JPS59204300A - Case of electronic device or the like - Google Patents
Case of electronic device or the likeInfo
- Publication number
- JPS59204300A JPS59204300A JP58078745A JP7874583A JPS59204300A JP S59204300 A JPS59204300 A JP S59204300A JP 58078745 A JP58078745 A JP 58078745A JP 7874583 A JP7874583 A JP 7874583A JP S59204300 A JPS59204300 A JP S59204300A
- Authority
- JP
- Japan
- Prior art keywords
- case
- layer
- wall
- electromagnetic shielding
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001169 thermoplastic Polymers 0.000 claims description 24
- 239000000463 material Substances 0.000 description 9
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000071 blow moulding Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Calculators And Similar Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電磁波をシールドすることのできる電子機器等
のケースに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a case for electronic equipment and the like that can shield electromagnetic waves.
一般ニ電子機器等のケース、例えばパーソナルコンピュ
ータのハウジングケースは、外部から発生、した電磁波
がケース内部の電子機器に影響したり、逆にケース内部
の電子機器がら発生した電磁波が外部へ放出することを
防ぐことが、近年とみに要求されている。このような電
磁波をシールドすることρできるケースは従来、外表面
を電磁波シールド材料にて塗装したケースが知らねてい
るが、塗装面が剥離する欠点があることから、最近、電
磁波シールド材料を混合したプラスチ、りを射出成形し
てなるケースが注目されているが、ケースの射出ゲート
付近とその他の部分との電磁波シールド特性の不均一が
生じ、またケース外表面に繊維等の電磁波シールド材料
が露出し、外観を低下させる問題があった。Cases for general electronic devices, such as the housing case of a personal computer, can cause electromagnetic waves generated from the outside to affect the electronic devices inside the case, or conversely, electromagnetic waves generated by the electronic devices inside the case to be emitted to the outside. In recent years, there has been a growing demand for prevention. Cases that can shield such electromagnetic waves have been known in the past by coating the outer surface with electromagnetic shielding material, but since the painted surface has the disadvantage of peeling, recently, electromagnetic shielding materials have been mixed. Cases made by injection molding of plastic and resin are attracting attention, but the electromagnetic wave shielding properties around the injection gate and other parts of the case are uneven, and the outer surface of the case is coated with electromagnetic shielding materials such as fibers. There was a problem of exposure and degrading the appearance.
本発明の第1の目的は、電硼シールド性の1与された熱
可塑性プラスチ、り層と、プローIt ノ高い熱可塑性
プラスチ、り層とを多層ブロー成形したケース部イオか
らなる、ケース全体に電磁波シールド特性の均一な電子
機器待のケースを提供することにある。また本発明の第
スの1]的は、1−記り一スにおいて、ケース部材を、
2屯壁に611)成し、J−記壁の外層はブロー比の高
い熱呵りv性プラスチ。The first object of the present invention is to provide an entire case consisting of a multi-layer blow molded case made of a thermoplastic plastic layer with a high electric shielding property and a thermoplastic plastic layer with a high resistance to blow molding. The purpose of this invention is to provide a case for electronic equipment with uniform electromagnetic shielding characteristics. In addition, the first object of the present invention is to provide the case member in the item 1-1.
611) on the 2nd wall, and the outer layer of the J-wall is made of heat-resistant plastic with a high blow ratio.
りにて構成してなる、外観特性の優れた電子機器等のケ
ースを提供することにある。It is an object of the present invention to provide a case for electronic equipment, etc., which is constructed of the same material and has excellent appearance characteristics.
以下本発明の一実施例を図面に基づき説明する。An embodiment of the present invention will be described below based on the drawings.
第1図において、/はパーソナルコンピュータのケース
であり、該ケース/は本体−と蓋体3とを合わせ面PL
にて接合される。りは本体λ及び蓋体3と一体に連設し
たヒンジであり、該ヒンジクを軸点として本体λと蓋体
3とを合わせ蓋体3に一体に連設したラッチタを本体ユ
のう、チ受凸起乙に嵌合してケース/は閉じられる。ま
た、7はパーソナルコンピュータの前面に位置するキー
ボード、表示部等の操作パネルである。In FIG. 1, / is a case of a personal computer, and the case / is a surface PL where the main body and the lid 3 are joined together.
