JPS5926471B2 - laminate - Google Patents
laminateInfo
- Publication number
- JPS5926471B2 JPS5926471B2 JP51026042A JP2604276A JPS5926471B2 JP S5926471 B2 JPS5926471 B2 JP S5926471B2 JP 51026042 A JP51026042 A JP 51026042A JP 2604276 A JP2604276 A JP 2604276A JP S5926471 B2 JPS5926471 B2 JP S5926471B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- film
- residues
- iii
- residue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002253 acid Substances 0.000 claims description 50
- -1 aromatic dicarboxylic acids Chemical class 0.000 claims description 25
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 24
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 238000001125 extrusion Methods 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229920006267 polyester film Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 125000005586 carbonic acid group Chemical group 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 description 20
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 13
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 229920001634 Copolyester Polymers 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical group OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 4
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical group C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical group O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000007860 aryl ester derivatives Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 150000001555 benzenes Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- BJNWFLGHFAIHAX-UHFFFAOYSA-N (4-acetyloxy-3-chlorophenyl) acetate Chemical compound CC(=O)OC1=CC=C(OC(C)=O)C(Cl)=C1 BJNWFLGHFAIHAX-UHFFFAOYSA-N 0.000 description 1
- KOAWERFKPZHNNY-UHFFFAOYSA-N (4-benzoyloxyphenyl) benzoate Chemical compound C=1C=CC=CC=1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=CC=C1 KOAWERFKPZHNNY-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- LHJGJYXLEPZJPM-UHFFFAOYSA-N 2,4,5-trichlorophenol Chemical compound OC1=CC(Cl)=C(Cl)C=C1Cl LHJGJYXLEPZJPM-UHFFFAOYSA-N 0.000 description 1
- LINPIYWFGCPVIE-IDEBNGHGSA-N 2,4,6-trichlorophenol Chemical group O[13C]1=[13C](Cl)[13CH]=[13C](Cl)[13CH]=[13C]1Cl LINPIYWFGCPVIE-IDEBNGHGSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- AIDLAEPHWROGFI-UHFFFAOYSA-N 2-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=C(C(O)=O)C=CC=C1C(O)=O AIDLAEPHWROGFI-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- UFMBOFGKHIXOTA-UHFFFAOYSA-N 2-methylterephthalic acid Chemical compound CC1=CC(C(O)=O)=CC=C1C(O)=O UFMBOFGKHIXOTA-UHFFFAOYSA-N 0.000 description 1
- XCSGHNKDXGYELG-UHFFFAOYSA-N 2-phenoxyethoxybenzene Chemical compound C=1C=CC=CC=1OCCOC1=CC=CC=C1 XCSGHNKDXGYELG-UHFFFAOYSA-N 0.000 description 1
- MTJGVAJYTOXFJH-UHFFFAOYSA-N 3-aminonaphthalene-1,5-disulfonic acid Chemical compound C1=CC=C(S(O)(=O)=O)C2=CC(N)=CC(S(O)(=O)=O)=C21 MTJGVAJYTOXFJH-UHFFFAOYSA-N 0.000 description 1
- GDBUZIKSJGRBJP-UHFFFAOYSA-N 4-acetoxy benzoic acid Chemical compound CC(=O)OC1=CC=C(C(O)=O)C=C1 GDBUZIKSJGRBJP-UHFFFAOYSA-N 0.000 description 1
- GPJJASIJVRXZFI-UHFFFAOYSA-N 4-methoxybenzene-1,3-diol Chemical compound COC1=CC=C(O)C=C1O GPJJASIJVRXZFI-UHFFFAOYSA-N 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- ZJGSWMLCSPKTFJ-UHFFFAOYSA-N Br.Oc1cccc(O)c1 Chemical compound Br.Oc1cccc(O)c1 ZJGSWMLCSPKTFJ-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ILAHYMUXWPYKDS-UHFFFAOYSA-N I.OC1=CC=C(O)C=C1 Chemical compound I.OC1=CC=C(O)C=C1 ILAHYMUXWPYKDS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- STTZDLWDMVBAOU-UHFFFAOYSA-N benzene-1,3-diol hydroiodide Chemical compound OC1=CC(O)=CC=C1.I STTZDLWDMVBAOU-UHFFFAOYSA-N 0.000 description 1
- MGWWWSRHCOVLIU-UHFFFAOYSA-N benzene-1,3-diol;hydrochloride Chemical compound Cl.OC1=CC=CC(O)=C1 MGWWWSRHCOVLIU-UHFFFAOYSA-N 0.000 description 1
- VVWGUPRYBSGIOR-UHFFFAOYSA-N benzene-1,4-diol;hydrobromide Chemical compound Br.OC1=CC=C(O)C=C1 VVWGUPRYBSGIOR-UHFFFAOYSA-N 0.000 description 1
- RTBFZNKEWQAVEO-UHFFFAOYSA-N benzene-1,4-diol;hydrochloride Chemical compound Cl.OC1=CC=C(O)C=C1 RTBFZNKEWQAVEO-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- FRJZOYQRAJDROR-UHFFFAOYSA-N cyclohexyl hydrogen carbonate Chemical compound OC(=O)OC1CCCCC1 FRJZOYQRAJDROR-UHFFFAOYSA-N 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- HPGJOUYGWKFYQW-UHFFFAOYSA-N diphenyl benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OC=2C=CC=CC=2)C=CC=1C(=O)OC1=CC=CC=C1 HPGJOUYGWKFYQW-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- ASHGTJPOSUFTGB-UHFFFAOYSA-N methyl resorcinol Natural products COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 1
- LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000874 polytetramethylene terephthalate Polymers 0.000 description 1
- 229920002215 polytrimethylene terephthalate Polymers 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid group Chemical group C(CCC(=O)O)(=O)O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
【発明の詳細な説明】 本発明は新規な積層体に関する。[Detailed description of the invention] The present invention relates to a novel laminate.
