JPS59221321A - Molding of heat-resistant resin of polyisocyanurate - Google Patents

Abstract

PURPOSE:To mold a polyisocyanurate resin having improved heat resistance efficiently, by using specific two components, casting or injection molding them, postcuring the molded article at a specific postcure starting temperature. CONSTITUTION:In molding two components by reaction casting or by an injection molding machine, (A) a liquid mixture of an organic polyisocyanate (e.g., hexamethylene-1,6-diisocyanate, etc.) and/or an isocyanate group-containing prepolymer, and an epoxy compound (e.g., allylglycidyl ether, triglycidyl ether of trimethylolpropane, etc.), as the first component, is blended with (B) a liquid mixture of aziridine compound and a tertiary amine, as the secondary component, and, if necessary, an (insert) active hydrogen compound, cast or injection molded, and postcured at 110-170 deg.C postcure starting temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molding method, and more particularly to a molding method for obtaining a tahoriisocyanurate resin molded product having excellent heat resistance by molding using a two-component reaction injection or injection molding machine.

It is generally known that polyisocyanurate resins obtained from organic polyisocyanates have good hardness, fire resistance, and mechanical resistance even at relatively high temperatures, for example 180°C. However, they are generally brittle, which greatly limits their applicability in a wide range of applications, and they also tend to disintegrate during demolding, making it difficult to obtain fully molded products. or,
These materials do not have sufficient thermal stability at temperatures above 200 degrees Celsius, and at these temperatures they begin to soften, deform, decompose, crack and foam, and when exposed to flame in this state, ignite and sustain combustion. Therefore, the heat resistance was generally poor.

The present invention also provides a method for efficiently molding a polyisocyanurate resin having excellent heat resistance using a two-component reaction injection or injection molding machine.

In order to efficiently mold using a two-component reaction injection or injection molding machine, the resin injected or injected into the mold must immediately start a polymerization reaction, and the polymerization reaction must proceed as quickly as possible within the mold. It is important that the degree of completion of the polymerization reaction is as high as possible. By satisfying these conditions, the molding cycle is increased, and at the same time, the strength of the cured resin at the time of demolding is increased, and even complex molded products can be easily demolded.

Furthermore, if the demolded molded product does not crack, soften, deform, or foam during post-curing, and the polyisone annulet-1 network formation reaction progresses reliably during post-curing, even at t7. It is expected that a polyisone annulate resin with high deformation temperature and excellent heat resistance will be obtained.

In conventional polyisocyanurate polymerization reaction and molding processing techniques, there is an induction period before starting the polymerization reaction, and
It has been difficult to obtain complex molded products because the polymerization reaction rate during injection or injection is slow and the degree of completion of the polymerization reaction is insufficient, making the molded products brittle and easily broken during demolding. In addition, if this molded product is heated above 110°C, it will crack, soften, deform, or foam, making it impossible to further advance the polyisocyanurate network forming reaction by post-curing. Because it is brittle and has poor heat resistance, it has little industrial value, and its range of applications is currently extremely limited.

The present invention solves the problems in conventional polyisocyanurate molding techniques.

That is, in the present invention, when molding is performed using a two-component reaction injection method or an injection molding machine, a liquid mixture of an organic polyisocyanate and/or incyanate group-containing prepolymer and an epoxy compound is used as the first component, and a liquid mixture of an epoxy compound is used as the second component. As necessary, an active hydrogen compound and/or an inert hydrogen compound are added to a liquid mixture of an aziridine compound and a tertiary amino acid, and injection or injection molding is performed, and the curing start temperature is set to 110°C after post-curing. The present invention relates to a method for molding a polyisocyanurate-based heat-resistant resin, characterized in that the temperature is 170°C to 170°C.

On the two-component reaction injection or injection molding machine used to carry out the present invention, a RI Ivl (Reaction In
injectionMolding ) or L I M (
Liquid Injection Mold-ing
), which simultaneously inject two types of liquids through a mixing chamber under pressure into a closed mold and react in the mold to form a polymer, urethane foaming machines, etc.
It includes a device such as a liquid blender that mixes two types of liquids through a mixing chamber under normal pressure or pressure, and then discharges and injects the mixture into an open mold under normal pressure, and a molding device system. Among these,
For efficient molding, a RIM molding machine is particularly preferred.

