JPS59232117A - Curing of epoxy resin - Google Patents
Curing of epoxy resinInfo
- Publication number
- JPS59232117A JPS59232117A JP10594983A JP10594983A JPS59232117A JP S59232117 A JPS59232117 A JP S59232117A JP 10594983 A JP10594983 A JP 10594983A JP 10594983 A JP10594983 A JP 10594983A JP S59232117 A JPS59232117 A JP S59232117A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- polythiol
- epoxy resin
- curing agent
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、エポキシ樹脂の硬化方法で、特に比較的低温
、たとえば常温、またはそれ以下の温度で著しく速やか
に硬化させることのできるエポキシ樹脂の硬化方法に関
するものである。特に、本発明はポリチオール系硬化剤
に特定の硬化触媒を併用させることにより、低温で速や
かに硬化し、しかも可使時間が長く接着性良好な硬化物
を与えるエポキシ樹脂の硬化方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for curing an epoxy resin, and particularly to a method for curing an epoxy resin that can be cured extremely quickly at a relatively low temperature, for example, room temperature or lower. In particular, the present invention relates to a method for curing an epoxy resin that cures quickly at low temperatures and provides a cured product with a long pot life and good adhesive properties by using a polythiol curing agent in combination with a specific curing catalyst. .
従来、エポキシ樹脂を常温で硬化させる場合、硬化剤と
してポリアミン類、またはポリアミド類を単独で使用す
るか、あるいはこれらに硬化促進剤どしてフェノール類
、アルコール類などをイタ1用してきたが、十分に満足
のできる硬化速度が得られなかった。また、ポリチオー
ル類を硬化剤として使用ずれば、常温でもエポキシ樹脂
を硬化させることができるが、この場合も硬化速度が遅
い欠点があった。また、多くの場合ポリチオール系硬化
剤に塩基性物質を併用して硬化速度の向上をはかつてい
るが、相溶性が悪かったり、適当な可使時間と十分な硬
化速度が得られず、実用上満足のい(ものではなかった
。Conventionally, when curing epoxy resins at room temperature, polyamines or polyamides have been used alone as curing agents, or phenols, alcohols, etc. have been used as curing accelerators for these. A fully satisfactory curing rate could not be obtained. Furthermore, if polythiols are used as a curing agent, the epoxy resin can be cured even at room temperature, but this also has the drawback of slow curing speed. In addition, in many cases, a basic substance is used in combination with a polythiol curing agent to improve the curing speed, but the compatibility is poor or an appropriate pot life and sufficient curing speed cannot be obtained, making it impractical for practical use. It wasn't satisfying.
たとえば、ポリチオール系硬化剤にポリエチレンポリア
ミン類を併用した場合、硬化速度が十分でなく、ポリチ
オール系硬化剤に比較的硬化の速いジエチレントリアミ
ンを併用した場合でも十分な硬化速度が得られず、さら
にポリチオール類との相溶性が悪い欠点があった。また
、ポリチオール系硬化剤にポリアミド類を併用させた場
合でも硬化速度が十分でなかった。さらにポリチオール
系硬化剤にジアザビシクロアルケン類(DBI )を併
用させた場合は、可使時間が極めて短く、実用土使用不
可能であった。ポリチオール系硬化剤に2.4.6−ト
リス(ジメチルアミノメチル)フェノールを併用した場
合は比較的硬化が速いが、まだ十分でなく、にり速硬化
のエポキシ樹脂の硬化方法の開発が必要であった。また
、2.4.6−トリス(ジメチルアミノメチル)フェノ
ールは皮膚毒性が高く、より低毒性の硬化触媒の開発が
望まれていた。For example, when a polythiol-based curing agent is used in combination with polyethylene polyamines, the curing speed is insufficient, and even when a polythiol-based curing agent is used together with diethylenetriamine, which has a relatively fast curing rate, a sufficient curing speed cannot be obtained. It had the disadvantage of poor compatibility with Further, even when a polyamide was used in combination with a polythiol curing agent, the curing speed was not sufficient. Furthermore, when a diazabicycloalkene (DBI) was used in combination with a polythiol curing agent, the pot life was extremely short and it was impossible to use it in practical soil. When 2.4.6-tris(dimethylaminomethyl)phenol is used in combination with a polythiol-based curing agent, curing is relatively fast, but it is still not sufficient, and it is necessary to develop a curing method for epoxy resins that cures quickly. there were. Furthermore, 2.4.6-tris(dimethylaminomethyl)phenol has high skin toxicity, and it has been desired to develop a curing catalyst with lower toxicity.
