン粉を合成樹脂に混入した場合には
、これらの粉末の周囲を合成樹脂が包み込んで絶縁して
し甘うため、電気抵抗値の低いキャビネッ）を得ること
が難しかった。A=3. at4 words■T However, G: Specific conductivity to copper L: Thickness (ff) μ: Magnetic permeability f: Frequency (MHz) A: Absorption loss (dB) In order to improve the electromagnetic wave shielding effect, lower the electrical resistance value. However, if metal powder or carbon powder is mixed into synthetic resin using this method, the synthetic resin will wrap around these powders and insulate them. , it was difficult to obtain a cabinet with low electrical resistance.
さらに導電性物質として金属箔や金属繊維等を用い、こ
れらを合成樹脂に混入した場合には、箔や繊維が相互に
接触しやすく前述の方法に比べ低抵抗値のものを得やす
いが射出成形用の材料を得るために従来からのスクリュ
一式押出機を用いて混練し押出した場合には、スクリュ
ー内部での高圧下の混練工程で微細に破断や切断が行わ
れて抵抗値が低くなるという難点があった。Furthermore, when metal foil, metal fibers, etc. are used as conductive substances and mixed into synthetic resin, the foils and fibers tend to come into contact with each other, making it easier to obtain a product with a lower resistance than the above-mentioned method, but injection molding When kneading and extruding the material using a conventional screw extruder to obtain the material for use in the product, the kneading process under high pressure inside the screw causes minute breaks and cuts, resulting in a low resistance value. There was a problem.
本発明は、従来方法におけるこれらの問題を解決するた
めになされたもので非晶質金属を混入することによって
混線工程や可塑工程に於ける上記金属の破砕や切断を少
くし、°また、非晶質金属の優れた磁気特性により電磁
波遮蔽効果の高い合成樹脂成形材料を供給することを目
的としている。The present invention was made in order to solve these problems in the conventional method, and by mixing an amorphous metal, it reduces the crushing and cutting of the metal in the wiring process and plasticizing process. The aim is to provide synthetic resin molding materials with high electromagnetic wave shielding effects due to the excellent magnetic properties of crystalline metals.
本発明の電磁波遮蔽性合成樹脂成形材料は、非晶質金属
と合成樹脂と力）ら成ることを特徴とする成形材料であ
る。The electromagnetic wave-shielding synthetic resin molding material of the present invention is a molding material characterized by being composed of an amorphous metal, a synthetic resin, and an amorphous metal.
本発明に使用する非晶質金属としては、それをＭａＸｂ
として表わすと、ＭとしてはＦｅ、Ｇｏ、Ｎｉの少なく
とも１種、×としてはＳｉ、Ｂ、Ｃ，Ｐ、Ａｌの少なく
とも１種で、ａ＝７０〜８５ｗｔ％、ｂ−１５〜３Ｑｗ
ｔ％の範囲のものがある。更に添加物としてＴｓ ＋
Ｖ ＋ Ｃｒ ＋ Ｍｎ＋ Ｚｒ ＋ Ｎｂ＋ Ｍｏ
＋ Ｒｕ ＋ Ｈｆ ｒ Ｔａ ＋ Ｗ ｒ Ｒｅ ノ
少なくとも１種ヲ０．５〜１０ｗｔ％の範囲で添加する
と軟磁気特性および熱安定性がよくなる。またそれらの
形状は薄膜、厚膜、薄片、薄帯、粉末、繊維のものが使
用される。The amorphous metal used in the present invention is MaXb
When expressed as, M is at least one of Fe, Go, and Ni, × is at least one of Si, B, C, P, and Al, a=70 to 85 wt%, b-15 to 3Qw
There are some in the range of t%. Furthermore, Ts + as an additive
V + Cr + Mn+ Zr + Nb+ Mo
When at least one of + Ru + Hf r Ta + W r Re is added in a range of 0.5 to 10 wt %, soft magnetic properties and thermal stability are improved. The shapes used include thin films, thick films, flakes, ribbons, powders, and fibers.
本発明に使用する合成樹脂としては、ポリアミド樹脂、
ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン
樹脂、ＡＢＳ樹脂、ポリ塩化ビニル樹脂等の熱可塑性樹
脂を使用することができる。The synthetic resins used in the present invention include polyamide resins,
Thermoplastic resins such as polyethylene resin, polypropylene resin, polystyrene resin, ABS resin, and polyvinyl chloride resin can be used.