Examples of organic polyisocyanates for use in the present invention include aliphatic, cycloaliphatic, aromatic substituted aliphatic, aromatic, or heterocyclic polyisocyanates, such as EVA, hexamethylene-1',6-diyne, cyanate, 2,2.4- or 2,2.6-) dimethyl-1,6-diitunanate,
1-Incyane-)-3,3,5-trimethyl-5-
Incyanate methylchlorhexane, cis or tr
ans-cyclohexa7-1,4-diisocyanate,
Dicyclomethane-4,4'-diisocyanate, ω, ω
'-diisocyanate methylcyclohexane, tolylene-2,4- or -2,6-dicyane 1-, diphenylmethane-2,4'- or -4,4'-diisocyanate, naphthylene-1,5-diisocyanate, bitolylene diisocyanate , m- or p-phenylene diisocyanate, xylylene], 3- or -1,4-diisocyanate, triphenylmethane-4,4',4''-h diisocyanate, tris(4-incyanate phenyl) More trifunctional polyisocyanates such as thiophosphate, undeca 7-1-10-triisocyanate, diphenylmethane-3,3', 4,4'-tetraisocyanate, and aniline are condensed with formalin and then phosgenated. polyphenylpolymethylene polyisocyanates of the type obtained,
diphenylmethane diisocyanates which are liquid at room temperature or urethane bonds, allophanate bonds, urea bonds, biuret bonds, oxazolidone bonds, incyanurate ring structures having carbodiimide groups or uretonimine groups as described in German Patent No. 092007; Examples include modified polyincyanates containing a uretidinedione ring structure. These organic polyisonanates can be used alone or as a mixture of two or more. Diphgonyl meta/polyisonanate, which is liquid in the middle groove of the polyisocyanate mentioned above, is particularly useful because of its ease of handling and availability.

The incyanate group-containing prepolymer used in the present invention is obtained by reacting an active hydrogen compound with an excess of organic polyyne/anate, and examples thereof include Eva, ethylene glycol, propanediol, butanediol, bentanediol, and hexane. low molecular weight diols such as diol, diethylene glycol, and dipropylene glycol; low molecular weight trifunctional or higher functional polyols such as glycerin, trimethylolpropane, and pesotaerythritol;
Hydroquine group-terminated polyethers, hydroquine group-terminated polyesters produced from alkylene ookindo,
It is prepared by reacting one or a mixture of two or more high molecular weight polyols such as hydroxyl group-terminated hydrocarbon chain polymers with an excess of organic polyisocyanate.

The organic polyisocyanate or isocyanate group-containing prepolymer can be used alone or as a mixture at any mixing ratio, and the isocyanate group content of these individual products or mixtures is preferably 4 to 35% by weight, particularly 10% by weight.
It is preferably about 30% by weight. If the incyanate group content is 4% by weight or less, too little incyanurate ring structure is introduced into the cured product, resulting in poor heat resistance, and if the incyanurate group content is 35% by weight or more. Since the theoretical polyisocyanurate network density of the cured product is very large, the network formation reaction cannot be completed sufficiently due to the effects of steric hindrance, etc., making it brittle and causing foaming and cracking when heated.

Evoquin compounds used in the present invention are mono- or polyepoxy compounds, including allyl glycidyl ether, butyl glycidyl ether, phenyl glycidyl ether, butylene oxide, propylene oxide, octylene oxide, styrene oxide, glycidol, glycidyl ester of persatic acid. Younamonoepoxide, diglyrindyl ether of bisphenol A, butadiene jeboxide, 3,4-epoxysicμ hexoflumethyl-(
3,4-epoxy)cyclohexane hydroxylate,
Bicyclohegycene dioxide, 4,4'-di(1,2-
epoxyethyl)diphenyl ether, 4,4'-cy(1,2-epoxyethyl)biphenyl, 2,2-bis(3,4-epoxy/chlorohexyl)propane, diglycidyl ether of resorcin, diglycidyl methylphloroglucin Ether, bis(2,3-epoxycinclopentyl)ether, 2-(3,4-epoxy)cyclohexane-5+5-spiro(3,4-epoxy)cyclohexane-m-diogy→none, bis-(3,4 -Evoquine-6-methylchlorohequinyl)adipate, N,N
'-m-phenylenebis(4,5-ehoquine-1,2-
7 Chlohexanedicarpoximide, etc.,
Triglycidyl ether of para-aminophenol, polyallyl glycidyl ether, 1,3.5- (1,2-
epoxyethyl)benzene, 2.2',4.4'-tetraglyndoxybenzophenone, tetraglycidoxytetraphenylethane, polyglycidyl ether of phenol/formaldehyde novolac, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane. Trifunctional or higher functional epoxides such as ethers or silane compounds having an epoxy group are used.

