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JPS5927383B2 - Ion beam thin film production equipment - Google Patents

Ion beam thin film production equipment

Info

Publication number
JPS5927383B2
JPS5927383B2 JP55071141A JP7114180A JPS5927383B2 JP S5927383 B2 JPS5927383 B2 JP S5927383B2 JP 55071141 A JP55071141 A JP 55071141A JP 7114180 A JP7114180 A JP 7114180A JP S5927383 B2 JPS5927383 B2 JP S5927383B2
Authority
JP
Japan
Prior art keywords
ion beam
thin film
substrate
production equipment
film production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55071141A
Other languages
Japanese (ja)
Other versions
JPS56169771A (en
Inventor
昌徳 古室
久三 川勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP55071141A priority Critical patent/JPS5927383B2/en
Publication of JPS56169771A publication Critical patent/JPS56169771A/en
Publication of JPS5927383B2 publication Critical patent/JPS5927383B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221Ion beam deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Description

【発明の詳細な説明】 本発明は薄膜作成装置、殊に電界蒸発型イオン源を用い
た薄膜作成装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin film forming apparatus, particularly to a thin film forming apparatus using a field evaporation type ion source.

一般に基板上に薄膜を作成するには、従来からの伝統的
手法としては蒸着法があるが、この方法を上回る利点を
有する手法として、イオンビームにより薄膜を作る試み
がなされている。
Generally, a traditional method for forming a thin film on a substrate is a vapor deposition method, but attempts have been made to form a thin film using an ion beam as a method that has advantages over this method.

即ち、イオンビームによつた場合、原則としては、1)
高い基板温度でしか形成できないような物質を低い基板
温度で形成できる、2)真空中の残留ガスが薄膜に混入
する程度を抑え、高い純度の薄膜とすることができる、
3)薄膜と基板との付着力を向上させることができ、薄
膜の密度も向上させることができる、等の効果が期待で
きるのである。しかし、従来のイオンビーム発生装置を
用いたものでは、上記の期待される効果は必ずしも満足
され得ない。第1図に、こラした従来の装置構成を示し
て簡単に説明し、その欠点を顕らかにする。従来は、る
つぼ型のイオンビーム発生装置が用いられている。即ち
、るつぼ1中の物質をヒータ2によつて高温に熱し、蒸
発させてイオン化し、高圧電源3による数KV〜数十K
Vの高電界で加速してから電子レンズ系4により或る程
度集束させる。この装置では、るつぼ1を高温に熱する
ため、るつぼ内壁やヒーターからの、また残留ガスの不
純物イオンが出力ビームIB中に混入してそのまま基板
に照射させることはできず、従つて磁気型の質量分析器
5によつて質量分析し、所要成分のみとしで基板6に指
向せねばならない。その後、イオンビームは基板6の前
面で減速され、比較的低電圧、一般に数十〜数百Vの電
源Tの加速電界で基板上に照射され、膜形成が行なわれ
る。以上のように、従来のるつぼ型イオン源を用いた装
置では、どうしてもイオン源から発生する不純物イオン
量が多く、質量分析器を必須とするため、装置全体が非
常に大型化してしまう。本発明はこの卓に鑑み、小型か
つ簡便な薄膜形成装置を提供せんとするものであり、そ
のためには先ず、高性熊なイオンビーム発生装置を模索
する所から始まづている。
That is, when using an ion beam, in principle, 1)
2) It is possible to form substances that can only be formed at high substrate temperatures at low substrate temperatures; 2) It is possible to suppress the amount of residual gas in the vacuum mixed into the thin film, resulting in a thin film with high purity;
3) Effects such as being able to improve the adhesion between the thin film and the substrate and improving the density of the thin film can be expected. However, the above-mentioned expected effects cannot necessarily be achieved using conventional ion beam generators. FIG. 1 shows a complicated conventional device configuration, which will be briefly explained and its shortcomings will be highlighted. Conventionally, a crucible-type ion beam generator has been used. That is, the substance in the crucible 1 is heated to a high temperature by the heater 2, evaporated and ionized, and the substance in the crucible 1 is heated to a high temperature of several KV to several tens of K by the high voltage power source 3.
After accelerating with a high electric field of V, it is focused to some extent by an electron lens system 4. In this device, since the crucible 1 is heated to a high temperature, impurity ions from the inner wall of the crucible, the heater, and the residual gas cannot mix into the output beam IB and directly irradiate the substrate. It must be subjected to mass analysis by a mass spectrometer 5 and directed to the substrate 6 with only the required components. Thereafter, the ion beam is decelerated in front of the substrate 6, and irradiated onto the substrate with an accelerating electric field of a power source T at a relatively low voltage, generally several tens to several hundreds of volts, to form a film. As described above, in an apparatus using a conventional crucible-type ion source, a large amount of impurity ions are inevitably generated from the ion source, and a mass spectrometer is required, resulting in an extremely large size of the entire apparatus. In view of this, the present invention aims to provide a small and simple thin film forming apparatus, and for this purpose, we first begin by searching for a highly functional ion beam generating apparatus.

