JPS5921086A - How to make printed wiring boards - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and particularly to an improvement in a method for manufacturing a printed wiring board for applying gold plating to the edges of the printed wiring board. .

(b) Prior art and problems In order to gold plate the terminals of a conventional printed wiring board, as shown in FIG.
A power supply pattern 3 is provided, a power supply electrode 4 is provided at the end of this pattern, a current for gold plating is supplied from this power supply electrode 4, and after gold plating is completed, the printed board 1 is cut along the outer shape. I was taking it and making it. However, this conventional method has the disadvantage that it takes time to cut out the outer shape, and this method is not suitable for island-shaped terminals 2-1 that do not touch the outer periphery of the printed board 1 as shown in FIG. is not preferable, and in order to deal with this, pattern 3- is applied to each terminal 2 and 2-1.
1 is provided, a conductive rubber is pressed into contact with this pattern 3-1 as a power supply electrode, and power is supplied through this rubber. However, this method requires an area on the printed wiring board to accommodate this rubber, which not only impedes the high density of the printed wiring board, but also has the disadvantage that contact resistance changes due to pressure bonding, which also increases the number of handling steps. was there.

(c) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the object of the present invention is to provide a method for producing a printed wiring board that can be plated efficiently and with good quality.

(d) Structure of the Invention Briefly stated, the present invention is characterized in that a power supply short circuit pattern is attached to the part to be plated, power is supplied through this short circuit pattern to perform plating, and the short circuit pattern is cut after plating is completed. Therefore, a printed wiring board of good quality can be obtained.

(e) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 3 is a plan view of one embodiment for explaining the method of manufacturing a printed wiring board of the present invention, and FIG. 4 is a plan view of another embodiment of the present invention. will be used, and its explanation will be omitted.

In the figure, 5 and 6 indicate short circuit patterns.

FIG. 3 shows a case where the power feeding pattern 3 is provided outside the terminal 2 side of the printed wiring board 1 as shown in FIG. 1, and when this printed wiring board 1 has an island terminal 2-1, , a short-circuiting pattern 5 is attached to short-circuit the terminal 2 and the island-shaped terminal 2-1. Needless to say, power is supplied from the supply electrode 4 to the island-shaped terminal 2 via the power supply pattern 3, the terminal 2, and the short circuit pattern 5.
-1 and plated. After plating is completed, the short circuit pattern 3 is cut at point A as shown in the figure.

FIG. 4 is the same as FIG. 3, and the difference is that there are many island-shaped terminals, and there are short circuit patterns 6 in the printed wiring board 1.
, and the same effect as in the previous figure is obtained.

(f) Effects of the Invention As explained in detail above, the method for manufacturing a printed wiring board of the present invention is efficient and does not use contact parts for plating island-shaped terminals, resulting in good plating quality. , which has many advantages in producing printed wiring boards.

[Brief explanation of the drawing]

1 and 2 are plan views showing a conventional manufacturing method, FIG. 3 is a plan view of an embodiment illustrating the method of manufacturing a printed wiring board of the present invention, and FIG. 4 is a plan view of another embodiment of the present invention. FIG. 3 is a plan view showing an example. In the figure, 1 is a printed wiring board, 4 is a supply electrode, 5 and 6
indicate short-circuit patterns. Figure 1 Figure 2-1 Figure 3 Figure 4

Claims (1)

[Claims] This is a method of plating a printed wiring board, in which a short-circuit pattern for power supply is attached to the part to be plated, power is supplied through the short-circuit pattern, the part to be plated is plated, and the short-circuit pattern is cut to form the required pattern. A method for manufacturing a printed wiring board, characterized by performing plating.