更に詳しくは耐熱性及び耐薬品性に優れ、しかも優れた
引張強度及びヤング率を有するポリエステルの積層体に
関する。従来、ポリエチレンテレフタレートフィルムは
、優れた機械的強度を有し、且つ耐熱性及び耐薬品性に
優れており、繊維、フィルム等に広く使用されている。More specifically, the present invention relates to a polyester laminate having excellent heat resistance and chemical resistance, as well as excellent tensile strength and Young's modulus. Conventionally, polyethylene terephthalate film has excellent mechanical strength, heat resistance, and chemical resistance, and has been widely used for fibers, films, and the like.
しかしながら、溶融押出し法によつて得られたままのフ
ィルム(原反)は強度、ヤング率がともに低く、通常実
用に供するために延伸処理を施しているのが実情であり
、また厚物のフィルムを得ることは困難である。又、た
とえ延伸したフィルムであつても、高強度を要求する用
途に用いるには問題がある。このため機械的及び熱的性
能の優れたフィルム、シートの出現が望まれている。本
発明者らは、かかる現状に鑑み、延伸を必要とせず且つ
優れた機械的強度を有するフィルム・シートを得るべく
鋭意検討の結果、本発明に到達した。However, the film (original film) obtained by the melt extrusion method has low strength and Young's modulus, and the reality is that it is usually subjected to stretching treatment for practical use. is difficult to obtain. Furthermore, even if the film is stretched, there are problems in using it in applications that require high strength. Therefore, there is a desire for films and sheets with excellent mechanical and thermal performance. In view of the current situation, the present inventors have arrived at the present invention as a result of intensive studies to obtain a film/sheet that does not require stretching and has excellent mechanical strength.
すなわち、本発明は二枚以上の樹脂フィルムを接合した
積層体において、該樹脂フィルムの少くとも二枚は溶融
押出し法で得られた、異方性溶融物を形成するポリエス
テルのフィルムAであり、且つ該フィルムAの少くとも
二枚はその押出し方向が互いに3(f’以上交叉してラ
ミネートされていることを特徴とする積層体である。That is, the present invention provides a laminate in which two or more resin films are bonded together, in which at least two of the resin films are polyester films A that form an anisotropic melt obtained by a melt extrusion method, Moreover, the film A is a laminate characterized in that at least two sheets of the film A are laminated so that their extrusion directions cross each other by 3 (f' or more).
本発明に訃いて異方性溶融物を形成するポリエステルと
は、父差偏光子を備える光学系に訃いて偏光を透過する
ポリエステルを云う。A polyester that forms an anisotropic melt according to the present invention refers to a polyester that transmits polarized light when used in an optical system that includes a differential polarizer.
かかるポリエステルの好ましいものとして、芳香族オキ
シカルボン酸の残基(1)、芳香族ジカルボン酸の残基
(4)、ハイドロキノンを主とする芳香族ジヒドロキシ
化合物の残基()及び炭酸残基()よりなり、且つ該残
基(1),(),()及び()の割合が式を満足するポ
リエステルBを挙げることができる。Preferred examples of such polyesters include aromatic oxycarboxylic acid residues (1), aromatic dicarboxylic acid residues (4), aromatic dihydroxy compound residues mainly containing hydroquinone (), and carbonic acid residues (). Polyester B can be mentioned, and the ratio of the residues (1), (), (), and () satisfies the formula.
該ポリエステルBを構成する芳香族オキシカルボン酸の
残基(1)は、p−オキシ安息香酸及び/又はその核置
換誘導体(例えば塩素原子、臭素原子、沃素原子等の如
きハロゲン原子;メチル、エチル等の如き低級アルキル
基;メトキシ、エトキシ等の如きアルコキシ基などの原
子又は基で、ベンゼン核の水素原子の少くとも1つが置
換されているp−オキシ安息香酸誘導体)の残基を主た
る対象とするが、その一部叉は全部を他の芳香族オキシ
カルボン酸及び/又はその核置換誘導体の残基で直換え
ることができる。前記p−オキシ安息香酸及びその核置
換誘導体の具体例としては、p−オキシ安息香酸、3−
クロル−4−オキシ安息香酸、3−ブロム−4−オキシ
安息香酸、3−メチル−4−オキシ安息香酸、3−メト
キシ−4−オキシ安息香酸、3.5−ジクロル−4−オ
キシ安息香酸、3.5−ジブロム−4一オキシ安息香酸
等を例示することができる。The aromatic oxycarboxylic acid residue (1) constituting the polyester B is p-oxybenzoic acid and/or its nuclear substituted derivatives (for example, halogen atoms such as chlorine, bromine, iodine, etc.; methyl, ethyl The main targets are residues of p-oxybenzoic acid derivatives in which at least one hydrogen atom of the benzene nucleus is substituted with an atom or group such as a lower alkyl group such as; an alkoxy group such as methoxy, ethoxy, etc. However, some or all of them can be directly replaced with residues of other aromatic oxycarboxylic acids and/or nuclear substituted derivatives thereof. Specific examples of the p-oxybenzoic acid and its nuclear substituted derivatives include p-oxybenzoic acid, 3-
Chlor-4-oxybenzoic acid, 3-bromo-4-oxybenzoic acid, 3-methyl-4-oxybenzoic acid, 3-methoxy-4-oxybenzoic acid, 3.5-dichloro-4-oxybenzoic acid, Examples include 3,5-dibromo-4-oxybenzoic acid.
