JPS5928942U - Electrostatic shield type reed relay - Google Patents
Electrostatic shield type reed relayInfo
- Publication number
- JPS5928942U JPS5928942U JP12316582U JP12316582U JPS5928942U JP S5928942 U JPS5928942 U JP S5928942U JP 12316582 U JP12316582 U JP 12316582U JP 12316582 U JP12316582 U JP 12316582U JP S5928942 U JPS5928942 U JP S5928942U
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic shield
- shield type
- reed relay
- type reed
- bobbin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の静電シールド形リードリレーの断面図、
第２図は本考案の一実施例による静電シールド形リード
リレーの断面図である。
７・・・ボビン、８・・・接地端子、９・・・無電解銅
メッキ層、１０・・・フレーム、１１・・・コイル端子
、１２・・・コイル、１３・・・口出線、１４・・・リ
ードスイッチ、１５・・・リードスイッチ端子、１６・
・・ケース。Figure 1 is a cross-sectional view of a conventional electrostatic shield type reed relay.
FIG. 2 is a sectional view of an electrostatic shield type reed relay according to an embodiment of the present invention. 7... Bobbin, 8... Ground terminal, 9... Electroless copper plating layer, 10... Frame, 11... Coil terminal, 12... Coil, 13... Lead wire, 14... Reed switch, 15... Reed switch terminal, 16.
··Case.
Claims (1)
部にはリードスイッチを設けた静電シールド形リードリ
レーにおいて、ボビンに接地端子を埋込んで無電解銅メ
ッキ処理を行なうことにより、ボビンの表面に無電解銅
メッキ層を形成すると共に、該無電解銅メッキ層と接続
端子とが接続することを特徴とする静電シールド形リー
ドリレＯIn an electrostatic shield type reed relay, which has a cylindrical bobbin with a ground terminal, a coil is installed on the outer periphery of the bobbin, and a reed switch is installed inside, by embedding the ground terminal in the bobbin and performing electroless copper plating, An electrostatic shield type reed relay O characterized in that an electroless copper plating layer is formed on the surface of the bobbin, and the electroless copper plating layer is connected to a connecting terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12316582U JPS5928942U (en) | 1982-08-16 | 1982-08-16 | Electrostatic shield type reed relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12316582U JPS5928942U (en) | 1982-08-16 | 1982-08-16 | Electrostatic shield type reed relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5928942U true JPS5928942U (en) | 1984-02-23 |
Family
ID=30281256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12316582U Pending JPS5928942U (en) | 1982-08-16 | 1982-08-16 | Electrostatic shield type reed relay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5928942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623382U (en) * | 1985-06-25 | 1987-01-10 |
-
1982
- 1982-08-16 JP JP12316582U patent/JPS5928942U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623382U (en) * | 1985-06-25 | 1987-01-10 | ||
| JPH042145Y2 (en) * | 1985-06-25 | 1992-01-24 |
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