JPS59215763A - Printer for thick film - Google Patents
Printer for thick filmInfo
- Publication number
- JPS59215763A JPS59215763A JP58091105A JP9110583A JPS59215763A JP S59215763 A JPS59215763 A JP S59215763A JP 58091105 A JP58091105 A JP 58091105A JP 9110583 A JP9110583 A JP 9110583A JP S59215763 A JPS59215763 A JP S59215763A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- resistance
- thick film
- thickness
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、厚膜印刷装置に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to a thick film printing apparatus.
従来例の構成とその問題点
従来の描画方式の厚膜印刷装置および工法は第１図〜第
４図に示すようになっている。１は抵抗ペーストを貯蔵
しているカートリッジであり、２はペースト吐出口を有
しているノズル、３は厚膜基板、４は前記厚膜基板３を
保持し、ＸＹ移動するＸＹテーブル、６はカートリッジ
１に接続し、圧縮空気を送り込むエアーチューブ、６は
カートリッジ１を固定しているヘッドフレーム、７はフ
レーム、８はＸＹテープイレ４を制御駆動させる制御部
である。Structure of a conventional example and its problems A conventional drawing type thick film printing apparatus and method are shown in FIGS. 1 to 4. 1 is a cartridge storing resistance paste, 2 is a nozzle having a paste discharge port, 3 is a thick film substrate, 4 is an XY table that holds the thick film substrate 3 and moves in XY, and 6 is an XY table that moves XY. An air tube is connected to the cartridge 1 and supplies compressed air; 6 is a head frame to which the cartridge 1 is fixed; 7 is a frame; and 8 is a control unit for controlling and driving the XY tape toilet 4.
第２図は、ノズル２の先端部分を拡大し、描画している
状態の図である。９は抵抗ペーストであり、ペースト９
には矢印入方向に圧縮空気による抑圧がかかっている。FIG. 2 is an enlarged view of the tip of the nozzle 2. 9 is a resistance paste, paste 9
is being suppressed by compressed air in the direction of the arrow.
１０は描画後の抵抗ペーストであり、１１は描画状態の
抵抗ペースト、１２は厚膜基板３上に形成されている導
体パターンである。描画は、ノズル２と厚膜基板３との
ギャップＨを保ちペースト９を押圧し、ＸＹテーブル４
を矢印Ｂ方向に移動させることにより、導体パターン１
２．１２ａ間に形成された描画抵抗１ｏのように描画さ
れる。10 is a resistor paste after drawing, 11 is a resistor paste in a drawn state, and 12 is a conductor pattern formed on the thick film substrate 3. For drawing, keep the gap H between the nozzle 2 and the thick film substrate 3, press the paste 9, and press the paste 9 on the XY table 4.
By moving in the direction of arrow B, conductor pattern 1
It is drawn like the drawing resistor 1o formed between 2.12a.
第３図は、ペースト９を押圧する圧縮空気によるペース
ト９の吐出量を描画時のＸＹチー、プル４の移動との相
互関係を示したものでちる〇第４図は、第３図のような
描画タイミングの場合の描画抵抗側断面形状を示したも
のであり、Ｌは描画長さであり、Ｌｌは描画書き出し部
、Ｌ３は描画書き終わり部、Ｌ２は描画厚みが系で一定
となっている安定部である。描画書き出し部Ｌ１、描画
書き終わり部Ｌ３は、導体パターン１２と描画抵抗１０
との重なり長さＳよりも小さいことが、描画抵抗値を安
定させる上での一つの条件となる。Figure 3 shows the relationship between the amount of paste 9 discharged by compressed air that presses the paste 9 and the movement of the XY Q and pull 4 during drawing. Figure 4 is similar to Figure 3. This figure shows the cross-sectional shape of the drawing resistor in the case of drawing timing, where L is the drawing length, Ll is the drawing start part, L3 is the drawing end part, and L2 is the drawing thickness which is constant in the system. This is the stable part. The drawing/writing start part L1 and the drawing/writing end part L3 include a conductive pattern 12 and a drawing resistor 10.