これらのうち、特にp−オキシ安息香酸が好ましい。又
、p−オキシ安息香酸の残基は残基(1)中に50モル
%以上含有されることが特に好ましい。前記他の芳香族
オキシ安息香酸及びその核置換誘導体の具体例としては
、m−オキシ安息香酸、4−クロル−3−オキシ安息香
酸、4−ブロム−3−オキシ安息香酸、5−ブロム−3
−オキシ安息香酸、5−メチル−3−オキシ安息香酸、
オキシナフトエ酸、オキシジフエニルカルボン酸、クロ
ムオキシナフトエ酸、プロムオキシナフトエ酸等を例示
することができる。芳香族オキシカルボン酸は、また、
その一部(例えば50モル%以下、好ましくは30モル
%以下の割合)をε−オキシカプロン酸の如き脂肪族オ
キシカルボン酸又はシクロヘキサンオキシカルボン酸の
如き脂環族オキシカルボン酸で置換えることもできる。Among these, p-oxybenzoic acid is particularly preferred. Furthermore, it is particularly preferable that the residue of p-oxybenzoic acid is contained in the residue (1) in an amount of 50 mol% or more. Specific examples of the other aromatic oxybenzoic acids and their nuclear substituted derivatives include m-oxybenzoic acid, 4-chloro-3-oxybenzoic acid, 4-bromo-3-oxybenzoic acid, 5-bromo-3
-oxybenzoic acid, 5-methyl-3-oxybenzoic acid,
Examples include oxynaphthoic acid, oxydiphenylcarboxylic acid, chromium oxynaphthoic acid, and promoxynaphthoic acid. Aromatic oxycarboxylic acids are also
A part of it (for example, 50 mol% or less, preferably 30 mol% or less) may be replaced with an aliphatic oxycarboxylic acid such as ε-oxycaproic acid or an alicyclic oxycarboxylic acid such as cyclohexaneoxycarboxylic acid. can.
かかる芳香族オキシカルボン酸の残基(1)を与える化
合物としては、p〜オキシ安息香酸残基を例にとれば、
p−オキシ安息香酸の他にp−アセトキシ安息香酸の如
き低級脂肪族カルボン酸エステル、p−オキシ安息香酸
フエニルの如きアリールエステル、p−オキシ安息香酸
メチルの如き低級アルキルエステル、p−オキシ安息香
酸クロリドの如き酸・・ロゲン化物等が挙げられる。Examples of compounds that provide such aromatic oxycarboxylic acid residues (1) include p~oxybenzoic acid residues:
In addition to p-oxybenzoic acid, lower aliphatic carboxylic acid esters such as p-acetoxybenzoic acid, aryl esters such as phenyl p-oxybenzoate, lower alkyl esters such as methyl p-oxybenzoate, p-oxybenzoic acid Examples include acids such as chloride, chlorides, and the like.
また、芳香族ジカルボン酸の残基()としては、例えば
テレフタル酸、イソフタル酸、ナフタリンジカルボン酸
、ジフエニルジカルボン酸、メチルテレフタル酸、メチ
ルイソフタル酸、ジフエノキシエタンジカルボン酸等の
残基を挙げることができる。Furthermore, examples of aromatic dicarboxylic acid residues include residues such as terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid, diphenyl dicarboxylic acid, methyl terephthalic acid, methyl isophthalic acid, and diphenoxyethane dicarboxylic acid. be able to.
これらのうち特にテレフタル酸の残基、イソフタル酸の
残基が好ましい。かかる芳香族ジカルボン酸の残基(4
)を与える化合物としては、遊離のジカルボン酸の他に
そのアルキルエステル、アリールエステル、酸ハロゲン
化物等を挙げることができる。Among these, terephthalic acid residues and isophthalic acid residues are particularly preferred. Residues of such aromatic dicarboxylic acids (4
) can include, in addition to free dicarboxylic acids, their alkyl esters, aryl esters, acid halides, and the like.
尚、本発明では芳香族ジカルボン酸の残基(ト)の一部
(例えば50モル%以下、好ましくは30モル%以下)
として、コ・・ク酸、アジピン酸、セバチン酸等の如き
脂肪族ジカルボン酸;シクロヘキサンジカルボン酸の如
き脂環族ジカルボン酸等の他のジカルボン酸等の残基で
置換えてもよい。更に、上記ポリエステルBVCトいて
、残基()を形成する芳香族ジヒドロキシ化合物とは、
芳香核に2個のヒドロキシル基が直接結合している化合
物であり、一・イドロキノン及び/又はその核置換誘導
体(例えば塩素原子、臭素原子、沃素原子等の如きハロ
ゲン原子;メチル、エチル等の如き低級アルキル基;メ
トキシ、エトキシ等の如きアルコキシ基などの原子又は
基でベンゼン核の水素原子の少くとも1つが置換されて
いるハイドロキノン誘導体)を主たる対象とするが、そ
の一部(例えば50モル%以下、好ましくは30モル%
以下の割合)を他の芳香族ジヒドロキシ化合物、その核
置換誘導体及び/叉はジオールで置換えてもよい。In addition, in the present invention, a part (for example, 50 mol% or less, preferably 30 mol% or less) of the aromatic dicarboxylic acid residue (g)
It may be replaced with a residue of other dicarboxylic acids such as aliphatic dicarboxylic acids such as citric acid, adipic acid, sebacic acid, etc.; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. Furthermore, the aromatic dihydroxy compound forming the residue () in the polyester BVC is as follows:
It is a compound in which two hydroxyl groups are directly bonded to an aromatic nucleus, and mono-hydroquinone and/or its nuclear-substituted derivatives (e.g. halogen atoms such as chlorine, bromine, iodine, etc.; methyl, ethyl, etc.) The main target is lower alkyl groups (hydroquinone derivatives in which at least one hydrogen atom of the benzene nucleus is substituted with an atom or group such as an alkoxy group such as methoxy, ethoxy, etc.), but a portion thereof (for example, 50 mol% Below, preferably 30 mol%
(the following proportions) may be replaced by other aromatic dihydroxy compounds, their nuclear substituted derivatives and/or diols.