The above epoxides may be used alone or as a mixture of two or more.

Among these epoxides, liquid and low-viscosity monoepoxides are particularly preferred, and for example, phenylglycidyl ether, diglycidyl ether of bisphenol A, etc. are particularly preferred because they are easily available industrially. Epoxide is used as a subsidiary component for organic polyisocyanate, and the weight fraction of epoxide in the total amount of organic polyisocyanate and epoxide is 0.1 to 30%,
Particularly preferably, it is about 0.05 to 10%. When the epoxide content is 0.1% by weight or less, the reaction completion rate in the latter half of the polyisocyanurate reaction is insufficient, and demolding after injection or injection becomes difficult. Moreover, if the epoxide content is 30% by weight or more, the heat distortion temperature of the cured resin becomes low and the heat resistance deteriorates.

The mixture of organic polyisocyanate and epoxy compound is preferably a liquid with a low viscosity at room temperature, but even if it can be made into a liquid with a low viscosity by heating or contains a solid dispersion.
Flowability as the first component of component reaction injection or injection molding machine,
Any material may be used as long as it does not interfere with meterability, mixing properties, or injection/injection properties. However, in order to simplify mixability, injection/injection properties, or the structure of a molding machine, it is more preferable that these mixtures be liquid at room temperature and have a viscosity of 50 poise or less.

The active hydrogen compound used in the present invention is a compound having a Tzerevitinoff active hydrogen atom, and generally has a molecular weight of 60 to 6.
000, and is a compound having at least one hydrogen that reacts with incyanate.

Compounds of this type are preferably polyhydroxyl compounds, especially compounds having 2 to 8 hydroxyl groups and having a molecular weight of 60 to 6000, such as ethylene. Glycol, 1,2- and -1,3-diol, butane-1,4- and 2゜3-diol, hexane-1
, 6-diol, octane-1,S-diol, neopentyl glycol, cyclohexane dimetatool, 2-
Methylpro/(diol, glycerol, trimethylolpropane, hexane-1,2,6-triol, butane-1,2,4-)diol, trimethylolethane, pentaerythritol, diethylene glycol, triethylene glycol, tetraethylene glycol, di Low molecular weight polyols such as propylene glycol, triethanolamine, tribrophenolamine, N-
Alkanolamines such as phenyldiethanolamine, high molecular weight polyols having 2 to 8, preferably 2 to 4 hydroxyl groups, such as low molecular weight polyols, water or amino compounds with ethylene oxide and/or
or polyether polyionyl of the type obtained by addition polymerization of fullylene oxide such as propylene oxide, poly(oxytetramethylene) glycol, castor oil or aliphatic polybasic acids such as lysyl inate polyol adivic acid and low Polyester polyols of the type obtained from molecular weight podiols, polyester polyols of the type obtained from low molecular weight polyols and aliphatic and aromatic polybasic acids or alkyd resin types, poly-ε-caprolactone polyols, polycarbonate polyols, polyacetal polyols, polythioether polyols It is one type or a mixture of two or more types.

The molar ratio of the incyanate group of the organic polyisocyanate to the active hydrogen of these active hydrogen compounds is 2 or more,
Preferably it is 5 or more. If it is smaller than 2, the heat resistance of the resin molded product will deteriorate.

In addition, the inert hydrogen compound used in the present invention is a compound that does not have Tzelevitinoff active hydrogen, is liquid at room temperature, and is compatible with organic polyisocyanate or incyanate group-containing prepolymer, such as xylene, tetraethyl, etc. Hydrocarbons like diphenyl, halogenated hydrocarbons like dichlorobenzene, diphenyl chloride, dibrembenzene, dibutyl phthalate, dioctyl phthalate, ethylene glycol dibenzoate, dioctyl adipate are used as plasticizers. esters, carbonates such as propylene carbonate and butylene carbonate, ethers such as ethyl non-glycol dibutyl ether and ethylene glycol methyl ether acetate, phosphates such as tricresyl phosphate and tris(2-chloroethyl) phosphate; Phosphites such as triphenyl phosphite and trioctyl phosphite, nitriles such as adiponitrile and acetonitrile, amides such as dimethylacetamide and diethylacetamide, sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide, hexamethyl phospho phosphoramide, hexaethylphosphoramide, and the like. These inert hydrogen compounds can be used alone or as a mixture of two or more, and can be used with or without the above-mentioned active hydrogen compounds.

