JPS5921309B2 - fever recording element - Google Patents
fever recording elementInfo
- Publication number
- JPS5921309B2 JPS5921309B2 JP52108461A JP10846177A JPS5921309B2 JP S5921309 B2 JPS5921309 B2 JP S5921309B2 JP 52108461 A JP52108461 A JP 52108461A JP 10846177 A JP10846177 A JP 10846177A JP S5921309 B2 JPS5921309 B2 JP S5921309B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina ceramic
- heat
- plate
- recording element
- kovar alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
この発明は発熱記録装置の発熱記録素子、特に幅の広い
発熱記録素子の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat generating recording element of a heat generating recording device, particularly to a structure of a wide heat generating recording element.
従来、50mm幅以上の幅をもつ発熱記録素子を製造す
る場合、一枚のアルミナセラミック板を基板とし、その
板上に一度に連続して配列された発熱素子を構成するか
、または、複数枚のアルミナセラミック板をアルミニウ
ム板上に接着して、広い幅の発熱記録素子を製造してい
た。しかし、大型のアルミナセラミック板は製造が難し
く歩留りも悪く高価なものとなる。一方複数枚のアルミ
ナセラミック板をアルミニウム板上に接着した場合、発
熱素子の作動によりアルミナセラミック板は急激に加熱
されたり、冷却される。上記のようにアルミナセラミッ
ク基板は激しいヒートショックにさらされ、アルミニウ
ムとアルミナの熱膨張係数の差により接続部は大きなス
トレスを受け、破損する場合が多い。Conventionally, when manufacturing a heat-generating recording element having a width of 50 mm or more, a single alumina ceramic plate is used as a substrate, and heat-generating elements are arranged continuously on the board at once, or multiple sheets are arranged. A wide range of heat-generating recording elements were manufactured by gluing an alumina ceramic plate onto an aluminum plate. However, large alumina ceramic plates are difficult to manufacture and have low yields, making them expensive. On the other hand, when a plurality of alumina ceramic plates are bonded onto an aluminum plate, the alumina ceramic plate is rapidly heated or cooled by the operation of the heating element. As mentioned above, alumina ceramic substrates are exposed to severe heat shock, and due to the difference in thermal expansion coefficients between aluminum and alumina, the connection parts are subjected to large stress and often break.
この発明は、アルミナセラミック基板をそれと同程度の
熱膨張係数をもつ特定の組成のコバール合金板上に接着
することによつて、温度変化によつて破損されることの
ない発熱記録素子を提供することを目的とするものであ
る。The present invention provides a heat-generating recording element that is not damaged by temperature changes by bonding an alumina ceramic substrate onto a Kovar alloy plate having a specific composition and having a coefficient of thermal expansion comparable to that of the alumina ceramic substrate. The purpose is to
Fe50〜90%、Ni40〜5%、C010〜1%を
主成分とするコバール合金板の組成を、重量%において
、Ni29.5±5%、Co16±3%、残りはFeと
することにより、その熱膨張係数は5.2〜5.4×1
0−6/℃となり、使用するアルミナセラミック基板と
熱膨張係数をほぼ同一にすることができる。By setting the composition of the Kovar alloy plate whose main components are 50 to 90% Fe, 40 to 5% Ni, and 10 to 1% CO, in terms of weight percent, Ni 29.5 ± 5%, Co 16 ± 3%, and the remainder is Fe. Its thermal expansion coefficient is 5.2~5.4×1
0-6/°C, and the coefficient of thermal expansion can be made almost the same as that of the alumina ceramic substrate used.
したがつて、このコバール合金板上に複数枚のアルミナ
セラミック板をそれぞれ互に突き合わして接続した状態
で接着した複数枚の発熱記録素子の接続により構成され
た連続する幅広い発熱記録素子は、ヒートショックによ
る接続部のストレスを受けることはない。以下この発明
の一実施例について図面により説明する。Therefore, a continuous wide heat-generating recording element constructed by connecting a plurality of heat-generating recording elements on which a plurality of alumina ceramic plates are butt-connected and bonded to each other on this Kovar alloy plate is a heat-generating recording element. The connections will not be stressed by shocks. An embodiment of the present invention will be described below with reference to the drawings.
