JPS59220942A - Wafer transfer device - Google Patents

Abstract

PURPOSE:To transfer wafers into another carrier without damage by a method wherein wafers in a carrier are forced to incline in one direction and securely adsorbed with a hand which can freely rotate and incline to and fro. CONSTITUTION:The adsorption hand 6 is lowered by fixing the directions X and Y, air is jetted from the hole 20 at the tip of said hand 16 to the main surfaces of wafers erecting side by side in the carrier, thus making them inclined at a fixed angle of theta. Then, all rods 8 and 18 are retreated into free state in the directions X and Y, and the wafer 10 is adsorbed by making the hole 20 of the hand 16 abut against it. The whole device 5 is raised together with a transfer unit 3, proceeding to above the carrier 2, projecting the rod 8 of a cylinder 9, and then lowers by fixting only to and fro. Releasing the pressure reduction at the position for lowering, the wafer 10 is set free and placed in the groove of the carrier 2. Next, the hand rises together with the transfer unit and turns back to the starting position A. In this construction, the adsorption hand displaces to the wafer or carrier in a free manner; therefore, even in the presence of positional slippage on the side of carry out and carry in, the wafer is adsorbed in the state, and rises and lowers along the groove, resulting in no damage of wafers.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a wafer transfer device, and relates to a device for transferring wafers between different wafer carriers for each process in a wafer processing process. Background technology and its problems] The carriers used in the wafer processing process are dedicated carriers with different shapes, such as TFE carriers in the wafer cleaning process, quartz boats in the impurity diffusion process, and aluminum carriers in the photo-etching process. It was getting worse. For this reason, it is essential to transfer wafers between carriers between each of the above steps.

A widely used method for transferring the wafers between carriers was to manually hold the wafers one by one with tweezers, but this method required a great deal of labor and caused scratches, cracks, etc. on the wafers. There were disadvantages such as a high risk of This drawback is a problem with Ueno, which has been rapidly progressing recently.
This is becoming a serious problem as the diameters of metals become larger and processing speeds increase.

Therefore, using a special transfer jig that allows the Ueno 1 to fall naturally due to its own weight can be used to transfer the Ueno 1 all at once, but it is prone to deformation and cracking of the carrier, and
When the diameter of the Ueno rod changes or the number of sheets stored in the carrier changes, it is necessary to update the jig each time, which causes many problems.

[Purpose of the invention]

This invention improves the wafer transfer device used in the processing process of semiconductor wafers, and allows the transfer of wafers, such as carriers and boats, which are different in material, shape, number of wafers, storage pitch, etc., without the need for manpower. After the wafer is automatically taken out from the storage carrier, it is stored in the carrier to be transferred.

[Summary of the invention]

The wafer transfer device according to the present invention includes a moving unit that moves between two fixed points and moves up and down at each fixed point, a first suction hand whose one end is pivoted to the transfer assisting unit, and a first suction hand that moves between two fixed points and moves up and down at each fixed point. A second suction hand has one end pivoted on the other end by an axis perpendicular to the axis of the suction hand; an opening for blowing the main surface to a predetermined slope and supporting the main surface by vacuum suction;
This device is equipped with a fixing mechanism for individually fixing the suction hand 1 and the suction hand N2.

[Embodiments of the invention]

Next, one embodiment of the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a plan view for explaining the general configuration of a wafer transfer device according to an embodiment of the present invention, and FIG. 2 is a front view of the device shown in FIG. 1, where (1) is at one fixed point. A first carrier, for example loaded with wafers, and (2) at the other fixed point a second carrier, for example an empty carrier, which receives wafers from the first carrier. The moving unit (3), which moves the distance #X between these fixed points and moves up and down at each fixed point, moves between both carriers by the guide (4) as shown in FIG. Go up and down in the direction. Each time the gear is raised or lowered, the gear moves forward or backward in the Y direction by a distance f'rIf corresponding to the pitch between wafers. This forward movement or backward movement is performed by the computer along with the operation of the moving unit, and is configured using a step motor (not shown) as a driving source. Furthermore, even if the two carriers are different in pitch between wafers, number of wafers stored, height, etc., it can be accommodated by slightly moving the guide in one direction, Y, using the lead screw (4a) provided on the guide (4) in Figure 1. . In other words, the carrier with the smaller number of carriers stored is quickly converted to the next carrier, and the transfer operation is continued continuously.

The mechanism of the suction hand will be explained in detail next.
It is omitted from FIGS. 1 and 2.

Next, the adsorption node in this embodiment will be explained in detail with reference to FIG. 4 and subsequent figures. The suction hand (5) is provided with a first suction hand (6) with the -E part pivoted on the lower end of the moving unit (3), and a first suction hand (6) with the -E part pivoted on the lower end of the moving unit (3), and a first suction hand (6) mounted slightly above the shaft (7) in a direction perpendicular to the shaft. Both (protruding from 111 and sucking with the sandwich ↑)・
The cylinder (9) is a rod (8) that stops the swing of the hand.

