JPS5924572A - Joining method of metal - Google Patents
Joining method of metalInfo
- Publication number
- JPS5924572A JPS5924572A JP13546682A JP13546682A JPS5924572A JP S5924572 A JPS5924572 A JP S5924572A JP 13546682 A JP13546682 A JP 13546682A JP 13546682 A JP13546682 A JP 13546682A JP S5924572 A JPS5924572 A JP S5924572A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- solder
- welding
- metals
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0004—Resistance soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は金属と金属との接合方法に関する。[Detailed description of the invention] The present invention relates to a method for joining metals together.
従来、金属と金属とを接合する場合、ハンダ付けが最も
多く用いられている。これはハンダ付けが最もｍ１便に
８１１にでもできるからである。また、特に電気部品の
接合には、ハンダ（＝Ｊけはγ［気前導通をとるのに最
も信頼性が高いことから広く用いられている。Conventionally, soldering is most often used to join metals together. This is because soldering can be done most easily on M1 and 811. In addition, solder (=J) is widely used, especially for joining electrical parts, because it is the most reliable for achieving generous conduction.
しかし、量産的にハンダ（＝Ｊけを行う場合、部品の給
料、固定、ハンダイｑりという一連の作業が自動化しに
＜＜、かつハンダ付は個所の導通の信頼性に問題がある
。またハンダ付（Ｊを行う加熱熱源として、ハンダごて
、チップヒーター、熱風等種々考えられるが、加熱１１
！ｆ間、冷却時間が必要なため、手作業を要すること、
また、自動化されたハンダ付けの生産能率向上に限界が
あるなどの問題がある。However, when soldering is performed in mass production, a series of operations such as parts mounting, fixing, and soldering must be automated, and soldering has problems with the reliability of conduction at parts. There are various possible heating sources for soldering (J), such as a soldering iron, a chip heater, and hot air.
! Manual work is required due to the cooling time required.
Further, there is a problem that there is a limit to the improvement in production efficiency of automated soldering.
本発明の目的は、以上に述べた従来の問題を解消した信
頼性高く高能率な金属の接合方法を提供するにある。An object of the present invention is to provide a highly reliable and highly efficient metal joining method that solves the conventional problems described above.
第１図に本発明の実施例について断面図を示す。FIG. 1 shows a sectional view of an embodiment of the present invention.
第１図において、本発明は金属１と金属２とをハンダ６
を介して密着さぜた後（第１図Ａ）、電気溶接により接
合する（第１図Ｂ）ことを特徴とする金属の接合方法で
ある。４は電気溶接イ癌の溶接ヘッド（図示せず）に連
結する十電１ｉ１ｉ、５は下電極を示す。In FIG. 1, the present invention connects metal 1 and metal 2 with solder 6.
This is a method of joining metals, which is characterized in that the metals are brought into close contact with each other through (FIG. 1A) and then joined by electric welding (FIG. 1B). Reference numeral 4 indicates a ten electrode 1i1i connected to a welding head (not shown) of an electric welding gun, and 5 indicates a lower electrode.
本発明の他の実施例を第２図に断面図で示す。Another embodiment of the invention is shown in cross-section in FIG.
第２図において、１は電気部品（水晶振動子。In Fig. 2, 1 is an electrical component (crystal oscillator).
抵抗、コンデンサー等）のリード端子であり、銅、コバ
ール、デュメット線等でできており、その表面にハンダ
６がメッキされているものである。These are lead terminals for resistors, capacitors, etc.), and are made of copper, Kovar, dumet wire, etc., and have solder 6 plated on their surfaces.
接合は前記第１図の実施例と同様に行ぞば良い。The bonding may be performed in the same manner as in the embodiment shown in FIG.