It is joined at. This is a hinge that is integrally connected to the main body λ and the lid 3, and the main body λ and the lid 3 are aligned with the hinge as an axis point, and the latchter that is integrally connected to the lid 3 is attached to the main body and the lid 3. The case is closed by fitting into the receiving protrusion. Further, 7 is an operation panel such as a keyboard and a display section located on the front side of the personal computer.
第2図において、パーソナルコンピュータの電子機器g
はケース/によって保獲されている。本体ノ及び2.7
体3はそれぞれ内壁7及び外壁10を自する中空、2市
壁構造に構成され、それぞれの壁は電磁波シールド性の
付与された熱可塑性プラスチ、り(以下EMITPとい
う)にて構成された内層/Aと、電磁波シールド性の付
与されないブロー比の高い熱tiJ Vfi性プラプラ
スチック下TPjという)にて構成された外層/Bから
なるコ層に構成されている。また、内壁ワと外壁10の
境界は合わせ面PLの外側周縁に位置し、EMIからな
る内層/Aは連続的に合わせ面P’L表((αまて延出
して構成することにより、電磁波シールド1)性を向上
させている。In Figure 2, the electronic device g of the personal computer
is held by Case/. Main body and 2.7
The body 3 has a hollow two-wall structure with an inner wall 7 and an outer wall 10, and each wall has an inner layer made of thermoplastic plastic (hereinafter referred to as EMITP) with electromagnetic shielding properties. A, and an outer layer/B made of a high-blow-ratio thermal tiJ Vfi plastic material (referred to as TPj) that does not provide electromagnetic shielding properties. In addition, the boundary between the inner wall W and the outer wall 10 is located at the outer periphery of the mating surface PL, and the inner layer /A made of EMI is continuously extended from the mating surface P'L ((α) to prevent electromagnetic waves. Shield 1) Improves performance.
り下に、本発明に係るケース/の製造方法を第3図およ
び第7図に基づき説明するに、//、/2は分割形式の
金型で一方の金型//には凸形キ、ビティ//1が、他
方の金型/2には門形キャビティ/21が形成される。Below, the manufacturing method of the case/ according to the present invention will be explained based on FIGS. 3 and 7. //, /2 are divided molds, and one mold // has a convex key. , and a gate-shaped cavity /21 is formed in the other mold /2.
まず、EMITPとTPとをそれぞれの押出機(図示せ
ず)にて溶融混練しそれぞれの押出機より接続された押
出グイ内(図示せず)にて接合し、内層/3aがEMI
TPからなり外1e / 3 bがTPカラナルllI
!vJ化状j、’71 ノ多層状バリスン/3を押出す
。ついで、凸形キャビティ//1と門形キャビティ/2
1との間に位置するよう押出して配置されたパリスン/
3を、金ノ1lIJ//、/2のキャビティ縁部C全周
面にて把持するよう、金型//、/2を閉鎖する。この
把持する手段としては、バリスン/3をプリブロー(E
端的に膨らませる)したり、また大1」径のバリスンを
押出すことにより行なえる。ついで、金型//、/2に
て囲まれたパリメン/3内に圧縮空気盾の+−+:、力
流体を導入して、バリスン/3を凸形キャビティ//’
及び凹形キャビティ/、2+の形状に対応する形状まで
膨張させ本体スが構成される。First, EMITP and TP are melt-kneaded in respective extruders (not shown) and joined in an extrusion gouer (not shown) connected from each extruder, so that the inner layer/3a is EMI
Consisting of TP, outer 1e/3b is TP KaranarullI
! Extrude vJ version j, '71 multi-layered ballisne/3. Next, convex cavity //1 and portal cavity /2
The parison is extruded and placed between 1 and 1.
The molds //, /2 are closed so that the molds #3 are gripped on the entire circumferential surface of the cavity edge C of the metal molds 11IJ//, /2. As a means of gripping, the Balisson/3 is pre-blow (E
This can be done by simply inflating (inflating) or by extruding a large 1" diameter ballison. Next, a compressed air shield +-+:, force fluid is introduced into the parimen/3 surrounded by the mold //, /2, and the balisne/3 is made into the convex cavity //'
The main body is constructed by expanding the concave cavity/, to a shape corresponding to the shape of 2+.