ハイドロキノン及びその核置換誘導体の具体例としては
、・・イドロキノン、塩化・・イドロキノン、臭化ハイ
ドロキノン、沃化ハイドロキノン、メチルハイドロキノ
ン、メトキシハイドロキノン等を例示することができる
。更に、他の芳香族ジヒドロキシ化合物及びその核置換
誘導体の具体例としては、レゾルシン、ジオキシナフタ
リン、ジオキシジフエニル、2.2−ビス(4−ヒドロ
キシフエニル)プロパン、1,1−ビス(4−ヒドロキ
シフエニノ(ハ)シクロヘキサン、塩化レゾルシン、臭
化レゾルシン、沃化レゾルシン、メチルレゾンシン、メ
トキシレゾルシン、臭化ジオキシナフタリン等を例示す
ることができる。また、ジオールとしては、エチレング
リコール、ネオペンチレングリコール等の如き脂肪族ジ
オール;シクロヘキサンジメチロール、シクロヘキサン
ジオール等の如き脂環族ジオール等を例示することがで
きる。これらは1種又は2種以上を用いることができ、
かかる芳香族ジヒドロキシ化合物の残基(11)を与え
る化合物としては、ハイドロキノンを例にとれば、p−
ジアセトキシベンゼン、p−ジベンゾイルオキシベンゼ
ン等の如き脂肪族もしくは芳香族カルボン酸のエステル
、或いは芳香族ヒドロキシ化合物とのカーボネート化合
物等が挙げられる。更にポリエステルBを構成する炭酸
残基()を与える化合物としては、ジフエニルカーボネ
ートの如きジアリールカーボネート、ホスゲンの如きハ
ロゲン化物等が挙げられる。Specific examples of hydroquinone and its nuclear-substituted derivatives include hydroquinone, hydroquinone chloride, hydroquinone bromide, hydroquinone iodide, methylhydroquinone, methoxyhydroquinone, and the like. Further, specific examples of other aromatic dihydroxy compounds and their nuclear substituted derivatives include resorcinol, dioxynaphthalene, dioxydiphenyl, 2,2-bis(4-hydroxyphenyl)propane, 1,1-bis( Examples include 4-hydroxyphenyno(ha)cyclohexane, resorcinol chloride, resorcinol bromide, resorcinol iodide, methylresorcinol, methoxyresorcinol, dioxynaphthalene bromide, etc. Also, as the diol, ethylene glycol, Examples include aliphatic diols such as neopentylene glycol; alicyclic diols such as cyclohexane dimethylol, cyclohexane diol, etc. These may be used alone or in combination of two or more,
Examples of compounds that provide the aromatic dihydroxy compound residue (11) include hydroquinone, such as p-
Examples include esters of aliphatic or aromatic carboxylic acids such as diacetoxybenzene and p-dibenzoyloxybenzene, or carbonate compounds with aromatic hydroxy compounds. Furthermore, examples of compounds that provide carbonic acid residues () constituting polyester B include diaryl carbonates such as diphenyl carbonate, halides such as phosgene, and the like.
ポリエステルBを構成する前記芳香族オキシカルボン酸
の残基(1)、芳香族ジカルボン酸の残基()、芳香族
ジヒドロキシ化合物の残基()及び炭酸残基()の割合
は、夫々のモル数をMI,M,M,Mとすると下記式を
満足する。The proportions of the aromatic oxycarboxylic acid residue (1), the aromatic dicarboxylic acid residue (), the aromatic dihydroxy compound residue (), and the carbonic acid residue () constituting the polyester B are the respective molar ratios. Letting the numbers be MI, M, M, M, the following formula is satisfied.
更に好ましくは、である。More preferably.
またMはO又はMより小さいモル数である。更にMIは
ポリマー中に10モル%以上含有されていることが好ま
しい。かかるポリエステルBは従来のポリエステル製造
方法により製造することができる。Moreover, M is O or a smaller number of moles than M. Furthermore, it is preferable that MI is contained in the polymer in an amount of 10 mol% or more. Such polyester B can be manufactured by a conventional polyester manufacturing method.
例えばp−オキシ安息香酸残基({)→( 》−CO−
),テレフタル酸(−0ε×()←ベマろ,ハード涜キ
ノン残基←{卜( ?=ら一)及び炭酸残基(−ハ一)
よりなるポリエステルは、(1) p−オキシ安息香酸
及び/又はp−オキシ安息香酸フエニル及び/又はp−
アセトキシ安息香酸とハイドロキノン及び/又はジアセ
トキシベンゼンとテレフタル酸及び/又はテレフタル酸
ジフエニルとジフエニルカーボネートとを溶融反応(必
要なら更に固相反応)或いは不活性溶媒下反応させる方
法、(2) p−オキシ安息香酸塩化物、ハイドロキノ
ン、テレフタル酸ジクロリド及びホスゲンをアルカリ溶
液下反応させる方法。For example, p-oxybenzoic acid residue ({) → ( 》-CO-
), terephthalic acid (-0ε×()←Bemaro, hard quinone residue←{卜(?=ra1) and carbonic acid residue (-ha1)
(1) p-oxybenzoic acid and/or phenyl p-oxybenzoate and/or p-
A method of reacting acetoxybenzoic acid, hydroquinone and/or diacetoxybenzene, terephthalic acid and/or diphenyl terephthalate, and diphenyl carbonate in a melt reaction (further solid phase reaction if necessary) or in an inert solvent, (2) p- A method of reacting oxybenzoic acid chloride, hydroquinone, terephthalic acid dichloride, and phosgene in an alkaline solution.
等により製造される。Manufactured by etc.