Active hydrogen compounds or inert hydrogen compounds.

It is used to uniformly mix and dissolve the aziridine compound and the tertiary amine in the first component, but at the same time, it has the effect of making the polyisocyanurate reaction proceed smoothly and greatly improving the physical properties by post-curing. These are used in an amount of 1 to 50% by weight, preferably 3 to 30% by weight, based on the total amount of the first component and the second component.
Regarding the active hydrogen compound, as described above, there are restrictions on the molar ratio between the incyanate group content and the active hydrogen content in the first component. If the content is less than 1% by weight, the above-mentioned effects will not be achieved, and if it is more than 50% by weight, the heat resistance of the cured resin will deteriorate.

The aziridine compound used in the present invention has the formula (wherein,
is H or a lower alkyl group, Y is H or a hydroxyl group,
ZliH or an n-functional residue, n is a number from 1 to 6), such as 2-(1-aziridinyl)ethyl methacrylate, 2-(1-aziridinyl)ethyl methacrylate, 2-(1-aziridinyl) ) Ethyl acrylate, methyl ω-aziridinylpropionate, ethylene glycol bis(ω-aziridinylpropionate), trimethylolpropane tris(ω-aziridinylpropionate), pentaerythritol tetra(ω- aziridinyl propionate), sorbitol hexa(ω-aziridinyl propionate), β-(2-methylaziridinyl)ethyl metalarylate, diethylene glycol bis[ω-(2-methylaziridinyl) fropion acid ester), 1,3.6-hexandriol tris[ω-(2-ethylaziridinyl)propionate ester], diglycerine tetra[ω
-(2-methylaziridinyl)propionic acid ester]
15- Compounds containing ester bonds such as 1-(2-hydroxyethyl)aziridine,
1. -(2-hydroxyethyl)-2-methylaziridine, 1-(2-hydroxyethyl)-2-ethylaziridine, 1-(2-hydroxy-2-phenylethyldroxy-2-phenylethyl)-2-methyl Compounds containing hydroxyl groups such as aziridine, 1-(2-
cyanoethyl)aziridine, 1-(2-cyanoethyl)
-2-methylaziridine, 1-(2-cyanoethyl)-
Compounds containing a nitrile group such as 2-ethylaziridine, compounds containing a carboxyl group such as ω-aziridinylpropionic acid, ω-(2-methylaziridinyl)propionic acid, ω-aziridinylpropion acid amide,
Compounds containing an amide group such as ω-(2-ethylaziridinyl)propionic acid amide, 1-(β-methoxyethyl)aziridine, 1-(β-methoxyethyl)-2-
Compounds containing an ether bond such as ethylaziridine, compounds such as 1-ethylaziridinyl-(β-phe-71thylethyl-methyl-16-silidine), or compounds of the formula (wherein X is H or lower Triethylene melamine derivatives represented by alkyl melamine, such as triethylene melamine, tris (2-methylethylene) melamine, tris (
2-ethylethylene) melamine, etc. The above aziridine compounds can be used alone or in a mixture of two or more. In molding the heat-resistant polyisocyanurate resin of the present invention, the aziridine compound is effective in shortening the molding cycle because it causes the polyisocyanurate reaction to occur within the mold without an induction period, and plays an important role. The purpose is to make it possible to sufficiently complete the polyisocyanurate network forming reaction by the keer after demolding. The aziridine compound comprises a first component and a second component.
It is used in an amount of 0.05 to 10% by weight, preferably 01 to 5% by weight based on the content of the components. If the amount is less than 0.005% by weight, the network forming reaction by post-guar will not be completed sufficiently, resulting in poor heat resistance of the cured product and easy thermal deformation.

Furthermore, since the liquid injected into the mold during injection molding cannot immediately start polymerizing, the mold cycle becomes long and molding efficiency deteriorates. If the amount is more than 10% by weight, the physical properties of the cured product will be poor and the aziridine compound will ooze out from the surface of the cured product, impairing the commercial value of the molded product.