また、第1図に4くずような本体λと蓋体3とがヒンジ
グにて一体に連設されたケース/を製造する場合には、
1.′r公昭ダワー/g7ダg号公報に示されている如
く、バリスン/3の押出方向の略中間を金型内の突起に
て圧縮薄肉化してヒンジグを形成するとともに、ヒンジ
グの両側に位置するバリスン/3を膨張することにより
、本体コ及び蓋体3を構成することができる。In addition, when manufacturing a case in which the main body λ and the lid 3 are connected together with a hinge, as shown in FIG. 1,
1. As shown in Kosho Dower/g7 Dower G, a hinge is formed by compressing and thinning approximately the middle of the extrusion direction of Balison/3 using a protrusion in a mold, and the hinge is located on both sides of the hinge. The main body and the lid 3 can be constructed by expanding the ballison/3.
電磁波シールド性の付与された熱可塑性プラスチ、7り
(EMITP)とは、ポリエチレン、ポリプロピレン、
ポリアミド、ABS等ブロー成形可能なプラスチ、りに
、ファイバー、フレークまたパウダー状のカーボン、鉄
、黄銅またアルミを混合してなる材料、またプラスチ1
.り自体電磁波シールド性をイJする材料である。EM
ITPにおいて、熱可塑性プラスチ、7り(例えばポリ
エチレン。Thermoplastic plastic with electromagnetic shielding properties (EMITP) is made of polyethylene, polypropylene,
Blow-moldable plastics such as polyamide and ABS, materials made by mixing resin, fibers, flakes or powdered carbon, iron, brass or aluminum, and plastics 1
.. It is a material that itself has good electromagnetic shielding properties. E.M.
In ITP, thermoplastic plastics, such as polyethylene.
ポリプロピレン等のポリオレフィン) / 004年部
に対し、太さSO〜/乙0μ、長さ/〜/Immの鉄、
黄銅またはアルミ繊維70〜1.10重石部61−合し
てなる材料を用いるのが、押出機混練性、ゲイ内接合性
、ブロー成形性及び電磁波シールド9゛・1性の面にお
いて好ましい。なお、E M 工T Pの電磁波シール
ド特性とは体積固有抵抗値が/Ω、6m以下、好ましく
は/×70−コΩ・on以ト°である3、また、電磁波
シールド性の付与されないブロー比の高い熱可塑性プラ
スチ、り(TP)とは、ボリエヂレン、ポリプロピレン
、ポリアミ” + A B S ’5ブロー成形+zf
能なプラスチ、りであり、TPにおいて灰色、赤色+
h’色、黄色等黒色以外の顔料を混合してなるプラスチ
1.りが外l1311時filの面において好ましい。Polyolefin such as polypropylene) / For 004 part, thickness SO~/Otsu 0μ, length /~/Imm iron,
It is preferable to use a material made of brass or aluminum fibers 70 to 1.10 weights 61 in terms of extruder kneading properties, intragay bonding properties, blow moldability, and electromagnetic shielding properties. In addition, the electromagnetic shielding property of E M Engineering T P is defined as having a volume resistivity of /Ω, 6 m or less, preferably /×70-Ω・on or less3, and a blower that does not have electromagnetic shielding properties. Thermoplastic plastics (TP) with a high ratio are polyethylene, polypropylene, polyamide + A B S '5 blow molding + Zf
It is a functional plasti, and it is gray, red + in TP.
Plasti made by mixing pigments other than black such as h' color and yellow 1. This is preferable in terms of outer 1311 time fil.