本発明において、異方性溶融物を形成するポリエステル
としては、前記ポリエステルBの他に、・・イドロキノ
ン核置換誘導体の残基及び芳香族ジカルボン酸の残基よ
りなるポリエステル例えばクロルハイドロキノン残基と
テレフタル酸残基及びジフエノオキシエタン一4,4′
−ジカルボン酸残基(モル比80:20〜70:30)
とよりなるコポリエステル、クロルハイドロキノン残基
又はメチルハイドロキノン残基とテレフタル酸残基及び
ナフタレン−2,6−ジカルボン酸残基(モル比70:
30)よりなるコポリエステル、クロルハイドロキノン
残基と4,45−ジオキシジフエニルエーテル残基(モ
ル比90:10)及びジフエニルエーテル一4,4′−
ジカルボン酸残基とよりなるコポリエステル等、ポリエ
チレンテレフタレートと・・イドロキノンの共重合ポリ
エステル、p−オキシ安息香酸の残基、芳香族ジカルボ
ィ酸の残基及びハイドロキノン残基よりなるポリエステ
ル例えばp−オキシ安息香酸残基、イソフタル酸残基及
びハイドロキノン残基(モル比60:40:40)より
なるコポリエステル、p−オキシ安息香酸残基、イソフ
タル酸残基及び4,42−ジオキシジフエニル残基(モ
ル比75:25:25)よりなるコポリエステルなど等
が挙げられる(特開昭50−158695号公報、特開
昭50−43223号公報、米国特許第3804805
号明細書参照)。In the present invention, polyesters forming an anisotropic melt include, in addition to the polyester B, polyesters consisting of residues of hydroquinone nuclear-substituted derivatives and residues of aromatic dicarboxylic acids, such as chlorohydroquinone residues and terephthalate. Acid residues and diphenoxyethane-4,4'
-Dicarboxylic acid residue (molar ratio 80:20 to 70:30)
A copolyester consisting of a chlorohydroquinone residue or a methylhydroquinone residue, a terephthalic acid residue, and a naphthalene-2,6-dicarboxylic acid residue (molar ratio: 70:
30), a copolyester consisting of chlorohydroquinone residue and 4,45-dioxydiphenyl ether residue (molar ratio 90:10) and diphenyl ether -4,4'-
Copolyesters made of dicarboxylic acid residues, copolyesters of polyethylene terephthalate and hydroquinone, polyesters made of p-oxybenzoic acid residues, aromatic dicarboxylic acid residues, and hydroquinone residues, such as p-oxybenzoic acid residues. Copolyester consisting of acid residue, isophthalic acid residue and hydroquinone residue (molar ratio 60:40:40), p-oxybenzoic acid residue, isophthalic acid residue and 4,42-dioxydiphenyl residue ( Copolyesters having a molar ratio of 75:25:25 (Japanese Patent Application Laid-open No. 158695/1982, Japanese Patent Application Laid-open No. 43223/1983, U.S. Patent No. 3804805)
(see specification).
本発明において前記ポリエステルの極限粘度は0.3以
上、更には0,5以上、特に0.8以上であることが好
ましい。In the present invention, the polyester preferably has an intrinsic viscosity of 0.3 or more, more preferably 0.5 or more, particularly 0.8 or more.
ここで極限粘度は2,4,6−トリクロロフエノール/
2,4,5−トリクロロフエノールの50/50(重量
比)の混合溶媒中35℃で測定した値である。またポリ
エステルには各種添加剤、例えば紫外線吸収剤、熱安定
剤、顔料、核剤等が含まれていてもよい。本発明に}い
ては上記異方性溶融物を形成するポリエステルを溶融押
出しして得られるフイルムAを使用する。Here, the intrinsic viscosity is 2,4,6-trichlorophenol/
This is a value measured at 35°C in a 50/50 (weight ratio) mixed solvent of 2,4,5-trichlorophenol. The polyester may also contain various additives such as ultraviolet absorbers, heat stabilizers, pigments, and nucleating agents. In the present invention, a film A obtained by melt-extruding the polyester forming the anisotropic melt is used.
該フイルムAは例えば200〜400℃、好ましくは2
30〜380℃程度で溶融せしめ、Tダイよりドラクト
1〜10、より好ましくは1〜5で押し出すことによつ
て得られる。この様にして得られたフイルムAは押出し
力向に配向して卦り、その方向の強度、ヤング率は製膜
、延伸及び熱処理して得られたポリエチレンテレJ■■
本発明の積層体を形成する該フイルムAは、押し出し方
向に30kg/Mm2以上の引張強度、700kg/1
tm2以上のヤング率を有していることが好ましい。尚
、本発明に使用するフイルムAは溶融押し出ししたまま
のものでもよいが、数%の延伸し、及び/叉は熱処理に
よつて更に強度、ヤング率、耐熱性を高めることが可能
である。熱処理をする場合の好ましい条件は200〜3
80℃の温度、常圧〜減圧下である。本発明の積層体は
、その構成するフイルムの少くとも二枚が上記異方性溶
融物を形成するポリエステルのフイルムAから成り、か
つそのうちの少くとも二枚はその押し出し方向が互いに
3♂以上に交叉してラミネートされていることが必要で
ある。The temperature of the film A is, for example, 200 to 400°C, preferably 2
It is obtained by melting it at about 30 to 380°C and extruding it through a T-die with drafts 1 to 10, more preferably 1 to 5. The film A obtained in this way is oriented in the extrusion force direction, and the strength and Young's modulus in that direction are the polyethylene tele J obtained by film forming, stretching and heat treatment.
The film A forming the laminate of the present invention has a tensile strength of 30 kg/Mm2 or more in the extrusion direction, and a tensile strength of 700 kg/1
It is preferable that the material has a Young's modulus of tm2 or more. The film A used in the present invention may be as-melted and extruded, but it is possible to further increase the strength, Young's modulus, and heat resistance by stretching it by several percent and/or heat treatment. The preferred conditions for heat treatment are 200-3
The temperature is 80° C. and the pressure is between normal pressure and reduced pressure. In the laminate of the present invention, at least two of the films constituting the film A are made of the polyester film A that forms the anisotropic melt, and at least two of the films are extruded in directions 3♂ or more from each other. It is necessary that they be laminated in a crossed manner.
異方性溶融物を形成するポリエステルのフイルムAは、
押し出し方向に配向している為押し出し方向には極めて
優れた性能を有しているが、直角方向に対しては幾分劣
るために二枚以上をフイルノムの押し出し方向が互いに
30二以上になるよう交叉せしめてバランスをとる必要
がある。The polyester film A forming an anisotropic melt is
Because it is oriented in the extrusion direction, it has extremely excellent performance in the extrusion direction, but it is somewhat inferior in the perpendicular direction. It is necessary to intersect and strike a balance.