Examples of the tertiary amine used in the present invention include trialkylamines such as triethylamine and tributylamine, triethanolamine, N-methyljetanolamine,
Flukanolamines such as N,N'-dimethylethanolamine, N-methylmorpholine, N-ethylmorpholine, N,N'-dimethylpiperazine, 1,4-diazavinchro (2,2,11 octane (triethylenediamine))
, 4,4'-dimethylmolypholinodiethyl ether, N
, N', N''-) !IS (dimethylaminopropyl)
Hegisahydro S=triazine, 2-methyldiazavinchlo[2,2,2]octane, ■-Methyl-4-dimethylaminoethylenepiverazine, I+5-diazabicyclo[4,3,0,]]nonene-51. ．． 4-bis(dimethylaminoethyl)piperazine, N-(2-cyanoethyl)piperidine, 1,8-diazabicyclo(5,4,0)
Cyclic amines such as undecene, N,N-dimethylcyclohexylamine, dimethylbenzylamine, methyldicyclohexylamine, 2-dimethylaminomethylphenol, 2,6- or 2,4-bis(dimethylaminomethyl)phenol, 2, 4.6- Tris(dimethylaminomethyl)phenol, tetramethylbutanediamine, tetramethylhexamethylenediamine, tetramethylethylenediamine, pestamethyldiethylenetriamine, bis(2-dimethylaminoethyl)ether, pentamethyldipropylenetriamine, bis (dimethylaminopropyl)methylamine, N,N-dimethylaminoethoxypropionitrile, dimethyl-2,2-dicarboxyethylamine, tetramethylguanidine, I,2-dimethylimidazole, 2-methylimidazole, 2.2
．． These include amines such as 4-trimethyl-2-silamorpholine and 1,3-diethylaminomethyltetramethyldisiloxane. The above tertiary amines can be used alone or in a mixture of two or more. Tertiary amines are effective in stabilizing the second component. This is because, in the absence of a tertiary amine, the aziridine compound in the second component may self-polymerize during storage at room temperature, increasing the viscosity of the second component or reducing the catalytic activity of the polyisocyanurate resin curing reaction. change. Therefore, it becomes impossible to mold this resin with good reproducibility. These difficulties can be overcome by the presence of tertiary amines. Tertiary amines also activate the aziridine compound, allowing efficient molding. The tertiary amine is 00% relative to the content of the first component and the second component.
It is used in an amount of 1 to 6% by weight, more preferably 0.05 to 4% by weight.

If it is less than 0.001% by weight, the stabilizing effect and activation effect of the aziridine compound will not be sufficient, and if it is more than 6% by weight, the physical properties of the cured product will deteriorate.

The first component and the second component are blended according to the above requirements,
Colorants, antioxidants, light stabilizers, inorganic or organic fillers, fibrous or flake reinforcing materials, etc. can also be added to each component.

The post-keer starting temperature in the present invention is 110 to 170°C
The temperature is more preferably 1.30 to 140°C. 11
When the post-cure temperature is lower than 0° C., no significant increase in the thermal stability temperature is observed, and the molded product cracks, softens, foams, etc., and has poor heat resistance. If the post-cure start temperature is higher than 170° C., thermal decomposition and softening deformation occur, resulting in cracking and foaming of the molded product, resulting in poor mechanical properties and appearance. Post-curing is started at 110 to 170°C for about 0.5 to 15 hours, preferably 1 to 6 hours.

According to the present invention, polyisocyanurate resin with good heat resistance can be molded extremely efficiently, so it can be used for electrical equipment parts such as main shells of televisions, VTRs, or audio equipment, switch covers, printed circuit boards, lamp covers, etc. It is extremely important and useful because it can produce and provide household items such as frying pan handles, iron handles, oven plates, etc., automobile parts such as engine compartment partition walls, carp covers, and structural parts 11 around heaters at low cost. .

Next, the present invention will be explained in more detail with reference to Examples. However, the present invention is not limited to these examples.

The formulations in each table listed in Examples are shown in parts by weight. Moreover, each physical property value is as follows.

(1) Density (yArj): Indicates the density of each measurement sample.

(2) Perfle hardness: Barcol hardness tester (GYZJ9
34-1 type) and measured 1-. Hardness values at 25°C are shown.

(3) Bending strength (a) and bending modulus, lath (K9
/cJ): Measured according to JISK7203. 3
A molded product measuring mm x 25 WrIn x 127 mm was measured with a support span of 50 cylinders.

(4) Impact strength (K9・砿/rJ): JTS
Measured according to K7110. It was measured with a notch using the Izot impact strength measurement method.

(5) Combustion test: Measured according to the UL 94 HB test method. An indirect flame was applied for 10 seconds to see if the sample continued to burn to the tip. For this test, 3 tan x 1.
A molded article measuring 2.7 mm x 127 mm was used.