第1図はこの発明の一実施例を構成する2枚の発熱記録
素子の構造を示す平面図、第2図はこの発明に係るコバ
ール合金板の平面図、第3図はこの発明の一実施例を示
す平面図および縦断面図である。図において1は発熱素
子リード、2は発熱素子、3はアルミナセラミック板、
4はコバール合金板、5は接着剤、6は突き合わせ面で
あり、発熱記録素子は第1図に示すように、アルミナセ
ラミック板3を基板とし、その表面上に一列に配列され
た発熱素子2を備えており、コバール合金板4はアルミ
ナセラミツク板3とほぼ同一の熱膨張係数を有する上記
成分よりなる0.1m1〜511の板である。FIG. 1 is a plan view showing the structure of two heat-generating recording elements constituting an embodiment of the invention, FIG. 2 is a plan view of a Kovar alloy plate according to the invention, and FIG. 3 is an embodiment of the invention. FIG. 3 is a plan view and a vertical cross-sectional view showing an example. In the figure, 1 is a heating element lead, 2 is a heating element, 3 is an alumina ceramic plate,
4 is a Kovar alloy plate, 5 is an adhesive, and 6 is a butting surface. As shown in FIG. 1, the heating recording element has an alumina ceramic plate 3 as a substrate, and heating elements 2 arranged in a line on the surface thereof. The Kovar alloy plate 4 is a plate of 0.1 to 511 m made of the above-mentioned components and has almost the same coefficient of thermal expansion as the alumina ceramic plate 3.
この発明の一実施例は第3図に示すとおり2枚の発熱記
録素子をコバール合金板4上に互に突き合わせ面6にお
いて接続した状態でエポキシ系接着剤または他の耐熱性
接着剤により接着された構造であり、ヒートシヨツクを
受けても、コバール合金板4とアルミナセラミツク板3
との熱膨張係数はほとんど同一であるので、突き合わせ
面に歪が発生することはない。したがつてヒートシヨツ
クによる故障の少い幅広い発熱記録素子を得ることがで
きる。特に、この発明ではコバール合金を使用したが、
コバール合金を使用した理由は、経済的(すなわち安価
)であることのみならず、発熱記録素子として、従来使
用されていたアルミニウム板と重量的に極端な差がない
こと、および組成を変えることによつて熱膨張係数をア
ルミナセラミツク基板と同程度のもの(すなわち、5.
2〜5.4×10−6/℃)にすることができるからで
ある。As shown in FIG. 3, one embodiment of the present invention is such that two heat-generating recording elements are bonded together on a Kovar alloy plate 4 at their abutting surfaces 6 using an epoxy adhesive or other heat-resistant adhesive. The Kovar alloy plate 4 and the alumina ceramic plate 3 remain intact even when subjected to heat shock.
Since the coefficient of thermal expansion is almost the same, no distortion occurs on the abutting surfaces. Therefore, it is possible to obtain a wide range of heat-generating recording elements that are less likely to fail due to heat shock. In particular, although Kovar alloy was used in this invention,
The reason for using Kovar alloy is not only that it is economical (that is, cheap), but also that there is no extreme difference in weight from the aluminum plate conventionally used as a heat-generating recording element, and that it is possible to change the composition. Therefore, the coefficient of thermal expansion is comparable to that of the alumina ceramic substrate (i.e., 5.
2 to 5.4×10 −6 /° C.).
以上の説明のとおり、この発明は、アルミナセラミツク
基板をそれと同程度の熱膨張係数をもつ特定の組成のコ
バール合金板上に接着するようにしているため、温度変
化による破損のない発熱記録素子を得ることができ、幅
の広い発熱素子を得ることができるという効果がある。As explained above, in this invention, an alumina ceramic substrate is bonded onto a Kovar alloy plate of a specific composition having a coefficient of thermal expansion comparable to that of the alumina ceramic substrate, so that a heat-generating recording element that is not damaged by temperature changes can be created. This has the effect that a wide heating element can be obtained.