好ましくは45め以上、より好ましくは600以上の交
叉である。本発明の積層体は上記ポリエステルフイルム
Aだけから形成されてもよいが、その他の樹脂フイルム
と合わせて積層されていてもよい。Preferably, the number of intersections is 45 or more, more preferably 600 or more. The laminate of the present invention may be formed only from the polyester film A, but may also be laminated together with other resin films.
その様な樹脂フイルムの例としては、ポリエチレンテレ
フタレート、ポリトリメチレンテレフタレート、ポリテ
トラメチレンテレフタレート、ポリヘキサメチレンテレ
フタレート、ポリエチレン−2,6一ナフタレンジカル
ボキシレート、ポリテトラメチレン−2,6−ナフタレ
ンジカルボキシレート等の如きポリエステル、ナイロン
6、ナイロン66等の如きポリアミド、ポリエチレン、
ポリプロピレン等の如きポリオレフイン等より成るフイ
ルムが例示される。これらは未延伸のままでもよく、又
延伸及び/又は熱処理されたものでもよい。本発明の積
層体を構成するフイルムの厚さは1〜1000μ、好ま
しくは5〜500μ程度である。積層体は二枚以上のフ
イルムを従来公知の方法、例えば熱により接着する方法
、超音波により接着する方法、コロナ放電により接着す
る方法、接着剤を使用する方法等により接着積層せしめ
ることによつて得られる。Examples of such resin films include polyethylene terephthalate, polytrimethylene terephthalate, polytetramethylene terephthalate, polyhexamethylene terephthalate, polyethylene-2,6-naphthalene dicarboxylate, and polytetramethylene-2,6-naphthalene dicarboxylate. polyester such as ester, polyamide such as nylon 6, nylon 66, polyethylene,
Examples include films made of polyolefins such as polypropylene. These may be left unstretched or may be stretched and/or heat treated. The thickness of the film constituting the laminate of the present invention is about 1 to 1000 microns, preferably about 5 to 500 microns. The laminate is produced by adhering and laminating two or more films by a conventionally known method, such as a method of bonding by heat, a method of bonding by ultrasonic waves, a method of bonding by corona discharge, a method of bonding by using an adhesive, etc. can get.
ここで接着剤を用いる以外の方法においてその接着時の
温度はポリエステルフイルムの流れ温度附近であり、好
ましくは流れ温度乃至流れ温度より10℃低い温度の範
囲であり、接着はフイルムに対して5k9/C7l又は
それ以下の圧力、例えば1kg/〜程度の圧力を加えて
行うことができる。また、接着層として前記樹脂フイル
ムを用いるときは、これらフィルムの流れ温度附近で前
記と同様の圧力を加えて接着させることができる。本発
明により得られる積層体は、縦,横にバランスのとれた
優れた機械的性能を有し、しかも耐熱性及び耐薬品性に
優れて}り、フイルム、シート、テープの形状で、磁気
テープ、被覆材等の如き用途に有用である。以下実施例
を挙げて本発明を説明する。In the case of methods other than using adhesives, the temperature at the time of adhesion is around the flow temperature of the polyester film, preferably in the range of the flow temperature or 10°C lower than the flow temperature, and the adhesion is 5k9/ This can be carried out by applying a pressure of C7l or lower, for example a pressure of about 1 kg/~. Further, when using the resin film as the adhesive layer, the same pressure as described above can be applied at a temperature close to the flow temperature of the film for adhesion. The laminate obtained by the present invention has excellent mechanical performance that is well-balanced vertically and horizontally, and has excellent heat resistance and chemical resistance. , coating materials, etc. The present invention will be explained below with reference to Examples.
なお例中の「部」は重量部を意味する。実施例 1
p−オキシ安息香酸96.7部、イソフタル酸49.8
部、ハイドロキノン38.5部及びジフエニルカーボネ
ート342.4部を酢酸第一スズ0.12部の存在下2
50〜280℃の温度、760〜0.3mmH9の圧力
下で反応せしめて極限粘度179のポリマーを得た。Note that "parts" in the examples mean parts by weight. Example 1 96.7 parts of p-oxybenzoic acid, 49.8 parts of isophthalic acid
2 parts, 38.5 parts of hydroquinone and 342.4 parts of diphenyl carbonate in the presence of 0.12 parts of stannous acetate.
The reaction was carried out at a temperature of 50 to 280°C and a pressure of 760 to 0.3 mmH9 to obtain a polymer having an intrinsic viscosity of 179.
このポリマーの組成は、pオキシ安息香酸残基A1・・
イドロキノン残基B1イソフタル酸残基C及び炭酸残基
DがA:B:C:D−50:25:21:4(モル比)
であつた。次いで、このポリマーを粉砕乾燥後、ルーダ
ータイプのフイルム成形機を用いてシリンダー温度33
0℃でT−ダイより150℃に加熱した回転ドラム上に
押し出した。得られたフイルムを0.02朋H9の減圧
下、250℃で3時間熱処理した。このフィルムの厚さ
は48μ、押出し方向の引張強度は56.2k9/Mm
2、ヤング率は2072.8k9/Mm2であつた。こ
のフイルムニ枚を押出し方向が直角になるように重ね合
せ、290′Cで5k9/C7iの圧力下に2分間置き
、接着させた。The composition of this polymer is p-oxybenzoic acid residue A1...
Idoquinone residue B1 isophthalic acid residue C and carbonic acid residue D are A:B:C:D-50:25:21:4 (molar ratio)
It was hot. Next, after pulverizing and drying this polymer, a Luder type film molding machine was used to reduce the cylinder temperature to 33°C.
It was extruded from a T-die at 0°C onto a rotating drum heated to 150°C. The obtained film was heat treated at 250° C. for 3 hours under reduced pressure of 0.02 H9. The thickness of this film is 48μ, and the tensile strength in the extrusion direction is 56.2k9/Mm.
2. Young's modulus was 2072.8k9/Mm2. The sheets of film were stacked so that the extrusion direction was perpendicular to each other, and placed under a pressure of 5k9/C7i at 290'C for 2 minutes to bond them together.