本発明者らは実用可能なエポキシ樹脂の低温硬化方法に
ついて鋭意研究を重ねた結果、ポリチオール系硬化剤に
脂肪族3級アミンを併用させることにより、低温におい
ても作業が十分可能な可使時間を持ち、しかも速やかに
硬化さぼることかできることを見出し、本発明に到達し
た。The present inventors have conducted intensive research on a practical low-temperature curing method for epoxy resins, and found that by using a polythiol-based curing agent in combination with an aliphatic tertiary amine, the pot life is long enough to enable work even at low temperatures. The inventors have discovered that the present invention can be achieved by discovering that it can be cured quickly and without curing.
本発明はエポキシ樹脂をポリチオール系硬化剤で硬化せ
しめる際、硬化触媒として環状、または非環状脂肪族3
級アミンを使用することを特徴とするエポキシ樹脂の硬
化方法である。In the present invention, when curing an epoxy resin with a polythiol curing agent, a cyclic or acyclic aliphatic compound is used as a curing catalyst.
This is an epoxy resin curing method characterized by using a class amine.
本発明におけるエポキシ樹脂としては通常用いられてい
る各種のエポキシ樹脂が使用できる。たとえば、ビスフ
ェノール系グリシジル型エポキシ樹脂(シェル化学社、
エピコート828など)、ノボラック型エポキシ樹脂(
シェル化学社、エピコート152など)等が使用される
。As the epoxy resin in the present invention, various commonly used epoxy resins can be used. For example, bisphenol-based glycidyl-type epoxy resin (Shell Chemical Co., Ltd.,
Epikote 828, etc.), novolac type epoxy resin (
Shell Chemical Co., Ltd., Epicote 152, etc.) are used.
本発明において用いられるポリチオール系硬化剤として
は1分子中に平均2個以」−のチオール基を有するチオ
ール化合物が使用される。すなわち、1.4−ブタンジ
チオール、1.8−オクタジエンジチオールなどのアル
キルチオール化合物、チオグルコン酸とトリメチロール
プロパン1〜リチオグリコレート、ペンタエリスリトー
ルテトラチオグリコレートなどとのエステル化反応で得
られるチオール化合物、エポキシ化合物と硫化水素との
反応によって得られるチオール化合物、ビス(ジクロロ
エチル)ホルマールと多硫化ソーダとの反応によって得
られるチオール化合物、2.2′〜ビスメルカプトジエ
チルエーテル
ル化合物とエポキシ化合物との反応で得られる末端チオ
ール基を有するチオール化合物などがあげられる。As the polythiol curing agent used in the present invention, a thiol compound having an average of two or more thiol groups in one molecule is used. That is, thiols obtained by esterification reactions of alkylthiol compounds such as 1,4-butanedithiol and 1,8-octadienedithiol, thiogluconic acid and trimethylolpropane 1-lithioglycolate, pentaerythritol tetrathioglycolate, etc. compound, a thiol compound obtained by the reaction of an epoxy compound and hydrogen sulfide, a thiol compound obtained by the reaction of bis(dichloroethyl) formal and sodium polysulfide, 2.2' ~ bismercapto diethyl ether compound and an epoxy compound Examples include thiol compounds having a terminal thiol group obtained by the reaction of
3−
さらに、本発明で用いられる好ましいポリチオール系硬
化剤としては、一般式
%式%]
(ただし、×の平均値は1.5〜2.5、R□、R2は
炭素数が2へ・6で、チオール基を1〜2個含むアルキ
ル基であり、mi、m2はOまたは1、nは1〜20で
ある。)で示される液状ポリサルファイドポリマーであ
り、より好ましくは平均分子量が500〜2000の液
状ポリサルファイドポリマーである。3- Furthermore, as a preferable polythiol curing agent used in the present invention, the general formula % formula %] (However, the average value of × is 1.5 to 2.5, R□, R2 is a carbon number of 2, 6 is an alkyl group containing 1 to 2 thiol groups, mi and m2 are O or 1, and n is 1 to 20), and more preferably has an average molecular weight of 500 to 20. 2000 liquid polysulfide polymer.