第1図はこの発明の一実施例を構成する2枚の発熱記録
素子の構造を示す平面図、第2図はこの発明に係るコバ
ール合金板の平面図、第3図はこの発明の一実施例を示
す平面図および縦断面図である。
図において2は発熱素子、3はアルミナセラミツク板、
4はコバール合金板、5は接着剤、6は突き合わせ面で
ある。FIG. 1 is a plan view showing the structure of two heat-generating recording elements constituting an embodiment of the invention, FIG. 2 is a plan view of a Kovar alloy plate according to the invention, and FIG. 3 is an embodiment of the invention. FIG. 3 is a plan view and a vertical cross-sectional view showing an example. In the figure, 2 is a heating element, 3 is an alumina ceramic plate,
4 is a Kovar alloy plate, 5 is an adhesive, and 6 is a butt surface.
Claims (1)
ラミック板上に一列に配列された発熱素子を備えた発熱
記録装置の発熱記録素子において、上記一列に配列され
た発熱素子をそれぞれ備えた複数枚のアルミナセラミッ
ク板を、重量%においてNi29.5±5%、Co16
±3%、残りはFeの組成のコバール合金板上に、それ
ぞれ互に突き合せた位置で接着したことを特徴とする発
熱記録素子。1. In a heat generation recording element of a heat generation recording device having an alumina ceramic plate as a substrate and heat generation elements arranged in a line on the alumina ceramic plate, a plurality of sheets of alumina ceramic each having a heat generation element arranged in a line as described above are used. The plate was made of Ni29.5±5%, Co16 in weight%.
A heat-generating recording element characterized in that it is bonded to a Kovar alloy plate having a composition of ±3% and the remainder being Fe at positions where they abut against each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52108461A JPS5921309B2 (en) | 1977-09-08 | 1977-09-08 | fever recording element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52108461A JPS5921309B2 (en) | 1977-09-08 | 1977-09-08 | fever recording element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5441742A JPS5441742A (en) | 1979-04-03 |
JPS5921309B2 true JPS5921309B2 (en) | 1984-05-18 |
Family
ID=14485346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52108461A Expired JPS5921309B2 (en) | 1977-09-08 | 1977-09-08 | fever recording element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5921309B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899053U (en) * | 1981-12-25 | 1983-07-05 | 株式会社リコー | thermal head |
JPS59114938U (en) * | 1983-01-24 | 1984-08-03 | ロ−ム株式会社 | thermal printer head |
JPS59114939U (en) * | 1983-01-24 | 1984-08-03 | ロ−ム株式会社 | thermal printer head |
JPS63162206U (en) * | 1987-04-14 | 1988-10-24 | ||
JP2579732Y2 (en) * | 1991-07-25 | 1998-08-27 | 進工業株式会社 | Cylindrical thermal printing element |
JPH0717072B2 (en) * | 1992-01-28 | 1995-03-01 | ローム株式会社 | Thermal print head |
-
1977
- 1977-09-08 JP JP52108461A patent/JPS5921309B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5441742A (en) | 1979-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5921309B2 (en) | fever recording element | |
WO2020012974A1 (en) | Package, method of manufacturing package, lid body with bonding material, and method of manufacturing lid body with bonding material | |
US3071187A (en) | Heat exchanger | |
JPWO2021200866A5 (en) | ||
JPS61198114A (en) | Coupling structure of structure with large difference in coefficient of thermal expansion | |
CN109168256A (en) | A kind of automobile sensor combined type PCB circuit board | |
JPS5935074A (en) | Ceramic sheet | |
JPS61127674A (en) | Structure of bonding ceramic and metal | |
JPH0234912B2 (en) | SERAMITSUKUSUTOKINZOKUTAITONOSETSUGOHOHO | |
JPH05304435A (en) | Mechanism for assembling slender object | |
JPS5811112B2 (en) | substrate | |
JPH0574943B2 (en) | ||
JPH0292873A (en) | Composite of parts with different coefficients of thermal expansion | |
JPH01145530A (en) | Light detection element | |
JPS6059799A (en) | Composite layer printed circuit board and method of producing same | |
SU582072A1 (en) | Method of joining metal to ceramic | |
JPH0319258Y2 (en) | ||
Erickson et al. | Bonding ceramic materials to metallic substrates for high-temperature low-weight applications | |
JPS58162025A (en) | Ceramic condenser | |
JPH0257508B2 (en) | ||
JPH0228998A (en) | Element substrate with radiation fin and manufacture thereof | |
JPS6158759A (en) | Thermal head | |
JPS60136390A (en) | Ceramic module | |
JPH0583964B2 (en) | ||
JPH04293302A (en) | Dielectric filter |