得られた積層フイルムの厚さは93μ、引張強度は37
.0k9/Mm2、ヤング率は1323.4k9/Mm
2であつた。また、積層フイルムは窒素気流中250℃
で24時間保持したが、熱収縮はみとめられなかつた。
実施例 2
p−オキシ安息香酸96.6部、ハイドロキノン33.
0部及びジフエニルカーボネート256.8部を酢酸第
一スズ0.12部の存在下、260〜320℃の温度、
760〜0.3mmHgの圧力下で反応せしめて極限粘
度1.29のポリマーを得た。The thickness of the obtained laminated film was 93μ, and the tensile strength was 37.
.. 0k9/Mm2, Young's modulus is 1323.4k9/Mm
It was 2. In addition, the laminated film was heated at 250°C in a nitrogen stream.
Although it was held for 24 hours, no heat shrinkage was observed.
Example 2 96.6 parts of p-oxybenzoic acid, 33 parts of hydroquinone.
0 parts and 256.8 parts of diphenyl carbonate in the presence of 0.12 parts of stannous acetate at a temperature of 260 to 320°C,
The reaction was carried out under a pressure of 760-0.3 mmHg to obtain a polymer with an intrinsic viscosity of 1.29.
このポリマーの組成はp−オキシ安息香酸残基A1・・
イドロキノン残基B及び炭酸残基DがA:B:D54:
23:23(モル比)であつた。次いで、該ポリマーを
粉砕乾燥後、ルーダータイプのフイルム成形機を用いて
シリンダー温度340℃でT−ダイより150℃に加熱
したドラム上に押し出した。The composition of this polymer is p-oxybenzoic acid residue A1...
Idoquinone residue B and carbonate residue D are A:B:D54:
The molar ratio was 23:23. Next, the polymer was pulverized and dried, and then extruded from a T-die onto a drum heated to 150°C using a Luder type film molding machine at a cylinder temperature of 340°C.
得られたフイルムの厚さは141μ、押し出し方向の引
張強度は40.8k9./InJヤング率は781.7
k9/Mm2であつた。このフイルムをフイルムAとす
る。別にテレフタル酸、コ・・ク酸及びエチレングリコ
ールから製造された共重合ポリエステル(テレフタル酸
残基E1コハク酸残基F及びエチレングリコールの残基
HはE:F:H=7:3:10(モル比)である)のフ
イルム(厚さ53μ)をフイルムBとして用いた。The thickness of the obtained film was 141μ, and the tensile strength in the extrusion direction was 40.8K9. /InJ Young's modulus is 781.7
It was k9/Mm2. This film will be referred to as film A. Separately, a copolymerized polyester produced from terephthalic acid, co-citric acid, and ethylene glycol (terephthalic acid residue E, succinic acid residue F, and ethylene glycol residue H are E:F:H=7:3:10 ( A film (thickness: 53 μm) with a molar ratio of 53 μm was used as film B.
上記フイルムAとフイルムBを、フイルムA1フイルム
B1フイルムAの順序で重ね、かつ上下のフイルムAの
押し出し方向が直角になるようにして、170℃の温度
で5k9/〜の圧力下に4分間プレスし、接着させた。Layer the above film A and film B in the order of film A, film B, film A, and press them for 4 minutes at a temperature of 170°C under a pressure of 5k9/~ so that the extrusion directions of the upper and lower films A are at right angles. and glued it.
得られた積層フイルムの厚さは293μ、引張強度は2
2.6k9/1tm2、ヤング率は502.4kg/!
Tm2であつた。The thickness of the obtained laminated film was 293μ, and the tensile strength was 2.
2.6k9/1tm2, Young's modulus is 502.4kg/!
It was Tm2.
実施例 3
p−オキシ安息香酸82.8部、イソフタル酸66.4
部、・・イドロキノン44.9部及びジフ一C′。Example 3 82.8 parts of p-oxybenzoic acid, 66.4 parts of isophthalic acid
44.9 parts of hydroquinone and Jif-C'.
ルカーボネート299.6部を酢酸第一スズ0.06部
の存在下250〜320′Cの温度、760〜0.3m
mH9の圧力下で反応せしめて極限粘度1.50のポリ
マーを得た。このポリマーの組成は、p−オキシ安息香
酸残基A1・・イドロキノン残基B及びイソフタル酸残
基CがA:B:C−60:40:40(モル比)であつ
た。299.6 parts of carbonate in the presence of 0.06 part of stannous acetate at a temperature of 250-320'C, 760-0.3 m
The reaction was carried out under a pressure of mH9 to obtain a polymer with an intrinsic viscosity of 1.50. The composition of this polymer was p-oxybenzoic acid residue A1...hydroquinone residue B and isophthalic acid residue C in a molar ratio of A:B:C-60:40:40.
次いで、このポリマーを粉砕乾燥後、ルーダータイプの
フイルム成形機を用いてシリンダー温度360℃でT−
ダイより150℃に加熱した回転ドラム上にドラフト率
3で押し出した。Next, after pulverizing and drying this polymer, it was T-shaped at a cylinder temperature of 360°C using a Luder type film forming machine.
It was extruded from a die onto a rotating drum heated to 150°C at a draft rate of 3.
得られたフイルムの厚さは75μ、押出し方向の引張強
度は31.5kg/7Itm2、ヤング率は800k9
/Mm2であつた。The thickness of the obtained film was 75μ, the tensile strength in the extrusion direction was 31.5kg/7Itm2, and the Young's modulus was 800k9.
/Mm2.
このフイルムニ枚を押出し方向が直角になるように重ね
合せ、290℃で2K1!/c−7Il.の圧力下に2
分間置き、接着させた。These films were stacked so that the extrusion direction was perpendicular to each other, and heated to 290°C for 2K1! /c-7Il. under the pressure of 2
Let it sit for a minute and let it adhere.
