JPS5931217B2 - Microwave integrated circuit package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improved package construction for housing a microwave integrated circuit constructed on an insulating substrate such as ceramic or sapphire.

In general, a package for a microwave integrated circuit includes, for example, a ceramic substrate constituting the microwave integrated circuit, which is mounted and supported on a metal base serving as a support plate in a direction horizontal to the main surface of the metal base. Input/output terminals, which are insulated from the metal base and extended in a direction perpendicular to the main surface thereof, are connected to input/output line ends of the microwave integrated circuit.

However, in such a configuration, the extension direction of the input/output line end of the microwave integrated circuit and the lead-out 1 of the input/output terminal are
0 direction is inevitably perpendicular to the 0 direction, and it is difficult to match the impedance at the connection between these input/output line ends and input/output terminals, especially in the microwave band, so adjustment work is required during connection work. They were worried about the increase in man-hours. Further, when such a package 15 is mounted on a wiring board or a chassis to configure a microwave device, the mounting area occupied by the package becomes large, which becomes an obstacle to miniaturization of the device. The present invention has been made in view of the above points, and its 20 objectives are to facilitate impedance matching at the connection between the input/output line ends and input/output terminals of a microwave integrated circuit, and to facilitate package mounting. The present invention is to provide a package 25 for a microwave integrated circuit having a configuration that enables miniaturization of the microwave device by reducing the area. The conductor film of the microwave integrated circuit board is connected at the groove portion of the support plate by fitting the terminal into the groove of the metal support plate in a direction perpendicular to the main surface of the metal support plate. the microwave integrated circuit is mounted and supported, the line end of the microwave integrated circuit is connected to the input/output terminal so as to extend in the direction of extension thereof, and a metal case is attached to the support plate. It is in.

35 FIG. 1 is a perspective view of essential parts for explaining an example of a schematic configuration of a package for a microwave integrated circuit according to the present invention, and FIG. 2 is a cylindrical view taken along line A-A in FIG. Identical parts in FIGS. 1 and 2 are designated by the same reference numerals.

In both figures, 1 is a support plate, for example, a metal base, and this metal base 1 has input terminals 2, output terminals 3, and other external connection leads 4 led out in a direction perpendicular to its main surface, for example. They are each arranged via an insulator 5 such as glass. Note that the input/output terminals 2 and 3 are each configured to have a predetermined characteristic impedance. Reference numeral 6 denotes a ceramic substrate, for example, which constitutes a microwave integrated circuit to be accommodated, and a microwave integrated circuit 7 such as an amplifier circuit or an oscillation circuit is constituted in the area surrounded by the dashed line of the ceramic substrate 6. From the microwave integrated circuit 7, an input line end 8, an output line end 9, and other wiring ends 100j for applying a bias voltage are led out, and a ceramic substrate 6 is provided. A conductive film 11 is adhered to the back side of the. Then, the ceramic substrate 6 is fitted into the concave groove 12 formed on the metal base 1, and the metal base 1 and the conductive film 11 on the back surface of the ceramic substrate are bonded together with a conductive adhesive 13 such as solder or silver. Thus, the ceramic substrate 6 is mounted and supported on the metal base 1 in a direction perpendicular to the main surface of the metal base, and the electrical connection between the conductor film 11 and the metal base 1 is made perfect. By mounting and supporting the ceramic substrate 6 on the metal base 1 in a direction perpendicular to the main surface of the metal base in this way,
The direction in which the input line end 8 and the output line end 9 are led out from the microwave integrated circuit 7 and the direction in which the input terminal 2 and the output terminal 3 are led out can be the same or parallel. The input line end 8 and the output line end 9, which require impedance matching particularly in the microwave band, are directly connected to the input terminal 2 and the output terminal 3 in a parallel relationship without bending, for example, by soldering. Alternatively, they may be adhesively connected using a conductive adhesive 14 such as silver to facilitate impedance matching at these connections. In addition, for example, wiring ends 10 for applying a bias voltage that do not require impedance matching are connected to external connection leads 4 by bonding wires 15.
The metal cap 16 and the metal base 1 are then welded together by, for example, electric welding or the like to be hermetically sealed. Compared to the conventional configuration in which a ceramic substrate is mounted and supported on a metal base in a direction horizontal to its main surface, this type of structure naturally allows the area of the main surface of the metal base to be reduced, making wiring easier. When a microwave device is constructed by mounting it on a substrate or chassis, the device can be made smaller. In the above-mentioned embodiment, the ceramic substrate is fitted into a concave groove formed in the metal base, and the metal base and the conductive film of the ceramic substrate are bonded with a conductive adhesive so that the ceramic substrate is mounted and supported on the metal base. However, as shown in FIG. 3, a plate-shaped metal spring 19 may be embedded in a concave groove 18 formed in the metal base 17, and the ceramic substrate 20 may be supported by being inserted into the metal spring 19. can.

As described above, the present invention allows the microwave integrated circuit to be accommodated by mounting and supporting the substrate constituting the microwave integrated circuit on the support plate in a direction perpendicular to the main surface of the support plate. The lead-out direction of the input/output line end and the lead-out direction of the input/output terminal can be configured in the same or parallel relationship, making impedance matching easy at each connection between the input/output line end and the input/output terminal. This makes it possible to reduce the number of connection work steps, and when configuring a microwave device on a wiring board or chassis, the mounting area can be reduced, which is effective in downsizing the device.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of essential parts for explaining an example of the schematic configuration of a package for a microwave integrated circuit according to the present invention, FIG. 2 is a sectional view taken along A-N1 in FIG. 1, and FIG. FIG. 4 is an enlarged sectional view of a main part for explaining a schematic structure of another example for supporting a ceramic substrate. 1, 17: Metal base, 2: Input terminal, 3: Output terminal,
4: External connection lead, 5: Insulator, 6, 20: Ceramic substrate, 7 Microwave integrated circuit, 8: Input line end,
9: Output line end, 10: Bias voltage application wiring end, 11: Conductor film, 12, 18: Concave groove, 13, 14:
Conductive adhesive, 15: Ponding wire, 16: Metal cap, 19: Plate metal spring.

Claims (1)

[Claims] 1. The substrate constituting the microwave integrated circuit to be accommodated is fitted into the groove of the metal support plate provided with input/output terminals in a direction perpendicular to the main surface of the metal support plate, and the microwave integrated circuit is inserted into the groove. The conductor film of the integrated circuit board is connected to and supported by the groove of the support plate, and the line end of the microwave integrated circuit is connected to the input/output terminal so as to extend in the direction of extension thereof, and the support plate A package for a microwave integrated circuit characterized by having a structure in which a metal case is attached to a plate.