本発明において硬化触媒として使用されるアミン類とし
ては、
1
\
− R2
L
5−
4−
または、
(ただし、R工はメチル基、またはピペリジン基、R2
は炭素数1〜20のアルキル基、R3は炭素数1〜20
のアルキレン基)であられされる、N, N−ジメチル
エチルアミン、N,N−ジメチルプロピルアミン、N,
N−ジメチルペンチルアミン、N,N−ジメチルドデシ
ルアミン、N,N−ジメチルへキサドデシルアミン、N
,N−ジメチルエタノールアミン、N,N−ジメチルプ
口パノール6ー
アミン、N、N−ジメヂルイソブロパノールアミン、N
−ジメチルブタノールアミン、N、N−ジメヂルシクロ
ヘキシルアミン、N、 N、 N’、N’−テ1へラメ
デルメチレンジアミン、N、 N、 N’、N’−デ1
〜ラメヂルエヂレンジアミン、NXN、N’、N′−テ
トラメチルプロパンジアミン、N、N、N’、蔭−テト
ラメチルへキサメチレンジアミン、N、N 、 N’、
N’−テ1−ラメチルウンデ力メヂレンジアミン、N−
メチルピペリジン、N、N’−ジメチルピペラジン、N
、N、N’、N′、N“、N“−へキサメヂル−1,6
,11−ウンデカメチレントリアミン、N1N′、N″
−トリス(ジメチルアミノプロピル)へキサヒドロ−8
−1−リアジン、NXN1N−トリス(ジメチルアミノ
プロピル)アミン、N1N−ビス(ジメチルアミノエチ
ル)メチルアミンなどがあげられる。The amines used as a curing catalyst in the present invention include 1 \ - R2 L 5- 4- or (where R is a methyl group, a piperidine group, R2
is an alkyl group having 1 to 20 carbon atoms, and R3 is an alkyl group having 1 to 20 carbon atoms.
N,N-dimethylethylamine, N,N-dimethylpropylamine, N,
N-dimethylpentylamine, N,N-dimethyldodecylamine, N,N-dimethylhexadodecylamine, N
, N-dimethylethanolamine, N,N-dimethylpropanol-6-amine, N,N-dimethylisopropanolamine, N
-dimethylbutanolamine, N,N-dimedylcyclohexylamine, N,N,N',N'-te1, ramedelmethylenediamine, N,N,N',N'-de1
~ Ramedyl ethylene diamine, NXN, N', N'-tetramethylpropanediamine, N, N, N', Yin-tetramethylhexamethylene diamine, N, N, N',
N'-teramylenediamine, N-
Methylpiperidine, N,N'-dimethylpiperazine, N
, N, N', N', N", N"-hexamyl-1,6
, 11-undecamethylene triamine, N1N', N''
-Tris(dimethylaminopropyl)hexahydro-8
-1-Ryazine, NXN1N-tris(dimethylaminopropyl)amine, N1N-bis(dimethylaminoethyl)methylamine, and the like.
本発明における3級アミン硬化触媒の使用Wは、エポキ
シ樹脂の種類やポリチオール系硬化剤の種類、硬化触媒
の種類によって変化し、−概に一般1、 的な規定
はできないが、通常、エポキシ樹脂10O重吊部に対し
て3〜20重量部重量部用する。The use W of the tertiary amine curing catalyst in the present invention varies depending on the type of epoxy resin, the type of polythiol curing agent, and the type of curing catalyst. Use 3 to 20 parts by weight for a 10O heavy lifting part.
また、本発明におけるポリチオール系硬化剤の使用量は
エポキシ樹脂の種類やポリチオール系硬化剤の種類、硬
化触媒の種類によって変化し、−概に一般的な規定はで
きないが、通常エポキシ樹脂100重量部に対して、1
0〜150重量部程度使置部る。In addition, the amount of polythiol curing agent used in the present invention varies depending on the type of epoxy resin, the type of polythiol curing agent, and the type of curing catalyst. For, 1
Approximately 0 to 150 parts by weight should be used.
本発明の硬化方法では必要に応じて充填剤、顔料、軟化
剤、流れ抑制剤、希釈剤等の各種添加剤を添加すること
ができる。これらの添加剤はあらかじめエポキシ樹脂お
よびポリチオール系硬化剤の一方または両方に添加する
ことができるし、硬化触媒に添加しておくことも可能で
ある。さらに、エポキシ樹脂どポリチオール系硬化剤の
混合時に添加することも可能である。In the curing method of the present invention, various additives such as fillers, pigments, softeners, flow inhibitors, and diluents can be added as necessary. These additives can be added in advance to one or both of the epoxy resin and the polythiol curing agent, or can also be added to the curing catalyst. Furthermore, it can also be added at the time of mixing the epoxy resin or polythiol curing agent.
本発明の硬化方法による硬化物は耐水性、耐薬品性、可
撓性、接着性にすぐれ、特に乾燥面のみならず、湿潤面
接着に良好な特性を示す耐水性低温硬化型接着剤として
利用することができる。The cured product obtained by the curing method of the present invention has excellent water resistance, chemical resistance, flexibility, and adhesive properties, and is used as a water-resistant low-temperature curing adhesive that exhibits particularly good properties for adhesion not only to dry surfaces but also to wet surfaces. can do.
