JPS5932079B2 - How to hold printed wiring board mounted components - Google Patents
How to hold printed wiring board mounted componentsInfo
- Publication number
- JPS5932079B2 JPS5932079B2 JP2912978A JP2912978A JPS5932079B2 JP S5932079 B2 JPS5932079 B2 JP S5932079B2 JP 2912978 A JP2912978 A JP 2912978A JP 2912978 A JP2912978 A JP 2912978A JP S5932079 B2 JPS5932079 B2 JP S5932079B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- printed wiring
- wiring board
- components
- mounted components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
この発明は印刷配線板実装部品の保持方法に関するもの
で、特に、実装部品が印刷配線板に組み 。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for holding components mounted on a printed wiring board, and particularly to a method for holding components mounted on a printed wiring board.
込まれ、そのリード端子がたとえば半田付されるまでの
叫、印届嚢線板から実装部品が抜け落ちることのないよ
うに保持するための方法に関する。従来、印刷配線板に
実装する部品のリード゛端子の切断または折り曲げを行
なう場合は、1個ずつ部品を実装しながら折り曲げ係止
させるか、または予め必要長さに切断処理されたリード
端子を挿入し、スポンジ等で上から押さえた後に印刷配
線板を反転させてリード端子を折り曲げる方法がとられ
ていた。そのため、リード端子の処理作業の能率が極め
て低かつた。それゆえに、この発明はこのような問題点
を解決するためのもので、リード端子の処理作業を簡単
かつ能率よく行なうことができる印刷配線板実装部品の
保持方法を提供するものである。The present invention relates to a method for holding a mounted component so that it does not fall out from a printed circuit board until its lead terminal is soldered, for example. Conventionally, when cutting or bending the lead terminals of components to be mounted on a printed wiring board, it was necessary to mount the components one by one while bending and locking them, or to insert lead terminals that had been cut to the required length in advance. However, the method used was to press the printed wiring board from above with a sponge or the like, then turn the printed wiring board over and bend the lead terminals. Therefore, the efficiency of processing the lead terminals was extremely low. Therefore, the present invention is aimed at solving these problems, and provides a method for holding components mounted on a printed wiring board, which allows processing of lead terminals to be carried out easily and efficiently.
この発明は、要約すれば、予め印刷配線板の片面に粘着
シートを貼り付け、この粘着シートを貫通するようにリ
ード端子を挿入し、粘着シートの粘着力によつて実装部
品が抜け落ちることのないようにしたものである。In summary, this invention is accomplished by pasting an adhesive sheet on one side of a printed wiring board in advance, inserting lead terminals through the adhesive sheet, and preventing mounted components from falling out due to the adhesive force of the adhesive sheet. This is how it was done.
そして、実装部品が機械的に固定された後は、粘着シー
トは剥がされる。以下、第1図ないし第3図を参照して
、この発明の一実施例について説明する。まず、印刷配
線板1の片面に粘着シート2が粘り付けられたものを用
意する。After the mounted components are mechanically fixed, the adhesive sheet is peeled off. An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. First, a printed wiring board 1 with an adhesive sheet 2 adhered to one side is prepared.
この印刷配線板1の貫通孔11に、粘着シート2が貼り
付けられていない側から、実装部品3のリード端子4を
挿入すると、リード端子4は粘着シート2を貫通し、粘
着シート2のリード端子4が貫通した部分は、第2図に
よく示されているように、リード端子4に付着する。し
たがつて、このリード端子4vc付着した粘着シート2
の粘着力によつて、実装部品3が印刷配線板1に対して
保持されることになる。上述した状態から、第3図に示
すように、印刷配線板1を反転させて、リード端子4を
折り曲げ係止させると、実装部品3は印刷配線板1に対
して機械的に固定されることになる。この後に、粘着シ
ート2を剥ぎとり、半田付すれば、実装部品3の実装が
完了する。以上のように、この発明によれば、部品を実
装すべき印刷配線板に予め粘着シートが貼り付けられて
いるので、実装部品のリード端子の挿入と同時に粘着シ
ートの粘着力によつてリード端子すなわち実装部品が簡
単に保持されることになるので、リード端子の処理を簡
単かつ能率よく行なうことができるという効果を奏する
。When the lead terminals 4 of the mounted component 3 are inserted into the through holes 11 of the printed wiring board 1 from the side where the adhesive sheet 2 is not attached, the lead terminals 4 penetrate the adhesive sheet 2 and the leads of the adhesive sheet 2 The portion through which the terminal 4 passes is attached to the lead terminal 4, as clearly shown in FIG. Therefore, the adhesive sheet 2 attached to this lead terminal 4vc
The mounting component 3 is held to the printed wiring board 1 by the adhesive force of the adhesive. From the above-mentioned state, as shown in FIG. 3, when the printed wiring board 1 is reversed and the lead terminals 4 are bent and locked, the mounted component 3 is mechanically fixed to the printed wiring board 1. become. After this, if the adhesive sheet 2 is peeled off and soldered, the mounting of the mounted component 3 is completed. As described above, according to the present invention, since the adhesive sheet is pasted in advance to the printed wiring board on which the component is to be mounted, the lead terminals are attached simultaneously with the insertion of the lead terminals of the mounted component by the adhesive force of the adhesive sheet. That is, since the mounted components are easily held, the lead terminals can be processed easily and efficiently.
