JPS5936365Y2 - Double-sided polishing equipment - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to improvements in double-sided polishing equipment.

As shown in FIG. 1, the single-sided polishing device includes a polisher 1 which has a polishing surface to which artificial leather is attached and is driven to rotate horizontally, and a cylinder device for pressurizing the workpiece W to the polishing surface. 2, the workpiece W is fixed to a head 3 rotatably held by the cylinder device 2, advances and retreats in the axial direction of the polisher 1, and is pressed against the polishing surface for processing. There are some things that look like this.

This polishing process tends to cause deep scratches due to the abrasive grains on the polisher 1, so it has the disadvantage that it is not easy to finish the processed surface smoothly.

In order to eliminate this drawback, a non-contact type surface polishing device (published in practical use in 1982-110582) has been proposed.

This device is equipped with a polisher that generates dynamic pressure on the polishing surface.
The polisher and the workpiece are moved relative to each other in a machining fluid in which abrasive grains are suspended to form a non-contact state between them, and the machining is performed by friction between the abrasive grains in the machining fluid and the workpiece. It is done.

By the way, as shown in FIG. 2, there is a double-sided polishing apparatus in which a workpiece W is placed on a polisher 1, and a polisher 6 is further placed on top of this workpiece W.

In this case, the workpiece W is held by a flat gear-shaped carrier 7.

However, the lever carrier 7 meshes with a pinion 8 that is rotationally driven and an internal gear 9 that is fixedly installed coaxially with the pinion 8, and the workpiece W is rotated by the rotation of the carrier 7. It is brought into pressure contact with the polishers 1 and 6, and both surfaces thereof are simultaneously polished.

This type of double-sided polishing apparatus has the disadvantage that it is difficult to finish the machined surface smoothly for the same reason as the single-sided polishing apparatus shown in FIG. 1 because deep scratches are likely to occur.

In order to eliminate this drawback, if the above-mentioned proposal made for the single-sided polishing apparatus is applied as is to this double-sided polishing apparatus, it would be possible to provide two polishers that generate dynamic pressure on both sides of the workpiece. .

That is, a bosser having a polishing surface that generates dynamic pressure on its upper surface is provided below the workpiece, and a polisher having a polishing surface that generates dynamic pressure on its lower surface is provided above the workpiece.

A conceivable device is one in which a polisher and a workpiece are moved relative to each other in a machining fluid, the workpiece is floated from a lower polisher by dynamic pressure, and an upper polisher is further floated from the floated workpiece by dynamic pressure.

However, in this apparatus, since the dynamic pressure for separating the upper and lower polishers is generated through the workpiece, the floating gap may fluctuate and the required processing quality may not be obtained.

The present invention was developed in view of the above-mentioned circumstances, and the opposing surfaces of a pair of polishers facing each other across the workpiece have the same magnetic pole, and the rotation of the polisher applies dynamic pressure to the workpiece through the machining fluid. The required processing quality is obtained by forming a stable gap on the surface.

Hereinafter, the present invention will be described based on embodiments with reference to the drawings.

As shown in FIGS. 3 and 4, the apparatus is comprised of a pair of polishers 11 and 12 facing each other with a disk-shaped workpiece W interposed therebetween, a carrier 13, and its rotation mechanism.

That is, the workpiece W is placed on a disk-shaped bosser 11 arranged horizontally, and a polisher 12 having the same shape as the polisher 11 is placed on top of the workpiece W.

The polisher 11 is rotated at a fixed position at a variable speed by a drive device (not shown).

This polisher 11 is connected to the polisher 1 through the workpiece W.
A permanent magnet (not shown) is built in so that the opposing surface 14 facing the rotating shaft 2 has an S pole, for example, so that a uniform magnetic force is generated in the direction of the rotation axis.

As shown in FIG. 5, this polisher 11 has radial grooves 15 having a negative inclination angle in the direction of rotation shown by arrow A on the opposing surface 14.
The shaft is uniformly formed, and when rotated in the direction of arrow A, dynamic pressure is generated in the axial direction via the machining fluid.

Next, the polisher 12 is rotated at a variable speed coaxially with and independently of the polisher 11 by a drive device (not shown), and is provided so as to be slidable in the direction of its rotation axis.

This polisher 12 has a facing surface 16 that faces the polisher 11 through the workpiece W and has an S pole similar to that of the polisher 11, and a repelling magnetic force causes the polisher 11 to
Depending on the thickness of the workpiece W, a larger gap is created between the two.

Note that this gap can be adjusted by applying a weight to the polisher 12.

Further, the opposing surface 16 of this polisher 12 is formed to be a surface that generates a dynamic pressure similar to that of the polisher 11 described above.

Next, to explain the carrier 13 and its rotation mechanism, between the pair of polishers 11.12 and coaxially with these polishers 11.12, there is a pinion whose speed is variable independently of these polishers 11.12 by a drive device (not shown). 1
7 is provided.