本発明の硬化方法による硬化物は家庭用、工業7−
用、土木建築用接着剤として重要であるが、塗料、注型
および積層樹脂としても利用することができる。The cured product obtained by the curing method of the present invention is important as an adhesive for household use, industry, and civil engineering and construction, but it can also be used as a paint, casting, and laminated resin.
次に実施例および比較例をあげて、さらに詳述する。Next, Examples and Comparative Examples will be given and further details will be given.
実施例1〜7
■ビコート828(シェル化学社、ビスフェノールA系
エポキシ樹脂、エポキシ当11190)4.0gに一般
式(1)で現わされるポリチオール系硬化剤(東しチオ
コール社、 商品名E1−−70、メルカプタン当量2
00〜250>4.OQと硬化触媒0.40を均一に混
合して、20℃における可使時間(混合開始から急激に
粘度が上昇するまでの時間)、および硬化時間(混合物
が硬化して指触によりタックフリーとなる時間〉を測定
した。その結果は表1に示した。Examples 1 to 7 ■ 4.0 g of Bicoat 828 (Shell Chemical Co., Ltd., bisphenol A-based epoxy resin, epoxy 11190) and a polythiol-based curing agent represented by the general formula (1) (Toshi Thiokol Co., Ltd., trade name E1) --70, mercaptan equivalent 2
00-250>4. OQ and curing catalyst 0.40 are mixed uniformly, and the pot life (time from the start of mixing until the viscosity suddenly increases) at 20°C and the curing time (the mixture hardens and becomes tack-free to the touch) are determined. The results are shown in Table 1.
比較例1〜3
実施例1〜7と同様にして可使時間と硬化時間の測定を
行なった。結果は表1に示した。Comparative Examples 1-3 The pot life and curing time were measured in the same manner as in Examples 1-7. The results are shown in Table 1.
実施例8〜10
9−
8−
エピコート828.2.Oo硬化触媒0.2゜を均一に
混合した。混合物を接着剤として使用し、20℃で24
時間硬化させIC8硬化物の引張り剪断接着強さをJ
l5K6850に従って測定した。Examples 8-10 9- 8- Epicote 828.2. 0.2° of Oo curing catalyst was mixed uniformly. The mixture was used as an adhesive at 24°C at 20°C.
The tensile shear adhesive strength of the IC8 cured product was determined by J
Measured according to I5K6850.
測定結果は表2に示した。The measurement results are shown in Table 2.
実施例11〜13
20℃で8時間硬化させた後、20℃の水に16時間浸
漬させたほかは実施例8〜1oと同様にして接着強さを
測定した。結果は表2に示した。Examples 11 to 13 After curing at 20°C for 8 hours, adhesive strength was measured in the same manner as Examples 8 to 1o, except that the samples were immersed in water at 20°C for 16 hours. The results are shown in Table 2.
10−10-
Claims (1)
、硬化触媒として環状、または非環状脂肪族3級アミン
を使用することを特徴とするエポキシ樹脂の硬化方法。A method for curing an epoxy resin, which comprises using a cyclic or acyclic aliphatic tertiary amine as a curing catalyst when curing the epoxy resin with a polythiol-based curing agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10594983A JPS59232117A (en) | 1983-06-15 | 1983-06-15 | Curing of epoxy resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10594983A JPS59232117A (en) | 1983-06-15 | 1983-06-15 | Curing of epoxy resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59232117A true JPS59232117A (en) | 1984-12-26 |
Family
ID=14421088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10594983A Pending JPS59232117A (en) | 1983-06-15 | 1983-06-15 | Curing of epoxy resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59232117A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPS62133425A (en) * | 1985-12-06 | 1987-06-16 | Sumitomo Bakelite Co Ltd | Composition of sealing material for liquid crystal cell |
US5128424A (en) * | 1991-07-18 | 1992-07-07 | Japan Synthetic Rubber Co., Ltd. | Epoxy resin, mercato curing agent and polysulfide adduct |
JPH04363318A (en) * | 1991-06-11 | 1992-12-16 | Sumitomo Rubber Ind Ltd | Quick-curing epoxy resin composition and method for forming coated floor using the composition |
WO1997006198A1 (en) * | 1995-08-04 | 1997-02-20 | Asahi Denka Kogyo Kabushiki Kaisha | Curable epoxy resin composition which gives flexible cured article |
WO1998006766A3 (en) * | 1996-08-08 | 1998-08-13 | Rene Becerra Brambila | Catalytic curing agent for resins and method for making the same |