得られた積層フイルムの厚さは140μ、引張強度は1
8.5kg/Mm2、ヤング率は450k9/Mm2で
あつた。また、この積層フイルムを窒素気流中25『C
で24時間保持したが、積層フイルムの収縮はみとめら
れなかつた。The thickness of the obtained laminated film was 140μ, and the tensile strength was 1
The weight was 8.5 kg/Mm2, and the Young's modulus was 450k9/Mm2. In addition, this laminated film was heated at 25°C in a nitrogen stream.
Although the film was held for 24 hours, no shrinkage of the laminated film was observed.
実施例 4
クロルハイドロキノンジアセテート228.5部、テレ
フタル酸116.2部及びナフタレン−2,6ジカルボ
ン酸64.8部を、300〜350℃の温度、760〜
10mmH9の圧力下で反応せしめて極限粘度2。Example 4 228.5 parts of chlorohydroquinone diacetate, 116.2 parts of terephthalic acid and 64.8 parts of naphthalene-2,6 dicarboxylic acid were mixed at a temperature of 300-350°C, 760-
Reacted under a pressure of 10 mmH9, resulting in an intrinsic viscosity of 2.
01のポリマーを得た。Polymer No. 01 was obtained.
このポリマーの組成はテレフタル酸残基A1ナフタレン
2,6−ジカルボン酸残基B及びクロルハイドロキノン
残基CがA:B:C=70:30:100(モル比)で
あつた。次いでこのポリマーを粉砕後、ルーダータイプ
のフイルム成形機を用いてシリンダー温度330℃でT
−ダイより150℃に加熱した回転ドラム上に押し出し
た。The composition of this polymer was terephthalic acid residue A, naphthalene 2,6-dicarboxylic acid residue B, and chlorohydroquinone residue C in a ratio of A:B:C=70:30:100 (molar ratio). Next, after pulverizing this polymer, it was heated to T at a cylinder temperature of 330°C using a Luder type film forming machine.
- It was extruded from a die onto a rotating drum heated to 150°C.
Claims (1)
、該樹脂フィルムの少くとも二枚は溶融押出し法で得ら
れた異方性溶融物を形成するポリエステルのフィルムA
であり、且つ該フィルムAの少くとも二枚はその押出し
方向が互いに30以上交叉してラミネートされているこ
とを特徴とする積層体。 2 異方性溶融物を形成するポリエステルのフィルムA
の少くとも二枚が直接又は他の樹脂フィルムを介して接
合していることを特徴とする特許請求の範囲第1項記載
の積層体。 3 異方性溶融物を形成するポリエステルのフィルムA
が、芳香族オキシカルボン酸の残基( I )、芳香族ジ
カルボン酸の残基(II)、ハイドロキノンを主とする芳
香族ジヒドロキシ化合物の残基(III)及び炭酸残基(
IV)よりなり、且つ該残基( I )、(II)、(III)及
び(IV)の割合が式30/70≦(M_ I +M_II)
/(M_III−M_II)≦99/1、(2/3)・(M
_III−M_II)<M_IV≦(3/2)・(M_IIIM_
II)、但し、式中M_ I 、M_II、M_III、M_IVは
夫々上記残基( I )、(II)、(III)、(IV)のモル
数である。 なおM_IIは0又はM_IIIより小さいモル数である。
を満足するポリエステルのフィルムであることを特徴と
する特許請求の範囲第1項又は第2項記載の積層体。[Claims] 1. In a laminate in which two or more resin films are bonded, at least two of the resin films are polyester films A that form an anisotropic melt obtained by melt extrusion.
A laminate, characterized in that at least two of the films A are laminated with their extrusion directions crossing each other by 30 or more degrees. 2 Polyester film A forming an anisotropic melt
2. The laminate according to claim 1, wherein at least two sheets of the laminate are joined directly or via another resin film. 3 Polyester film A forming an anisotropic melt
However, residues of aromatic oxycarboxylic acids (I), residues of aromatic dicarboxylic acids (II), residues of aromatic dihydroxy compounds mainly containing hydroquinone (III), and carbonic acid residues (
IV), and the ratio of the residues (I), (II), (III) and (IV) is the formula 30/70≦(M_I +M_II)
/(M_III-M_II)≦99/1, (2/3)・(M
_III−M_II)<M_IV≦(3/2)・(M_IIIM_
II), where M_I, M_II, M_III, and M_IV are the number of moles of the above residues (I), (II), (III), and (IV), respectively. Note that M_II is 0 or a smaller number of moles than M_III.
The laminate according to claim 1 or 2, which is a polyester film that satisfies the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51026042A JPS5926471B2 (en) | 1976-03-12 | 1976-03-12 | laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51026042A JPS5926471B2 (en) | 1976-03-12 | 1976-03-12 | laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52109578A JPS52109578A (en) | 1977-09-13 |
JPS5926471B2 true JPS5926471B2 (en) | 1984-06-27 |
Family
ID=12182633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51026042A Expired JPS5926471B2 (en) | 1976-03-12 | 1976-03-12 | laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5926471B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562127A (en) * | 1979-06-22 | 1981-01-10 | Teijin Ltd | Manufacturing method for film of polyester |
JPS6189816A (en) * | 1984-10-09 | 1986-05-08 | Polyplastics Co | Manufacture of laminated film |
JPS61130041A (en) * | 1984-11-28 | 1986-06-17 | ポリプラスチックス株式会社 | Manufacture of molded shape having excellent size stability |
JPH0673179B2 (en) * | 1985-06-14 | 1994-09-14 | ポリプラスチックス株式会社 | Magnetic disk |
JPH0682893B2 (en) * | 1986-06-11 | 1994-10-19 | ポリプラスチックス株式会社 | Electrical component board |
DE69635219T2 (en) * | 1995-04-12 | 2006-07-13 | Sumitomo Chemical Co., Ltd. | Film made of a liquid-crystalline polyester composition |
-
1976
- 1976-03-12 JP JP51026042A patent/JPS5926471B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS52109578A (en) | 1977-09-13 |
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