以上本発明は、金属１と金属２とを電気溶接の溶接電流
により加熱溶接し、さらにその溶接時の熱でハンダも溶
融することにより、第１図Ｂに示すように、溶接部の周
囲にハンダを回り込ませて固着させるため、溶接のみ、
またはハンダ＋Ｉりのみの接合方法に比べ、より以上の
接合強□度を得ることができる。また、ハンダにより確
実に接合されるため、電気的導通の面で信頼性が向上す
る。As described above, the present invention heat-welds metal 1 and metal 2 using a welding current of electric welding, and further melts the solder with the heat during welding, so that the welded area is formed around the welded part as shown in FIG. 1B. Only welding is required to wrap the solder around and secure it.
Alternatively, it is possible to obtain a higher bonding strength than a bonding method using only solder + I. Furthermore, since they are reliably joined by solder, reliability is improved in terms of electrical continuity.
さらにまた、ハンダの加熱冷却時間について分析してみ
ると、加熱は溶接と同１１！ｆに短時間に行われ、冷却
は母材が溶接後ハンダの熱を吸収するため早く冷却同化
する。このため、加熱冷却時間を畑縮することができ作
業機率が向上する。Furthermore, when we analyze the heating and cooling time of solder, we find that the heating time is the same as that of welding! The base metal absorbs the heat of the solder after welding, so the base metal cools and assimilates quickly. Therefore, the heating and cooling time can be shortened and the efficiency of working equipment can be improved.
さらに本発明の他の実施例を第６図、第４図に示す。７
は金属２の表面にメッキ等により設けられたハンダを示
し、接合は前記実施例と同様の方法で行えばよい。第４
図において、８け金属１の表面にメッキ等により設けら
れたハンダを示し、９は金属２の表面にメッキ等により
殺けられたハンダを示し、９は金属２の表面にメッキ等
により設けられたハンダを示す。接合は前記実施例と同
様の方法で行えばよい。Further, other embodiments of the present invention are shown in FIGS. 6 and 4. 7
indicates solder provided on the surface of the metal 2 by plating or the like, and bonding may be performed by the same method as in the previous embodiment. Fourth
In the figure, 8 indicates solder provided on the surface of metal 1 by plating or the like, 9 indicates solder that has been removed by plating or the like on the surface of metal 2, and 9 indicates solder provided on the surface of metal 2 by plating or the like. The solder is shown below. Bonding may be performed in the same manner as in the previous embodiment.
以上本発明は、どちらか一方あるいは両方がハンダメッ
キされた金属と金属とを密着させて電気溶接により、溶
接、ハンダイ１けを同時に行わせるものである。つまり
、ハンダメッキされた内部の金属と接合される相手金属
とが電気溶接され、それと同時に溶接熱でハンダメッキ
が溶融し、溶接部分の周りをハンダで固めてしまうこと
を特徴とし、前記実施例で説明したように接合強度の向
」二が図られること、電気的導通の面で信頼が向上する
こと、作業１７１：率の向上が図られることなど多くの
利点を有する金属の接合方法である。尚、本実施例では
電極が金属を挾持するよう配ｆｊ（されているが、同一
の側に並べて配置しても良い。As described above, the present invention is to simultaneously perform welding and soldering by electric welding by bringing two metals, one or both of which are solder-plated, into close contact with each other. In other words, the solder-plated internal metal and the mating metal to be joined are electrically welded, and at the same time, the solder plating is melted by the welding heat, and the area around the welded part is solidified with solder. As explained in 171, this is a method of joining metals that has many advantages, such as improving the joint strength, improving reliability in terms of electrical continuity, and improving work efficiency. . Incidentally, in this embodiment, the electrodes are arranged so as to sandwich the metal, but they may be arranged side by side on the same side.
第５図、第６図に本発明による電気部品の接合例を平面
図で示す。FIGS. 5 and 6 are plan views showing examples of joining electrical components according to the present invention.
