JPS59207616A - Method of producing laminated ceramic condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for manufacturing a multilayer ceramic capacitor,
In particular, the present invention relates to a method for cutting a laminate having a predetermined pattern of internal electrodes 7 between stacked green sheets.

[Background technology]

Generally, this type of multilayer ceramic capacitor is manufactured as follows, for example. That is, first, a green sheet (protective sheet) having a predetermined pattern of internal electrodes 7 on its upper surface and having a wall thickness of 100 to 000 μm is housed in a mold. The wall thickness of the internal electrode 7 having a predetermined pattern on the upper surface is 30 to 30 mm.
A plurality of 60 μm green sheets are sequentially stored in a mold. Furthermore, all green sheets (protective sheets) with a wall thickness of 100 to 200 μm are stored. In this state, the green sheet and the internal electrodes are pressed together with a green sheet (th) pressing body. Next, this laminate is affixed to the entire resin sheet, and then cut vertically using a long and narrow cutter device.

Cut it horizontally and make it into chips. Next, this chip is peeled off from the entire resin sheet and placed on a sintering setter. Thereafter, the chip is completely sintered and electrode extensions 8w are formed at both ends to obtain a multilayer ceramic capacitor.

By the way, laminates are made into chips by sequentially cutting the entire laminate horizontally using a long and thin cutter device, but because the blades of the cutter device are thick and wide, chips are not formed during cutting. It tends to stick to the blade or stress is applied to the chip, resulting in a loss of properties. Moreover, since the chip is extremely small,
There is a problem that peeling from the resin sheet requires a large amount of man-hours, and feeding to the sintering setter cannot be carried out smoothly. [Disclosure of the Invention] Therefore, the purpose of the present invention is to cut and separate the laminate. It is an object of the present invention to provide a method for manufacturing a multilayer ceramic capacitor that can be highly efficient and can also be smoothly supplied to a sintering setter.

The feature of the present invention is that when cutting the entire laminate having a predetermined pattern of internal electrodes 7 between the stacked green sheets into dice, the entire cutter device having the thin wires arranged in a lattice pattern is fully utilized.

According to this invention, the laminate is cut into dice by a single cutting operation of the cutter device having all the thin wires arranged in a lattice pattern, so that the entire cutting operation can be carried out swiftly and efficiently.

Moreover, since the cutter device is composed of thin wire,
It is possible to cut the laminate without applying stress 7 to it. For this reason, it is possible to completely eliminate any influence on the characteristics.

Furthermore, since the laminate is cut and separated while stored in the mold, the resin sheet t4 can be completely omitted.

For this reason, not only can the large number of man-hours required for peeling the chips from the resin sheet be completely saved, but also the chips can be placed on a setter for sintering at the same time as cutting, making this type of work significantly more efficient.

[Best mode for carrying out the invention]

Next, an embodiment of the present invention will be described with reference to all of FIGS. 1 to 6.

First, as shown in FIG. 1, internal electrodes 2 with a predetermined pattern are screen printed on the upper surface of the mold 1 to a thickness of 150 mm.
A green sheet 3 of μm is stored.

Then, on top of this green sheet 3, a plurality of green sheets 4 having a wall thickness of 60 μm each having a predetermined pattern of internal electrodes 2 screen-printed on the upper surface are sequentially placed in a stacked manner. Subsequently, the entire green sheet 5 having a wall thickness of 150 μm is placed. In this state, the pressing body 6 is completely lowered, so that the green sheet 3°4.5 and the internal electrode 2 are integrated, and the laminate 7 shown in FIG. 2 is formed. Next, Figure 3~
As shown in FIG. 4, the entire laminate 7 is housed in the formwork 8. Thin metal wires 9 are arranged and fixed in a grid pattern at the lower end of the opening of the formwork 8, and the laminate 7 is placed on the thin metal wires 9. A pressing body 10 is disposed above the formwork 8 so as to be vertically movable, and step portions 11, 11 are formed at both ends of the pressing body 10. Further, a sintering setter 12 is arranged below the formwork 8. Next, as shown in FIG. 5, the laminate 7 is heated to a temperature of 50 to 100 DEG C. while the pressing body 10i is inserted into the formwork 8. As a result, the laminate 7 is pressed by the lower surface 10a of the pressing body 10 and begins to descend. At this time, the laminate 7 is cut into dice shapes using the thin metal wires 9. Then, when the lower surface 10EL of the pressing body 10 comes into contact with the thin metal wire 9, the chip 7t is automatically placed on the sintering setter 12. Note that when the lower surface 10a of the pressing body 10 is brought into contact with the thin metal m9, the stepped portions 11, 1 of the pressing body 10
1 is brought into contact with the upper surface of the formwork 8 to prevent further descent. Thereafter, the chip 7' is sintered, and as shown in FIG. 6, an electrode extension layer 13 is formed on the exposed end face of the internal electrode 2, thereby obtaining a multilayer ceramic capacitor.

According to this embodiment, the entire laminate 7 can be cut into a desired shape by simply storing the entire laminate 7 in the formwork 8 and pressing it with the presser lO, and can also be placed on the sintering setter 12. . Therefore, this series of operations can be made extremely efficient.

Moreover, since the cutter device is made of thin metal wires 9 and the laminate 7 is appropriately heated during cutting, the laminate 7 can be reliably cut without applying stress 7 to the laminate 7.

7 to 8 show another embodiment 7 of the cutter device according to the present invention, in which a pressing body 10 +
is located. Below this pressing body lot is a protrusion F! having a protrusion amount 7 equal to the thickness of the laminate 7! fS14 is formed. At the lower end of this protrusion 14, thin metal wires 9 are arranged in a grid pattern. Note that the pressing body 10. It is also possible to configure the portion indicated by the dotted line in the figure to be slightly movable.

Cutting of the laminate 7 by this device is performed as follows.

First, the lower opening of the formwork 8 is closed with a lid (not shown). After storing the laminate 7 in the formwork 8, the pressing body 10. is lowered until the thin metal wire 9 comes into contact with the lid body. As a result, the laminate 7 is cut into dice, and the chip 7'' is housed in the protrusion 14.Next, the lid is removed, and the central portion of the pressing body 10 (the dotted line portion shown in the figure) is removed. ), the chips fall onto the sintering vine 12.

In addition, in the present invention, the thin wire may be made of resin or the like in addition to metal. Further, heating when cutting the laminate can be omitted.

[Brief explanation of the drawing]

1 to 6 are explanatory diagrams of the method of the present invention, in which FIG. 1 is a side sectional view showing a state in which a green sheet is stored in a mold;
Figure 2 is a side sectional view of the laminate, Figure 3 is a side sectional view showing how the laminate is stored in the formwork, Figure 4 is a bottom view of Figure 3, and Figure 5 is a side view of the laminate in a cut state. 6 is a side sectional view of a multilayer ceramic capacitor in a completed state, FIG. 7 is a side sectional view showing another embodiment of the cutter device according to the present invention, and FIG. 8 is a bottom view of FIG. 7. be. Figure 1 Figure 2 ヱ Figure 3 Q Figure 4 Figure 51 Q Figure 6 ＼ : ■ ■

Claims (1)

[Claims] A predetermined pattern s'i between stacked green sheets
A method for manufacturing a multilayer ceramic capacitor, characterized in that a cutter device having thin wires arranged in a lattice pattern is used when cutting a laminate having all t-poles into dice.