JPS59204614A - Molding material for sealing semiconductor part - Google Patents

Abstract

PURPOSE:A molding material for sealing semiconductor devices, consisting of a fine powdered and compressed binary system containing specific components, and having improved pot life and retained curability and other characteristics. CONSTITUTION:A molding material, containing (A) an epoxy resin, e.g. glycidyl ether of bisphenol A or polyethylene glycol, etc., (B) a novolak type phenolic resin, e.g. a resin prepared by condensing and dehydrating a phenol with HCHO, as a curing agent, (C) a catalyst, e.g. 2-methylimidazole or benzyldimethylamine, and (D) a filler, e.g. silica or clay, and obtained by incorpoarating the component (A) in (i) a component system, incorporating >=10wt% component (B) and the component (C) in (ii) a component system as essential components, mixing the respective systems (i) and (ii) at the softening points of the respective component resins or above under melting, pulverizing the resultant mixture into fine powder, and compressing and compacting the resultant fine powdered material containing the uniformly dispersed systems (i) and (ii) at >=0.8 compression ratio.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin molding material for encapsulating electronic components, which has an excellent pot life.

Epoxy resins have excellent moisture resistance, electrical properties, and mechanical properties, so they are widely used as electrical insulating materials. In particular, when it comes to resin sealing of transistors, guide circuits, etc., high moisture resistance and electrical properties are essential, epoxy resin, polyamine as a hardening agent, etc.
Acid anhydride, novolac type phenol side + IM yz, and epoxy resin for low pressure transfer molding with silica as the main component are used for acidic power S king.

However, epoxy resin compositions III and QARX are generally inferior to hotlines and require a refrigerator for transportation and storage, and are extremely difficult to handle compared to other thermosetting resin compositions such as unsaturated polyester resins, diallyl di-thalerate resins, and phenolic resins. It's weird. In addition, the resin fl''I, which has good storage stability, is inferior in properties, so it can currently only be used in a limited number of applications, such as for sealing pouches containing conductors.

On the other hand, as a method for improving the pot life of epoxy resin compositions, epoxy resins are mechanically powdered with a hardening agent.
The so-called tri-blend manufacturing method is well known. Since the molding material made from tri-blend tin is divided into resin and hardening agent, the curing properties are considerably slow, so it is necessary to use one eye resin in the molding material used for the light jaw material. and lAα is confusing because n of the filler is an elemental component (Also, custom orders also decrease l
It had a number of drawbacks, and its characteristics made it unsuitable for practical use. For the above reasons, epoxy 4 for sealing the Chihiro Body Apparatus
It is common to make phantom resin molding materials by bath-melting the entire composition using a mixing machine such as a mixer roll or an extruder. It was something I couldn't get.

Unexploded E! A has carefully considered the above issues, and
The object is to provide a molding material which can attract the characteristic compatibility with the lobe pot line with the formula 1.

The non-invention is a molding material for encapsulating electronic components, which contains an epoxy tree B, (b) a novolac type phenolic resin as a hardening agent, (C) a catalyst, and (d) a filler as essential components. ) and (II), which are uniformly dispersed fine powder, are densified at the compressed end to a compression ratio of 0.8 or more, and (1) RJ epoxy resin is an essential component.
10% or more on the novolac-type phenol side and fusu as an essential component of the catalyst. After pulverization, the resulting molding material is completely powdered.
1i! It is better on the hot line than molding materials made by mixing, and also has better curing properties and properties.

As a curing agent, polyamines such as diaminodiphenylmethane and diaminodiphenylsulfone, and also 'r
Acid anhydrides such as HP A and BTD A tend to be inferior to Hotton 2 when micronized, and the present invention V'c
Although it cannot be used as a curing agent, the fluid retention rate of 40i and 6μ Nitsun is as good as 80% when used on a platform that does not use enol resin.

In addition, as a curing agent, novolac-type phenolic resin was added without using fat, (γL with novolac-type phenol resin boiled in the υ system).
can be done. In other words, since there is almost no reaction between the epoxy resin and the novolak-type resin, it does not drop to the pot line, and when mixing in the bath melt, (1) phenolic resin is added to the thread. It is possible to know someone.

However, (if the male line has a catalyst level of K, the number of children in the beating thread will be extremely small, and it will be difficult to mix the (1) system and (11) system evenly, so apply more than 10% of the enol resin (11). ) It is shinta that is used for thread.

In addition, as for molding materials, imitation powder tablets can also be corrected into granules. l) Dense C is desirable from the viewpoint of degassing when handling balls, and the compression ratio (composition ratio/composition ratio) =
It is safe to know that the pressure end can be mechanically reduced to 0.8 or higher. In this case, the particle size of the fine powder is 50X forging% before the tray.
It is preferable that C is 44μ or less, and that the weight and weight is 2% or less with a force and strength of 100μ or more.If the powder is pulverized too much, the pot life will be reduced.

Examples of epoxy resins that can be used in the present invention include glycyl ethers of phenols such as bisphenol A, bisphenol F lusorcinol, phenol novosic, and cresol novolac, and alcohols such as butanediol, polyethylene glycol, and polyethylene glycol. Glycidyl-type epoxy resins, such as glycidyl esters of carboxylic acids such as dithalic acid, isophthalic acid, and tetodihydrophthalic acid, are epoxidized at the inside of the molecule to form the so-called moon ring. There are mold epoxides, etc.