そして、粘着シートは、実装部品が機械的に固定されて
から、剥がされるので、粘着シート自身や粘着シートに
付与される粘着剤が、半田付において、半田を汚したり
、半田付に対して悪影響を及ぼしたりすることはない。
さらに、実装部品のリード端子は、粘着シートが貼り付
けられていない側から貫通孔に挿入されるので、リード
端子が粘着シートを突き破つて押し込まれたときには、
第2図に示されるように、粘着シート2がリード端子4
に沿つて反り上がり、リード端子4の長さ方向の比較的
長い部分で、粘着シート2がリード端子4を保持するこ
とになる。したがつて、リード端子の保持状態をより安
定なものとすることができる。なお、前述した実施例で
は、粘着シートの粘着力によつて保持された実装部品を
機械的に固定するために折夕曲げ係止するところまで説
明したが、この発明の方法はこれに限らず、印刷配線板
に部品を挿入した状態で保管したジ、運搬したりする場
合にも適用することができる。Since the adhesive sheet is peeled off after the mounted components are mechanically fixed, the adhesive sheet itself and the adhesive applied to the adhesive sheet may contaminate the solder or have an adverse effect on soldering. It will not cause any harm.
Furthermore, since the lead terminal of the mounted component is inserted into the through hole from the side to which the adhesive sheet is not attached, when the lead terminal is pushed through the adhesive sheet,
As shown in FIG. 2, the adhesive sheet 2 is attached to the lead terminal 4.
The adhesive sheet 2 holds the lead terminal 4 at a relatively long portion in the longitudinal direction of the lead terminal 4. Therefore, the holding state of the lead terminal can be made more stable. In addition, in the above-mentioned embodiments, the mounting components held by the adhesive force of the adhesive sheet are bent and locked in order to mechanically fix them, but the method of the present invention is not limited to this. It can also be applied to cases where components are stored or transported with printed wiring boards inserted.
第1図ないし第3図はこの発明の一実施例を説明するた
めの図であり、第1図は印刷配線板に実装部品のリード
端子を挿入した状態の側面図であり、第2図は第1図の
部分断面図であり、第3図は第1図のリード端子を処理
した状態を示す側面図である。
図において、1は印刷配線板、2は粘着シート、3は実
装部品、4はリード端子、11は貫通孔である。1 to 3 are diagrams for explaining one embodiment of the present invention, in which FIG. 1 is a side view of a state in which lead terminals of a mounted component are inserted into a printed wiring board, and FIG. FIG. 3 is a partial cross-sectional view of FIG. 1, and FIG. 3 is a side view showing the lead terminal of FIG. 1 in a processed state. In the figure, 1 is a printed wiring board, 2 is an adhesive sheet, 3 is a mounting component, 4 is a lead terminal, and 11 is a through hole.
Claims (1)
印刷配線板の片面に粘着シートを貼り付け、粘着シート
が貼り付けられていない側から、前記貫通孔に、前記粘
着シートを貫通するように、前記リード端子を挿入し、
それによつて前記実装部品が機械的に固定されるまでの
期間に、前記粘着シートの粘着力によつて前記実装部品
が抜け落ちることなく保持され、前記実装部品が機械的
に固定されてから、前記粘着シートは剥がされる、印刷
配線板実装部品の保持方法。1. Paste an adhesive sheet on one side of a printed wiring board that has through-holes into which lead terminals of mounted components are inserted, and from the side where the adhesive sheet is not pasted, insert the adhesive sheet into the through-hole so as to penetrate through the adhesive sheet. , insert the lead terminal,
As a result, during the period until the mounted component is mechanically fixed, the mounted component is held without falling off due to the adhesive force of the adhesive sheet, and after the mounted component is mechanically fixed, the mounted component is A method of holding printed circuit board mounted components in which the adhesive sheet is peeled off.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2912978A JPS5932079B2 (en) | 1978-03-13 | 1978-03-13 | How to hold printed wiring board mounted components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2912978A JPS5932079B2 (en) | 1978-03-13 | 1978-03-13 | How to hold printed wiring board mounted components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54120869A JPS54120869A (en) | 1979-09-19 |
JPS5932079B2 true JPS5932079B2 (en) | 1984-08-06 |
Family
ID=12267680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2912978A Expired JPS5932079B2 (en) | 1978-03-13 | 1978-03-13 | How to hold printed wiring board mounted components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5932079B2 (en) |
-
1978
- 1978-03-13 JP JP2912978A patent/JPS5932079B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS54120869A (en) | 1979-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0907307A1 (en) | Heat sink for surface mount power packages | |
JPS5932079B2 (en) | How to hold printed wiring board mounted components | |
JPH05274996A (en) | Method of attaching fuse clip and combination fuse clip | |
US3983623A (en) | Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards | |
US4287667A (en) | Method of mounting an electrical component | |
JPS6242596A (en) | Flexible printed circuit board | |
JPH04243155A (en) | Hybrid integrated circuit device | |
JPS61193727A (en) | Fitting method of electronic component | |
JPH01154592A (en) | Mounting method for component on printed board | |
JP3349434B2 (en) | Support for three-terminal transistor | |
JPS63161696A (en) | Method of surface mount of electronic parts | |
JPS61287563A (en) | Lead for taping part | |
JPH0786086A (en) | Electronic component for mounting printed circuit board and mounting method thereof | |
JPH04167490A (en) | Printed-wiring board | |
JP2001326443A (en) | Method of mounting electrical component | |
JPH02148710A (en) | Method of inserting and mounting circuit component with lead terminal | |
JPH06334324A (en) | Reflow method for discrete component | |
JPS62252193A (en) | Method of connecting leads of parts to through-holes of printed board | |
JPS62241281A (en) | Pin jack fitting method | |
JPS60154697A (en) | Electronic component mounting method | |
JPS6250080B2 (en) | ||
JPS63108795A (en) | Method of surface mounting of dip package type ic on printed wiring board | |
JPS59211298A (en) | Method of preventing floating of connecting wire in solder dip | |
JPS5831759B2 (en) | Lead wire connection method | |
JPS6285492A (en) | Attachment of electronic part |