又、エポキシ樹脂、不飽和ポリエステル樹脂、フェノー
ル樹脂、ポリイミド樹脂等の熱硬化性樹脂を使用するこ
とができる。Furthermore, thermosetting resins such as epoxy resins, unsaturated polyester resins, phenol resins, and polyimide resins can be used.
本発明の電磁波遮蔽性合成樹脂成形材料を製造するには
、非晶質金属と合成樹脂とを所定量配合し、スクリュ一
式エクストルーダ又はロール等により均一に混練し造粒
機により粒状又は顆粒状の成形材料の形状については特
に限定はなく所望の太き意、形状をつくることができる
。In order to produce the electromagnetic wave shielding synthetic resin molding material of the present invention, a predetermined amount of amorphous metal and synthetic resin are mixed, uniformly kneaded using a set of screw extruders or rolls, and then processed into granules or granules using a granulator. There are no particular limitations on the shape of the molding material, and any desired thickness and shape can be created.
次に本発明の実施例について具体的に説明する。 Next, examples of the present invention will be specifically described.
実施例１
非晶質金属（Ｆｅ−８ｉ−Ｂ） ５０重量％平
均寸法０．２間×０２朋×２０μ
耐衝撃ポリスチレン樹脂 ５０重量％（ダイヤレ
ックスＨＴ−６１．三菱モンサンド製）を配合し、スク
リー一式エクスト、ルーダにより均一に混練し、直径２
問長さ３朋程度の円柱状の粒状成形材料を得た。Example 1 Amorphous metal (Fe-8i-B) 50% by weight Average dimensions: 0.2mm x 02mm x 20μ 50% by weight of impact-resistant polystyrene resin (Dialex HT-61, manufactured by Mitsubishi Monsando) was blended, Scree set extra, knead uniformly with Ruder, diameter 2
A cylindrical granular molding material having a length of about 3 mm was obtained.
得られた成形材料により射出成形法で板状試験片を作成
し電磁波遮蔽効果を調べた。その結果３０ＭＨｚに於け
る電磁波遮蔽効果は約３５ ｄＢであり優れた結果を示
した。A plate-shaped test piece was made using the obtained molding material by injection molding, and the electromagnetic wave shielding effect was investigated. As a result, the electromagnetic wave shielding effect at 30 MHz was approximately 35 dB, which was an excellent result.
成形品に含まれる箔片を拡大写真によって調べたところ
、寸法的に混線、成形前のものと変化なく混練成形工程
での破砕、破断が行なわれなかったことを示していた。When the foil pieces contained in the molded product were examined using enlarged photographs, it was found that the dimensions were unchanged from those before molding, indicating that they had not been crushed or broken during the kneading and molding process.
実施例２
非晶質金属（Ｆｅ−Ｎｉ−８ｉ−Ｂ）
平均寸法０．２闘×０．２間×２０μ ４０重量係フェ
ノール樹脂（硬化剤、フィラーなどを含む）６０重量係
を配合し、ロールにより均一に混練し、しかる後造粒機
により粒状成形材料を得た。得られた成形材料を圧縮成
形法により板状試験片を成形し、電磁波遮蔽効果を調べ
た。３０ＭＨｚにおける電磁波遮蔽効果は約３０ｄＢと
満足すべき結果を得た。Example 2 Amorphous metal (Fe-Ni-8i-B) Average dimensions: 0.2mm x 0.2mm x 20μ 40% by weight Phenol resin (including curing agent, filler, etc.) 60% by weight is blended, The mixture was uniformly kneaded using a roll, and then a granular molding material was obtained using a granulator. The obtained molding material was molded into a plate-shaped test piece by compression molding, and the electromagnetic wave shielding effect was investigated. The electromagnetic wave shielding effect at 30 MHz was about 30 dB, which is a satisfactory result.
成形品に含まれる箔片を拡大して調べたところ、寸法的
に混和、成形前のものと変らず、混練、成形工程での破
砕、破断が行なわれていないことを示した。When the foil pieces contained in the molded product were examined under magnification, the dimensions were the same as before mixing and molding, indicating that they had not been crushed or broken during the kneading and molding processes.