One condition for stabilizing the drawing resistance value is that the overlap length S is smaller than the overlap length S.
以上のように、ペースト吐出量とＸＹテーブル移動タイ
ミングとを合致させ、描画動作させる事により、理想的
な無駄の少ない描画抵抗が得られる。しかしながら、抵
抗ペースト種類が変更になった場合、また抵抗ペースト
の特性が経時変化した場合、外況温度か変動した場合、
前記タイミングが守られても、描画厚み系が変化し、所
定の抵抗値が得られないという欠点がある。As described above, by matching the paste discharge amount and the XY table movement timing and performing the drawing operation, an ideal drawing resistance with less waste can be obtained. However, if the type of resistor paste is changed, the characteristics of the resistor paste change over time, or the outside temperature changes,
Even if the above-mentioned timing is maintained, there is a drawback that the drawing thickness system changes and a predetermined resistance value cannot be obtained.
発明の目的
本発明は、上記欠点を解消し、ペースト特性か変化等し
ても、描画厚みを変化させ管理することで、描画抵抗値
の安定化を得られる工法を提供するものである。OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned drawbacks and provides a method that stabilizes the drawing resistance value by changing and managing the drawing thickness even if the paste characteristics change.
発明の構成
本発明は、抵抗ペースト特有の吐出量変化と一致してｘ
ｙテーブルを移動させ、さらに貯蔵されている抵抗ペー
ストの特性変化および、使用ペースト間の特性差に対応
して、描画速度を変え、描画厚みを可変設定する手段を
設けることにより、最適描画抵抗値が得られるという大
きな効果を有するものである。Structure of the Invention The present invention has the following advantages: x
The optimum drawing resistance value can be achieved by moving the y table, changing the drawing speed and variably setting the drawing thickness in response to changes in the characteristics of the stored resistance pastes and differences in characteristics between the pastes used. This has the great effect of providing the following benefits.
実施例の説明
以下、本発明の実施例について第６図を参照にしながら
説明する。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIG.
第６図は、一定形酸、一定吐出圧力のもとてのＸＹテー
ブル速度と描画後の抵抗ペースト厚みとの関係を示した
もので、ｘＹテーブル速度Ｓ１から速度Ｓ２までの間で
は、ＸＹテーブル速度と描画抵抗厚みとは直線変化の関
係がある。この特性を利用し、第３図に示すＸＹテーブ
ル最高移動速度Ｈ３を各描画位置で変更制御させること
により、抵抗ペースト特性が変化等しても穀潰抵抗値が
得られる。Figure 6 shows the relationship between the original XY table speed and the resistive paste thickness after drawing under constant acid and constant discharge pressure. There is a linear relationship between speed and drawing resistance thickness. By utilizing this characteristic and changing and controlling the XY table maximum moving speed H3 shown in FIG. 3 at each drawing position, the crushing resistance value can be obtained even if the resistance paste characteristics change.
発明の効果
以上のように本発明は、ペースト特性の経時変化、およ
びペースト種類の切換えによる特性変化に、即対応も可
能であるばかりでなく描画抵抗値の犬ｌ〕な安定化がは
かれるといった、大きな効果が得られる。Effects of the Invention As described above, the present invention not only allows immediate response to changes in paste characteristics over time and changes in characteristics due to switching of paste types, but also stabilizes the drawing resistance value. Great effect can be obtained.