なお、TPの高いブロー比とはtjJ Vfi化状態の
伸性に優れていることを示し、ブリー比の高い熱可塑性
プラスチ、りを使用することにより金型に彫刻された深
さ0.O5−01l−のエンボス模様をほぼ忠実にケー
ス表面に再現し、また肉厚の均一なケースを得ることが
で、きる。またTPO体積固有抵抗値は/ 0’〜10
40Ω・αである。Note that a high blow ratio of TP indicates excellent elongation in the tjJ Vfi state, and by using a thermoplastic plastic with a high blow ratio, the depth 0. The embossed pattern of O5-01l- can be almost faithfully reproduced on the case surface, and a case with uniform wall thickness can be obtained. In addition, the TPO volume resistivity value is / 0'~10
It is 40Ω·α.
また、本発明においてケースとはパーソナルコンビ、−
タ、ワードブロセ、、す、電気・電子計測器、電子楽器
等のハウジングケース部材、キャリングケース部材等で
あり、ケースのうち一部、例えば本体部拐に本発明のケ
ース部材を使用して、他の部材(・才公知のケース部材
を使用することができる。In addition, in the present invention, the case refers to a personal combination, -
Housing case members, carrying case members, etc. for electrical/electronic measuring instruments, electronic musical instruments, etc., using the case member of the present invention for a part of the case, for example, the main body part, A known case member can be used.
本発明において多層とは2層以上を示すものであり1例
えば内外層をT P’にて構成し、中間層をEMIにて
構成した3層とすることもできる。尚上記3層の場合で
あっても、ブロー成形することによりa層の場合と同じ
<EMITPからなる層は連続的に合わせ面PL衣表面
で延出して構成することができる。また、EMITPか
らなる材料はブロー成形性に乏しいことから、EM’I
TPからなる層とTPからなる層とのケース壁の平均肉
厚比は30:3θ〜左、7kに設定するのが好ましい。In the present invention, multilayer refers to two or more layers, and for example, it may be three layers, with the inner and outer layers made of TP' and the intermediate layer made of EMI. Even in the case of the above-mentioned three layers, by blow molding, the layer consisting of <EMITP as in the case of layer a can be constructed by continuously extending on the surface of the mating surface PL. In addition, since the material made of EMITP has poor blow moldability, EM'I
The average thickness ratio of the case wall between the layer made of TP and the layer made of TP is preferably set to 30:3θ to 7k.
上記実施例において、ケース部4Jである本体λあるい
は蓋体3は中空2重壁構造に構成されているので、内壁
9は電子機器gを保、(Qするのに適したリブ、リセス
等の形状を外壁10のrし状に関わりなく形成すること
ができるとともに、緩函性。In the above embodiment, the main body λ or the lid 3, which is the case part 4J, has a hollow double wall structure, so the inner wall 9 has ribs, recesses, etc. suitable for holding the electronic device g. The shape can be formed regardless of the curved shape of the outer wall 10, and it is easy to package.
軽量性の面で優れている。また、第2図に、」〈ず如<
、EMITPからなる内壁9とTPからなる外壁の境界
は合わせ面PLの外側周縁に位11tシ、EMIからな
る内層/Aは連続的に合わせ而P L表面まで延出して
構成することにより電磁波シールド特性を向上すること
ができる。Excellent in terms of lightness. Also, in Figure 2,
, the boundary between the inner wall 9 made of EMITP and the outer wall made of TP is located at the outer periphery of the mating surface PL, and the inner layer /A made of EMI extends continuously to the surface of PL, thereby providing electromagnetic wave shielding. Characteristics can be improved.
本発明は上記の如く、電磁波シールドの1与された熱可
塑性プラスチ、り層と、電磁シ−ルド性の付与されない
熱可塑性プラスチ、り層とを多層ブロー成形したケース
部材からなる、ケース全体に電磁波シールド特性の均一
な電子機器等の収納ケースを得ることができ、また、ケ
ース部’Mを1重壁に構成し、上記壁の外層は電磁シー
ルド性の付力されない熱可塑性プラスチ、りにて構成し
てなる。外観特性の優れた電子機器雪の収納ケースを得
ることができる。また1本発明に係るケース部イオ°の
外層をファイバー等の充填物を含まないブロー比の高い
熱可塑性プラスチ、りにて構成すれば、金型に彫刻され
た深さ0.03〜0. ’l vnmのエンボス模様を
ほぼ忠実に外層へ再現して構成することができる。As described above, the present invention consists of a case member made of multilayer blow molding of a thermoplastic plastic layer provided with electromagnetic shielding properties and a thermoplastic plastic plastic layer provided with no electromagnetic shielding properties. A storage case for electronic devices etc. with uniform electromagnetic shielding properties can be obtained, and the case part 'M is constructed with a single wall, and the outer layer of the wall is made of thermoplastic plastic that has electromagnetic shielding properties and is not loaded. It is composed of It is possible to obtain an electronic device snow storage case with excellent appearance characteristics. In addition, if the outer layer of the case part according to the present invention is made of thermoplastic plastic with a high blow ratio and does not contain fillers such as fibers, the depth engraved on the mold may be 0.03 to 0. The embossed pattern of 'lvnm can be almost faithfully reproduced on the outer layer.