(9). When this rod protrudes, the suction hand is prevented from swinging and is fixed, and when the rod is retracted, it becomes free to swing. Next, the second adsorption node ae has its upper part attached to the lower end of the first suction node (6), and its axis αη
A rod tt8 is located slightly lower than 111 and protrudes from both sides in the vertical direction to clamp the suction node and prevent it from swinging.
1. (t81 is driven by the cylinder u bell (1cm).The action of this rod is the same as the first suction hand, so the explanation will be omitted.This second suction hand (161
Each conduit (2+1. (2 hot water is installed) is provided with a perforated canopy at the lower end and equipped with a switching cockter so that high-pressure air blowing and vacuum suction can be performed at will.

Note that 01 indicates the wafer with a broken line.

Next, the state in which this apparatus continuously and automatically transfers wafers between carriers using a computer will be explained with reference to FIGS. 3 and subsequent figures.

(al A in Figure 3 is the start, and the shift b in the X and Y directions is also fixed and descends (Figures 4 and 5)
.

(bl) Air blow is applied to the main surface of the wafer parallel to the wafer carrier from the opening (end) at the tip.Since the wafer on the carrier moves parallel to the groove wider than the thickness of the wafer, this air blow blows air to the main surface of the wafer parallel to the wafer carrier. After setting the wafer to θ, all the rods (8, 8, 18° 18) are moved back to be free in the X and Y directions, and the opening (shaft) of the second suction hand is brought into contact with the wafer and suctioned (see Fig. 6). ).

(cl suction hand (the tuft rises as the moving unit (1) rises and moves onto the second carrier (2).

(d) Fix only in the front-back direction, that is, make the rod (8) of the cylinder (9) protrude and descend (Fig. 7).

(el) By releasing the vacuum in the lowered position and freeing wafer 0 (1), the wafer is transferred to the second carrier (2
) is placed in the groove. Thereafter, the suction hand moves up together with the moving unit and returns to the starting position.

Thereafter, by repeating steps (a) to (el) above, all wafers are transferred.

In this invention, since the suction hand can be freely displaced with respect to the wafer or carrier, even if there is a positional deviation between the unloading side and the loading side (1111), as shown in FIGS. The wafer picked up in a shifted state moves up (FIG. 7) and down (FIG. 8) along the carrier groove, so that the wafer can be transferred without damaging the wafer.

Furthermore, this device includes the operation of the mobile unit, and the operation of each part is stored in memory and operated according to instructions from the CPU, making it compatible with automation.

〔Effect of the invention〕

According to this invention, since the wafer in the carrier is generally inserted and supported in a groove, it is unclear whether it is tilted forward or backward, but the wafer is forcibly tilted in one direction, for example, in the first direction. Since the suction hand can freely rotate and tilt in the front and rear directions, it can reliably suction and support the wafer. Further, even if the carrier containing the wafer and the empty carrier are misaligned in the right and left directions, the wafer can be reliably sucked and supported by, for example, rotation of the second suction hand.

The transfer of Ueno between processes can be completely carried out as shown on the diagonal. And the pitch size of the carrier is different,
Furthermore, there is a remarkable advantage that wafers can be transferred between carriers having different numbers of carriers (carrier lengths) without damaging the wafers and at a good yield.

[Brief explanation of drawings]

Figure 1 is a top view of a wafer transfer device according to an embodiment of the present invention, Figure 2 is a front view of the device shown in Figure 1, Figure 3 is an operation sequence diagram, and Figure 2 is a suction hand. Figure 5 is a side view of Figure 4, Figures 6 to 8 are diagrams explaining the operation of the suction nozzle, Figure 6 is a front view, Figures 7 and All figures 8 are 1-side views of the sacrum. 1 First carrier 2 Second carrier 3 Moving unit 4 Guide 5 1J arrival node 17 6 j [1 suction hand 7 First suction hand shaft 8 , 8 First occupational hand rod 16
r+; 2 suction hand 17 2nd suction 1 hand IQl+18.
18 >>, 2 suck? 1 hand rod 20
ttr, adsorption of 2) and pore-opening agent
Patent Attorney I-H-O Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 7
Figure 8

Claims (1)

[Claims] a moving unit that moves between two fixed points and moves up and down at each fixed point; a first suction hand that has one end pivoted to the moving unit;
A second suction hand whose one end is pivoted to the other end of the first suction nozzle by an axis perpendicular to the axis of the suction hand; an opening for sucking and supporting the wafer at the end of the suction hand by blowing the main surface of the wafer, which is freely aligned in parallel with the groove of the carrier, to a predetermined inclination and suctioning the wafer under reduced pressure;
a wafer transfer device comprising a fixing mechanism for individually fixing the first suction hand and the second suction hand;