結果としては、イオンビーム発生装置としては、電界蒸
発型のものを用いることとなつた。
As a result, it was decided to use a field evaporation type ion beam generator.

この電界蒸発型イオンビーム発生装置自体は既に開発さ
れており、ヒータに備えた先端半径数μmの針状陽極に
イオン化すべき物質を付着させ、該物質をヒータにより
加熱した溶融状態においたまま、強電界を陽極尖端に加
えることによりイオン放出を行なわせるものである。こ
の装置固有の特徴としては、1)小型、2)構造が簡単
、3)単位消費電力あたりのイオン電流が大、4)高輝
度、5)不純物イオンが混入しにくい、等がある。本発
明でも、この特徴はそのまま生かそうとするものである
が、以下、第2図に示す基本的な実施例に就き説明する
と、薄膜を形成すべき物質8は、上述のように、ヒータ
9に備えられた針状陽極10に付着されている。
This field evaporation type ion beam generator itself has already been developed, and a substance to be ionized is attached to a needle-shaped anode with a tip radius of several μm provided in a heater, and the substance is left in a molten state heated by the heater. Ions are emitted by applying a strong electric field to the tip of the anode. Characteristics unique to this device include 1) small size, 2) simple structure, 3) large ion current per unit power consumption, 4) high brightness, and 5) difficulty in mixing with impurity ions. Although this invention is intended to take advantage of this feature as it is, the basic embodiment shown in FIG. 2 will be explained below. It is attached to a needle-like anode 10 provided in the.

ここで理解をた易くするため、イオン化すべき物質8は
金(AU)であるとする。イオン源としての金は、接地
に対して、又は金薄膜を形成すべき基板6に対して相対
的に数十〜数百Vの正の電位に電源7によつて保たれ、
かつヒータ9により溶融状態に維持されている。
Here, for ease of understanding, it is assumed that the substance 8 to be ionized is gold (AU). The gold as an ion source is kept at a positive potential of several tens to hundreds of volts by a power source 7 relative to ground or the substrate 6 on which the gold thin film is to be formed,
And it is maintained in a molten state by the heater 9.

この状態で、引き出し電極11に高圧電源3から負の数
KVの高電圧が印加されると、金イオンが引き出される
。この金イオンビームIBを基板6上に集束するため、
電子レンズ系13が用いられるが、これは簡単な任意の
構成を採ることができる。図示の場合は、上記の引き出
し電極11と接地電極12とから電子レンズ系を構成し
ていて、減速の中心軸側に向いた電界を作るようになつ
ており、イオンビームIBの軌道は一旦脹らんだ後、゛
集束する形となる。このようにして集束した金イオンビ
ームを基板6上に照射すれば所望の金薄膜が得られるが
、本出願人の試用例では集束径は1Tfnn以下迄可能
となつた。
In this state, when a negative high voltage of several KV is applied to the extraction electrode 11 from the high voltage power supply 3, gold ions are extracted. In order to focus this gold ion beam IB onto the substrate 6,
An electron lens system 13 is used, but this can take any simple configuration. In the case shown in the figure, the above-mentioned extraction electrode 11 and ground electrode 12 constitute an electron lens system, which creates an electric field directed toward the central axis of deceleration, and the trajectory of the ion beam IB is temporarily expanded. After focusing, it takes on a converging shape. By irradiating the substrate 6 with the gold ion beam focused in this manner, a desired gold thin film can be obtained, and in a trial example by the present applicant, it has become possible to achieve a focused diameter of 1 Tfnn or less.