Also, the polisher 11.1 is coaxially connected to this pinion 17.
An internal gear 18 larger than 2 is fixedly provided,
A flat gear-shaped carrier 13, which is thinner than the workpiece W, is meshed between these gears 17 and 18.

That is, as the pinion 17 rotates, the carrier 13 rotates between the polishers 11 and 12 and revolves around the axis of the pinion 17.

This carrier 13 has a circular workpiece holding hole 19 in the center.
is formed.

This holding hole 19 has a diameter larger than the diameter of the workpiece so that the movement of the workpiece in the direction of the rotation axis of the carrier 13 is not restricted during machining.

In FIG. 4, four carriers 13 are arranged equally dividing the circumference.

During processing, the processing portion is immersed in a processing liquid in which abrasive grains are suspended in a processing liquid tank (not shown).

Note that the polishers 11 and 12 may be provided with an electromagnet.

The repulsive force of electromagnets can be easily adjusted.

Further, it goes without saying that non-magnetic or weakly magnetic materials are used for the carrier 13 and the like.

For processing, the polisher 12 is moved and the workpiece W is set in the holding hole 19 of the carrier 13.

However, when this polisher 12 is placed on the workpiece W of the lever, a repulsive force shown by an arrow B acts on both polishers 11 and 12, and the polisher 12 floats up from the polisher 11 to a height that balances the gravity.

The gap g between the polishers 11 and 12 caused by this floating can be kept at a constant value using a weight.

The pair of polishers 11, 12 and pinion 17 are then rotated.

Then, the opposing surfaces 14, 16 of these polishers 11, 12
Grooves 15 provided therein act on the machining fluid to apply dynamic pressure to the workpiece W from its upper and lower surfaces.

The magnitude of this dynamic pressure can be adjusted by changing the rotational speed of the polisher 11, 12, so that the workpiece W can be levitated at an appropriate position between the gaps 2.

Meanwhile, the workpiece W is rotated by the flow of the machining fluid and the rotation of the carrier 13 meshing with the rotationally driven pinion 17.

The abrasive grains of the flowing working fluid rub against the rotating workpiece W separated from the polisher 11, 12, thereby progressing the polishing process.

During this processing, the polisher 11, 12 maintains the gap g due to the action of magnetic force, so this gap g is more stable than when the gap is created only by dynamic pressure.

Note that this gap g is primarily formed by the repulsive force of the magnetic force, and the dynamic pressure is only secondarily involved.

However, if necessary, the rotation speed of polisher 11, 12, etc.
It is also possible to make this dynamic pressure largely contribute to the formation of the gap g by changing the shape of the grooves 15 on the opposing surfaces 14 and 16.

Note that the present invention is not limited to the above embodiments,
For example, it is also possible for both polishers 11, 12 or polisher 11 to slide in the axial direction.

Further, it is also conceivable that the rotation of the carrier 13 is performed by another mechanism that does not use the internal gear 18.

Furthermore, it goes without saying that the carrier 13 can be modified in various ways without departing from the spirit of the invention, such as by providing an eccentric holding hole or a plurality of holding holes.

As described in detail above, in the present invention, the opposing surfaces of a pair of polishers facing each other across the workpiece have the same magnetic pole, and the rotation of the polisher applies dynamic pressure to the workpiece through the machining fluid. Because it is formed on the surface, a stable gap is obtained between the polishers during machining, so the friction of the abrasive grains against the workpiece is uniform, resulting in smooth machining without scratches or unevenness. Can be done.

Further, since the gap between the polishers can be changed arbitrarily, the processing speed and quality can be easily adjusted, and the desired processing quality can be easily obtained.

The present invention can be easily applied not only to polishing machines but also to lapping machines, and is widely effective in the field of precision machining.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventional single-sided polishing device, FIG. 2 is a front sectional view of a conventional double-sided polishing device, FIG. 3 is a front sectional view of a double-sided polishing device according to an embodiment of the present invention, and FIG. 4 is a front sectional view of the conventional double-sided polishing device. FIG. 5 is a reduced plan view viewed in the direction of arrow C and a partially cutaway perspective view of the polisher. 11.12...Polisher, 13...Carrier, 14,16...Opposing surface, W...
・Workpiece.

Claims (1)

[Scope of utility model registration request] A pair of rotating polishers having opposing surfaces facing each other with a workpiece in between, and a carrier that holds the workpiece between the pair of polishers and rotates the workpiece by rotation, At least one of the polishers is slidable in the direction of the rotation center axis of the polisher, and each opposing surface has the same magnetic pole, and rotation of the polisher applies dynamic pressure to the workpiece through the machining fluid. On the other hand, the workpiece is held by the carrier so as not to be restrained in the direction of the opposing surfaces of the pair of polishers, and the opposing surfaces of the pair of polishers rotate the workpiece held by the carrier. A double-sided polishing device characterized in that the polishing liquid is released from the polishing liquid through the processing liquid.