Examples 1 to 6, Comparative Examples 1 to 5, and the first and second components shown in Table 1 were mixed using Twin Flow VR (
After filling the incyanate tank and polyol tank of a Naka Seiki compounding machine and adjusting the temperature to 25°C, the liquid was pumped using a gear pump to achieve the specified mixing ratio. The mixture was mixed using a stirring device and poured into a Teflon-coated mold (top end open) whose temperature was previously controlled to 30°C. The material was removed from the mold under the molding conditions shown in Table 1, and the physical properties were measured after keering in a gear oven. Table 1 shows the results of the molded product according to the present invention and the molded product of the comparative example. still,
Prior to injection molding, the first component and the second component are
Degassing treatment was performed at rr for 1 hour.

Example 7 ~] 5, Comparative Example 6.7, 23 - The first component and second component shown in Table 2 were filled into each tank of a TK-10RIM injection machine (polyurethane engineering group), and the temperature was controlled at 30 ° C. After that, the liquids are fed to a predetermined mixing ratio using a piston cylinder, the two liquids are mixed using an impingement stirring method, and a 7 elemental mold release agent is applied.
It was injected into a closed mold whose temperature was controlled at ℃. After demolding and curing in a gear oven under the molding conditions shown in Table 2, physical properties were measured. Table 2 shows the results for the molded product according to the present invention and the molded product of the comparative example.

Example 16, the first component and the second component were formulated as shown in Table 3, and each]
After degassing with OTorr for 2 hours, the mixture was injected into a closed mold temperature-controlled at 55° C. in the same manner as in Example 2. The mold could be demolded 55 seconds after injection and injection, and the demoldability was good. This molded product was placed in a gear oven at 140℃×2H+]80℃×
When cured after 2H, the physical properties were as follows.

Appearance No abnormality Heat distortion temperature 〉250℃ 24- Density (y/crI) 1.34 Puffle hardness 54 Bending strength 23 Bending modulus (K9/CJ) 529 Impact strength (
Ky-crn/J 2.8 Flammability Test
Passed UL 94 HB Also, when I started curing another molded product at 180°C in a gear oven, it foamed and deformed. Furthermore, another molded product was cured at 100° C. for 24 hours and then placed in an oven at 180° C., but this product also showed deformation, void formation, cracking, etc.

Below is a blank table 1 Table 2 27- Notes to the table) 0 1 of the primary acid component = organic polyynnanate, prepolymer containing ynnyanate group, o rr l,: epoxy compound 0 2nd component I: active hydrogen Compound 0 〃 ■: Inert hydrogen compound 0 〃 ■ Near syridine compound 0 〃 ■: Tertiary amine 1) Carbodiimide-modified diphenylmethane diynnanate (Nippon Polyurethane Kogyo Products, NCO content 286%)
) 2) Polyol-modified diphenylmethane diisocyanate (Japan Polyurethane Industries, NGO content 261%) 3) MDI/polyether Brevo exchanger (Japan Polyurethane Industries, NGO content 16.1%) 4) Bisphenol A-based epoxy resin (Nel Chemical products) 5) Polyoximbu p-pyrene glycol molecule [L100
06) Trimethylolpropane tris (ω-aziridinylpropionate ester), Mutual Pharmaceutical Products 7) Triethylene urea, Mutual Pharmaceutical Products 8) N, N7 N”-tris(dimethylaminopropyl)hexahydro-5-) Riazine, SanAbbot products 9) 1.8-Diaza-Bincro (5,4,0) / Decene 7 Symbol ◎ Good O 艮 △ Acceptable × Not possible 28 - Table 3 First component/Second component weight combination ratio -/ 1 1) Epoxysilane: Nippon Unicar product 2) Milled glass fiber: Nittobo product 3) Polyoxypropylene glycol, molecular weight 10004) Aminosilane: Nippon Unicar product 5) Trimethylolpropane tris (ω-aziridinyl propionate ester): mutual pharmaceutical products

Claims (1)

[Claims] When molding using a two-component reaction injection method or an injection molding machine, the first component is a liquid mixture of an organic polyisocyanate and/or baincyanate group-containing prepolymer and an epoxy compound; If necessary, an active hydrogen compound and/or an inert hydrogen compound is added to a liquid mixture of an aziridine compound and a tertiary 7-amine as two components, and injection or injection molding is performed, and the curing start temperature is A method for molding a heat-resistant polyisocyanurate resin, characterized in that the temperature is 110 to 170°C.