これは、一つには電界蒸発型イオン源が高輝度であると
いうことによつている。つまり、簡単な電子レンズ系に
よつても容易に1T1t1n径以下にビームを集束する
ことができるのであり、純度の高い薄膜形成のための充
分な電流密度を採ることができるのである。また、不純
物イオンの混入余地が原理的に少いため、従来のように
質量分析器というような大型の構成要素は不要となり、
装置全体を著しく小型化できるのである。
This is partly due to the high brightness of the field evaporation type ion source. In other words, even with a simple electron lens system, the beam can be easily focused to a diameter of 1T1t1n or less, and a sufficient current density for forming a highly pure thin film can be obtained. In addition, because there is theoretically little room for impurity ions to enter, there is no need for large components such as conventional mass spectrometers.
The entire device can be significantly downsized.

勿論、第2図示の実施例以外にも、電子レンジ系13は
設計的に様々な構成を採ることが可能であり、電位につ
いても、イオン源と基板とを相対的な所要の電位差を保
ち乍ら共に高電位にするという方式でも本質的には同じ
である。
Of course, the microwave oven system 13 can be designed in various configurations other than the embodiment shown in the second figure, and the electric potential can be maintained at a required relative potential difference between the ion source and the substrate. It is essentially the same even if both are set to a high potential.

以上詳記のように、本発明によれば、従来大型かつ高価
であつたイオンビーム薄膜作成装置を小型かつ簡易なも
のとすることができ、同時に周辺機器も少くなるため、
全体としてコスト的にも安価となるという大きな効果を
有する。
As described in detail above, according to the present invention, the ion beam thin film forming apparatus, which was conventionally large and expensive, can be made smaller and simpler, and at the same time, the number of peripheral devices can be reduced.
This has the great effect of being inexpensive overall.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のイオンビーム薄膜作成装置の概略構成図
、第2図は本発明の基本的一実施例の概略構成図、であ
る。 図中、3は高圧電源、6は基板、8はイオン化すべき物
質、9はヒータ、10は針状電極、13は電子レンズ系
、である。
FIG. 1 is a schematic diagram of a conventional ion beam thin film forming apparatus, and FIG. 2 is a schematic diagram of a basic embodiment of the present invention. In the figure, 3 is a high voltage power supply, 6 is a substrate, 8 is a substance to be ionized, 9 is a heater, 10 is a needle electrode, and 13 is an electron lens system.

Claims (1)

【特許請求の範囲】[Claims] 1 電界蒸発型イオンビーム発生装置と、該装置により
発生したイオンビームを基板上に集束させる電子レンズ
系とより成り、集束したイオンビームによつて上記基板
上に薄膜を形成させることを特徴とするイオンビーム薄
膜作成装置。
1. It is characterized by comprising a field evaporation type ion beam generator and an electron lens system that focuses the ion beam generated by the device onto a substrate, and forms a thin film on the substrate with the focused ion beam. Ion beam thin film creation device.
JP55071141A 1980-05-28 1980-05-28 Ion beam thin film production equipment Expired JPS5927383B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55071141A JPS5927383B2 (en) 1980-05-28 1980-05-28 Ion beam thin film production equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55071141A JPS5927383B2 (en) 1980-05-28 1980-05-28 Ion beam thin film production equipment

Publications (2)

Publication Number Publication Date
JPS56169771A JPS56169771A (en) 1981-12-26
JPS5927383B2 true JPS5927383B2 (en) 1984-07-05

Family

ID=13452009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55071141A Expired JPS5927383B2 (en) 1980-05-28 1980-05-28 Ion beam thin film production equipment

Country Status (1)

Country Link
JP (1) JPS5927383B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60183720A (en) * 1984-03-01 1985-09-19 Mitsubishi Electric Corp Thin film evaporating apparatus
JP2730269B2 (en) * 1990-05-31 1998-03-25 株式会社島津製作所 Semiconductor device manufacturing equipment
EP0534354A1 (en) * 1991-09-25 1993-03-31 Sumitomo Electric Industries, Limited Surface acoustic wave device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS56169771A (en) 1981-12-26

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