本発明に係る合成樹脂成形材料は、非晶質金属を配合す
ることによって、これが成形後においても非晶質金属が
破砕、破断されることなく原状を保持し、きわめてすぐ
れた電磁波遮蔽効果を示したＯ
特許出願人 東芝ケミカル株式会社
特許出願人 東京芝浦電気株式会社By incorporating an amorphous metal into the synthetic resin molding material of the present invention, the amorphous metal retains its original state without being crushed or broken even after molding, and exhibits an extremely excellent electromagnetic wave shielding effect. Patent applicant: Toshiba Chemical Co., Ltd. Patent applicant: Tokyo Shibaura Electric Co., Ltd.
Claims (1)
電磁波遮蔽性合成樹脂成形材料。 ２ 非晶質金属の含有量が２０〜７０重量％である特許
請求の範囲第１項記載の電磁波遮蔽性合成樹脂成形材料
。[Claims] 1. An electromagnetic wave-shielding synthetic resin molding material characterized by comprising an amorphous metal and a synthetic resin. 2. The electromagnetic wave shielding synthetic resin molding material according to claim 1, wherein the content of amorphous metal is 20 to 70% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148516A JPS5938244A (en) | 1982-08-28 | 1982-08-28 | Electromagnetic wave shielding synthetic resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57148516A JPS5938244A (en) | 1982-08-28 | 1982-08-28 | Electromagnetic wave shielding synthetic resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938244A true JPS5938244A (en) | 1984-03-02 |
| JPH0237947B2 JPH0237947B2 (en) | 1990-08-28 |
Family
ID=15454514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57148516A Granted JPS5938244A (en) | 1982-08-28 | 1982-08-28 | Electromagnetic wave shielding synthetic resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938244A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60173052A (en) * | 1984-02-20 | 1985-09-06 | Mitsui Toatsu Chem Inc | resin composition |
| JPS61166098A (en) * | 1985-01-18 | 1986-07-26 | 品川商工株式会社 | Electromagnetic shielding body |
| JPS6283846A (en) * | 1985-10-08 | 1987-04-17 | Miyoshi Oil & Fat Co Ltd | Cream cheese-like food and production thereof |
| JPH0222333A (en) * | 1987-10-29 | 1990-01-25 | Hiraoka & Co Ltd | Amorphous metal-containing flexible sheet |
| JPH08204380A (en) * | 1995-01-31 | 1996-08-09 | Tokin Corp | Noise suppressing method for electric apparatus and noise suppressed electronic apparatus using this method |
| KR100565845B1 (en) * | 2003-06-12 | 2006-03-30 | 재단법인 포항산업과학연구원 | Electromagnetic wave absorber |
| CN105199375A (en) * | 2015-10-12 | 2015-12-30 | 苏州宽温电子科技有限公司 | Electrically and magnetically conductive composite material and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187357A (en) * | 1981-05-15 | 1982-11-18 | Aisin Seiki Co Ltd | Soft magnetic resin composed of amorphous alloy |
-
1982
- 1982-08-28 JP JP57148516A patent/JPS5938244A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187357A (en) * | 1981-05-15 | 1982-11-18 | Aisin Seiki Co Ltd | Soft magnetic resin composed of amorphous alloy |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60173052A (en) * | 1984-02-20 | 1985-09-06 | Mitsui Toatsu Chem Inc | resin composition |
| JPH0573784B2 (en) * | 1984-02-20 | 1993-10-15 | Mitsui Toatsu Chemicals | |
| JPS61166098A (en) * | 1985-01-18 | 1986-07-26 | 品川商工株式会社 | Electromagnetic shielding body |
| JPS6283846A (en) * | 1985-10-08 | 1987-04-17 | Miyoshi Oil & Fat Co Ltd | Cream cheese-like food and production thereof |
| JPH0550251B2 (en) * | 1985-10-08 | 1993-07-28 | Myoshi Yushi Kk | |
| JPH0222333A (en) * | 1987-10-29 | 1990-01-25 | Hiraoka & Co Ltd | Amorphous metal-containing flexible sheet |
| JPH08204380A (en) * | 1995-01-31 | 1996-08-09 | Tokin Corp | Noise suppressing method for electric apparatus and noise suppressed electronic apparatus using this method |
| KR100565845B1 (en) * | 2003-06-12 | 2006-03-30 | 재단법인 포항산업과학연구원 | Electromagnetic wave absorber |
| CN105199375A (en) * | 2015-10-12 | 2015-12-30 | 苏州宽温电子科技有限公司 | Electrically and magnetically conductive composite material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0237947B2 (en) | 1990-08-28 |
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