EP0872505A1 (en) * | 1997-04-16 | 1998-10-21 | Ciba Spezialitätenchemie Bergkamen GmbH | Curable compositions based on glycidyl compounds, amine hardeners and heterocyclic accelerators |
WO2013089000A1 (en) * | 2011-12-15 | 2013-06-20 | 東レ・ファインケミカル株式会社 | Curable composition |
CN103347925A (en) * | 2010-12-17 | 2013-10-09 | 陶氏环球技术有限责任公司 | Curable composition |
JP2016079313A (en) * | 2014-10-20 | 2016-05-16 | 京セラケミカル株式会社 | Repairable adhesive composition and electric and electronic component |
US9751973B2 (en) | 2010-06-24 | 2017-09-05 | Hexion Inc. | Epoxy systems for composites |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5381598A (en) * | 1976-12-27 | 1978-07-19 | Nakamura Yoshirou | Epoxy resin compound |
JPS5571763A (en) * | 1978-11-24 | 1980-05-30 | Dainippon Toryo Co Ltd | Epoxy resin coating composition |
JPS5978230A (en) * | 1982-10-26 | 1984-05-07 | Yuka Shell Epoxy Kk | Room temperature-curable epoxy resin composition |
-
1983
- 1983-06-15 JP JP10594983A patent/JPS59232117A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5381598A (en) * | 1976-12-27 | 1978-07-19 | Nakamura Yoshirou | Epoxy resin compound |
JPS5571763A (en) * | 1978-11-24 | 1980-05-30 | Dainippon Toryo Co Ltd | Epoxy resin coating composition |
JPS5978230A (en) * | 1982-10-26 | 1984-05-07 | Yuka Shell Epoxy Kk | Room temperature-curable epoxy resin composition |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6090217A (en) * | 1983-10-24 | 1985-05-21 | Dainippon Ink & Chem Inc | Epoxy resin composition for new construction or repair and application material containing the same |
JPS62133425A (en) * | 1985-12-06 | 1987-06-16 | Sumitomo Bakelite Co Ltd | Composition of sealing material for liquid crystal cell |
JPH04363318A (en) * | 1991-06-11 | 1992-12-16 | Sumitomo Rubber Ind Ltd | Quick-curing epoxy resin composition and method for forming coated floor using the composition |
US5128424A (en) * | 1991-07-18 | 1992-07-07 | Japan Synthetic Rubber Co., Ltd. | Epoxy resin, mercato curing agent and polysulfide adduct |
WO1997006198A1 (en) * | 1995-08-04 | 1997-02-20 | Asahi Denka Kogyo Kabushiki Kaisha | Curable epoxy resin composition which gives flexible cured article |
WO1998006766A3 (en) * | 1996-08-08 | 1998-08-13 | Rene Becerra Brambila | Catalytic curing agent for resins and method for making the same |
US6355763B1 (en) * | 1997-04-16 | 2002-03-12 | Vantico Gmbh & Co. Kg | Epoxy resin, polyamine hardener and N,N′,N″-tris(dialkylaminoalkyl)hexahydrotriazine |
WO1998046660A1 (en) * | 1997-04-16 | 1998-10-22 | Ciba Spezialitätenchemie Bergkamen Gmbh | Hardenable mixtures made of glycidyl compounds, aminic hardeners and heterocyclic accelerators |
EP0872505A1 (en) * | 1997-04-16 | 1998-10-21 | Ciba Spezialitätenchemie Bergkamen GmbH | Curable compositions based on glycidyl compounds, amine hardeners and heterocyclic accelerators |
US9751973B2 (en) | 2010-06-24 | 2017-09-05 | Hexion Inc. | Epoxy systems for composites |
US9920161B2 (en) | 2010-06-24 | 2018-03-20 | Hexion Inc. | Epoxy systems for composites |
CN103347925A (en) * | 2010-12-17 | 2013-10-09 | 陶氏环球技术有限责任公司 | Curable composition |
JP2013545868A (en) * | 2010-12-17 | 2013-12-26 | ダウ グローバル テクノロジーズ エルエルシー | Curable composition |
WO2013089000A1 (en) * | 2011-12-15 | 2013-06-20 | 東レ・ファインケミカル株式会社 | Curable composition |
JPWO2013089000A1 (en) * | 2011-12-15 | 2015-04-27 | 東レ・ファインケミカル株式会社 | Curable composition |
US9296890B2 (en) | 2011-12-15 | 2016-03-29 | Toray Fine Chemicals Co., Ltd. | Curable composition |
JP2016079313A (en) * | 2014-10-20 | 2016-05-16 | 京セラケミカル株式会社 | Repairable adhesive composition and electric and electronic component |
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