第１図は厚膜印刷装置の斜視図、第２図は同装置の描画
状態を示す説明図、第３図はペースト吐出とｘＹテーブ
ル移送速度との関係を示すタイミング図、第４図は描画
抵抗の側断面図、第５図はｘｙテーブル移動速度と描画
抵抗厚みとの関係を示すグラフである。
１・・・・・・カートリッジ、２・・・・・・ノズル、
３・・・・・・厚膜基板、４・・・・・・ＸＹテーブル
。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名８
Ｍ ２ 図
第 ３ 図
×γテーブノｂ逢度δ−伽Fig. 1 is a perspective view of the thick film printing device, Fig. 2 is an explanatory diagram showing the drawing state of the same device, Fig. 3 is a timing diagram showing the relationship between paste discharge and the xY table transfer speed, and Fig. 4 is the drawing FIG. 5, a side sectional view of the resistor, is a graph showing the relationship between the xy table moving speed and the drawing resistor thickness. 1...Cartridge, 2...Nozzle,
3...Thick film substrate, 4...XY table. Name of agent Patent attorney Toshio Nakao and 1 other person 8 M 2 Figure 3
Claims (1)
ートリッジの一方につながる圧縮空気源と、カートリッ
ジの他の一方に設けられ、抵抗ペースト吐出口を有する
ノズルと、厚膜基板を保持し、かつ水平方向にＸＹ移動
させるＸＹテーブルと、とのＸＹテーブルを、所定の抵
抗描画厚さを得るために、描画速度をそれぞれの描画位
置で可変設定する手段とからなる厚膜印刷装置。A cartridge that stores a resistive paste therein, a compressed air source connected to one side of the cartridge, a nozzle provided on the other side of the cartridge and having a resistive paste discharge port, and a nozzle that holds a thick film substrate and is arranged horizontally. A thick film printing apparatus comprising: an XY table that is moved in the XY direction; and means for variably setting the drawing speed of the XY table at each drawing position in order to obtain a predetermined resistance drawing thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58091105A JPS59215763A (en) | 1983-05-23 | 1983-05-23 | Printer for thick film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58091105A JPS59215763A (en) | 1983-05-23 | 1983-05-23 | Printer for thick film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59215763A true JPS59215763A (en) | 1984-12-05 |
Family
ID=14017241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58091105A Pending JPS59215763A (en) | 1983-05-23 | 1983-05-23 | Printer for thick film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59215763A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6357771U (en) * | 1986-09-30 | 1988-04-18 | ||
| EP0347824A2 (en) * | 1988-06-22 | 1989-12-27 | Sumitomo Electric Industries, Ltd. | A thick film forming process |
| JPH0291992A (en) * | 1988-09-29 | 1990-03-30 | Juki Corp | Through-hole drawing method in direct drawing equipment |
| WO2007088948A1 (en) * | 2006-02-03 | 2007-08-09 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing same |
| WO2008081618A1 (en) * | 2007-01-05 | 2008-07-10 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing the same |
| US7595716B2 (en) | 2006-02-03 | 2009-09-29 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing the same |
| WO2017006382A1 (en) * | 2015-07-03 | 2017-01-12 | 富士機械製造株式会社 | Supply/replacement device and printing device |
-
1983
- 1983-05-23 JP JP58091105A patent/JPS59215763A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6357771U (en) * | 1986-09-30 | 1988-04-18 | ||
| EP0347824A2 (en) * | 1988-06-22 | 1989-12-27 | Sumitomo Electric Industries, Ltd. | A thick film forming process |
| JPH0291992A (en) * | 1988-09-29 | 1990-03-30 | Juki Corp | Through-hole drawing method in direct drawing equipment |
| WO2007088948A1 (en) * | 2006-02-03 | 2007-08-09 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing same |
| US7595716B2 (en) | 2006-02-03 | 2009-09-29 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing the same |
| WO2008081618A1 (en) * | 2007-01-05 | 2008-07-10 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing the same |
| JPWO2008081618A1 (en) * | 2007-01-05 | 2010-04-30 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| US7915996B2 (en) | 2007-01-05 | 2011-03-29 | Murata Manufacturing Co., Ltd. | Electronic component and method for producing the same |
| JP4807597B2 (en) * | 2007-01-05 | 2011-11-02 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| WO2017006382A1 (en) * | 2015-07-03 | 2017-01-12 | 富士機械製造株式会社 | Supply/replacement device and printing device |
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