In addition to the novolak type phenolic resin used as a curing agent, it is generally made by condensing phenol, cresol, xylenol, etc. with formalin or paraformaldehyde in the presence of an acidic catalyst and dehydrating it. It is.

Also, use of hardening agent] - 0.00 for 1 epoxide.
5 to 1.5 equivalents are preferred, and this range? If this is exceeded, the hardenability and customization properties will be significantly reduced.

As a catalyst, 2-methylimidazole, 2-ether-4
-Imidazoles such as methylimidazole, amines such as benzyldimethylamine, trisdimethylaminemethylphenol, phosphorus compounds such as triphenylphos-2-yne, tributylphosphine, and tetraphenylphosphonium tetraphenylfolate, etc. Materials can be used for pregnancy (in the male lineage).Silica, clay, alumina, barium chain acid,
It can be used for powdered inorganic*' such as mica powder, water-containing alumina, and wollastonite, with silica powder being preferred.

The method of dividing the optical filler into the (I) and (n) systems is sometimes limited by bath-melting the yarns, but the (IJ system) It is preferable to use as much as possible, and (n) system Kl'ff may be completely used.

In addition, a coloring agent, a mold release agent, and C may be used in the molding material of the present invention as necessary. Although there are no immediate restrictions on the method of dividing the cold caustic agent into the (i) and (11) systems, it is important to make the coupling explosion roughly proportional to the optical filler contribution. It is preferable to make the other factors proportional to the amount of resin and curing agent.

The following is an example of a concrete straight bending table 1.
230. Softening point: 77°C (Japan TepaGeigy Co., Ltd. trade name) (2) Novolac type phenolic resin, equivalent weight 106. Softening point: 85°C (Hitachi Chemical trade name) (3) Fused silica powder (Tatsumori trade name).

(4) γ-glycidoxyglobiltrimethoxy 2
Divide the composition shown in Table 1vc into 1-(1)B and 1-(loss).
After melting and mixing on a mixing roll at 0° C. for 5 minutes, the mixture was taken out in the form of a sheet and cooled.

After coarsely pulverizing 1-(1) and 1-(II), they were mixed in a V-type blender. Next, when it was copy-pulverized at 7400 rpm using a bottle mill (Colplex 160Z model manufactured by Albi Fusha Co., Ltd.), the particle size was found to be 1 for particles of 100 μm or more (78% or more of particles of 44 μm or less).

The mixture was pressurized to a compression ratio of 0.85 to form a tablet, which was then subjected to molding.

Example 2 material in the same manner as in Example 1. I-produced.

7z for items over 100μ (81 for items under 44μ)
% was rare. This was also compressed to a compression ratio of 0.86 and made into tablets.

:ni:Ryubutsu 6, Ri-(kl)H177Scoi Zitei 40°Cr2
After melting and mixing, the mixture was cooled and coarsely ground. In addition, there was no material with a thickness of 0100μ or more that was coated in the same manner as in Example 1, and 89% of the materials had a thickness of 44μ or more. This product was also made into a doublet at a compression ratio of 0.86 and subjected to molding.

Example 4 0100 manufactured by the same method as Example 6
oct''L, which had 0.6% of the content of 0.6% or more than μ or 60% of the content of 44μ or less, was also tabletted at a pressure ratio of 0.85 and subjected to molding.Comparative Example 1 The composition shown in Table IK was After being coated with bath melted oil for 5 minutes with a mixing roll, it is cooled and coarsely pulverized, and the compression ratio is 0.8.
The mixture was made into a tablet using Step 2 and subjected to molding.

Table 2 Characteristics table Arm bending for the characteristics shown in Table 2vc.

A test piece for measuring properties was molded by a transfer molding method under the conditions of curing at 180°C for 2 minutes, and then rapidly curing at 180°C for 5:10 minutes. For volume resistivity, 100ml1llφ-5mm
Measurement was performed according to JIS K6911 using a disc of i. Also, PC'lJ Glacier Cooker Test is an abbreviation for the 0 glass transition width after 100 hours of treatment in steam at 120°C. The measurement was carried out at 180° C. using a JSR type long-absorbing resin rust meter (manufactured by Imanaka Machinery Co., Ltd.). The hot life of the valley materials of Examples 1 to 4 was very good when measured at 18q°C using spiral flow 1'ff and El'vll Kinryo coating with an injection pressure cuff of 0 kg/d.
I can't think of an epoxy resin molding material for L-t.
Oa et al.

The glass transition salinity and electrical properties are also improved by the rice-manufacturing method, I''J, etc., and it is used as a molding material for pricking electronic parts by the P1 invention, and as a molding material that has both pot life and physical properties.

Claims (1)

[Claims] 1. (a) -r-boxy resin, (b) novolac type phenol resin as a curing agent, (C) catalyst and (aJ
2. A molding material for encapsulating electronic parts that has a light cross material as an essential component has two threads (1) and (n) uniformly dispersed in the molding material with a pressure-to-dynamic ratio of 0.8 or more. It is a compressed densified GNFC material, and (I) is coated with epoxy resin as an essential component, and contains 10% or more of novolac type phenolic resin as an essential component of the catalyst, and (1) as an essential component. A molding material for encapsulating electronic parts, which is made by mixing with resin at a temperature above the softening point of the resin and then pulverizing it. 2. @Powder particles with a particle size of 100μ or more are 2.
Items with a diameter of 44μ or less. The molding material for encapsulating electronic components according to claim 1 of the watch claim, which has a molding material of at least 10%.