第５図において、１０は電気部品、１１はリード端子、
１２は搬送用の金Ｒ仮あるいはパターン電極を施した回
路基板などである。In FIG. 5, 10 is an electrical component, 11 is a lead terminal,
Reference numeral 12 denotes a circuit board or the like provided with gold R temporary or patterned electrodes for transportation.
ｆＰＪ６図において、１３はアキシー）・ルタイブの１
１気部品、１４はリード端子、１５は金属板（回路基板
）である。In the fPJ6 diagram, 13 is Axie) Lutaib's 1
1 is a component, 14 is a lead terminal, and 15 is a metal plate (circuit board).
第１図、第２図、第３図、第４図は本発明の実施例を示
す断面図である。各図中（Ａ）図は溶接前、（Ｂ）図は
溶接後の溶接部分の断面図を示す・第５図、第６図は本
発明による電気部品の接合例を示す平面図である。
１・・・金属１ ２・・・金ＦＡ２３・・・ハン
ダ ４・・・土電ノ１「（５・・・下電極
６．７，８．９・・・ハンダメッキ
１０・・・電気部品 １１・・・リード端子１２・
・・金属板
１３・・・アギンヤルタイグ電気部品
１４・・・リード端子 １５・・・金属板以 」ニ
（Ａ） 才３図 （巳）
（Ａ） 才＋図 （Ｂ）1, 2, 3, and 4 are sectional views showing embodiments of the present invention. In each figure, (A) shows a cross-sectional view of the welded part before welding, and (B) shows a cross-sectional view of the welded part after welding. FIGS. 5 and 6 are plan views showing examples of joining electrical parts according to the present invention. 1...Metal 1 2...Gold FA23...Solder 4...Doden No. 1 (5...Lower electrode 6.7, 8.9...Solder plating 10...Electrical component 11... Lead terminal 12.
...Metal plate 13...Aginyaltaig electrical parts 14...Lead terminal 15...Metal plate (A) Figure 3 (Snake) (A) Figure + Figure (B)
Claims (1)
とをハンダを介して密着した後、電気溶接により接合す
ることを特徴とする金属の接合方法。 ２、 金属１にハンダメッキを施す。 特許請求の範囲第１項記載の金属の接合方法・ ６ 金属２にハンダメッキを施す。 特許請求の範囲第１項記載の金属の接合方法。 ４ 金属１および金属２の双方にノ＼ンダメツキを施す
。 特、′ｉ′は１゛１求の範囲第１項記載の金属の接合方
法０[Claims] 1. In a metal-to-metal joining method, metal 1 and metal 2
A method of joining metals, which is characterized in that the metals are brought into close contact with each other through solder and then joined by electric welding. 2. Apply solder plating to metal 1. Method for joining metals according to claim 1. 6. Applying solder plating to the metal 2. A method for joining metals according to claim 1. 4. Dampen both Metal 1 and Metal 2. In particular, 'i' is in the range of 1゛1.Metal joining method described in item 10
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13546682A JPS5924572A (en) | 1982-08-03 | 1982-08-03 | Joining method of metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13546682A JPS5924572A (en) | 1982-08-03 | 1982-08-03 | Joining method of metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5924572A true JPS5924572A (en) | 1984-02-08 |
Family
ID=15152365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13546682A Pending JPS5924572A (en) | 1982-08-03 | 1982-08-03 | Joining method of metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5924572A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156152A (en) * | 1976-06-22 | 1977-12-26 | Fuji Electric Co Ltd | Method of brazing conductor |
| JPS55106672A (en) * | 1979-02-08 | 1980-08-15 | Nachi Fujikoshi Corp | Brazing method in oxydation-free atmosphere |
-
1982
- 1982-08-03 JP JP13546682A patent/JPS5924572A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156152A (en) * | 1976-06-22 | 1977-12-26 | Fuji Electric Co Ltd | Method of brazing conductor |
| JPS55106672A (en) * | 1979-02-08 | 1980-08-15 | Nachi Fujikoshi Corp | Brazing method in oxydation-free atmosphere |
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