第1図は本発明に係るケースの斜視図、第2図は第1図
の要部断面図、第3図及び第9図は本発明に係るケース
を製造する工程を説明する金型横断面略図である。
/@電子機器のケース
一本 体
3蓋体
7内 壁
10外 壁
特許出願人
キョーラク株式会社FIG. 1 is a perspective view of a case according to the present invention, FIG. 2 is a sectional view of the main part of FIG. This is a schematic diagram. /@ One electronic device case Body 3 Inside lid 7 Wall 10 Outside Wall Patent applicant Kyoraku Co., Ltd.
Claims (1)
り層と、ブロー比の高い熱可塑性プラスチ、7り層とを
多層ブロー成形したケース部材からなることを特徴とす
る電子機器等のケース。 2)ケース部材を、2重壁に構成し、上記壁の外層ハフ
ロー比の高い熱可塑性プラスチックにて構成してなる特
許請求の範囲第1項記載の電子機器等のケース。[Claims] /) Thermoplastic plastic with electromagnetic shielding properties;
A case for an electronic device, etc., characterized in that the case is made of a multilayer blow-molded case member made of a double layer, a thermoplastic plastic layer with a high blow ratio, and a seven layer. 2) A case for an electronic device or the like according to claim 1, wherein the case member has a double wall structure, and the outer layer of the wall is made of a thermoplastic plastic having a high flow ratio.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58078745A JPS59204300A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58078745A JPS59204300A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59204300A true JPS59204300A (en) | 1984-11-19 |
JPH0231877B2 JPH0231877B2 (en) | 1990-07-17 |
Family
ID=13670419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58078745A Granted JPS59204300A (en) | 1983-05-04 | 1983-05-04 | Case of electronic device or the like |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59204300A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825098U (en) * | 1981-08-12 | 1983-02-17 | 株式会社東芝 | electronic equipment housing |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AR205727A1 (en) * | 1974-03-22 | 1976-05-31 | Rohm & Haas | MODIFYING COMPOSITION TO EXTRUDE ALVEOLAR POLYVINYL CHLORIDE |
-
1983
- 1983-05-04 JP JP58078745A patent/JPS59204300A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825098U (en) * | 1981-08-12 | 1983-02-17 | 株式会社東芝 | electronic equipment housing |
Also Published As
Publication number | Publication date |
---|---|
JPH0231877B2 (en) | 1990-07-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20040089659A1 (en) | Transport and storage container for liquids and method for manufacturing an inner plastic container of the transport and storage container | |
CN104477507A (en) | Films, packaging and methods for making them | |
CN102118929B (en) | Molded article for housing of an electronic device and method for producing the same | |
CN102834237A (en) | Injection moulding method for modifying a surface of an apolar polymer molded body and multiple layer film for this method | |
RU96121335A (en) | EXTRUSION OF THERMALLY BINDING MATERIALS | |
JPS59204300A (en) | Case of electronic device or the like | |
JPS59204299A (en) | Case of electronic device or the like | |
JPH0425852B2 (en) | ||
JPS61195822A (en) | Manufacture of electromagnetic-shielding molded article | |
JPH06204678A (en) | Plastic housing panel | |
JPH11207896A (en) | Coating substitution film | |
JP3280784B2 (en) | Manufacturing method of sheet for coating | |
JP3345076B2 (en) | Manufacturing method of molded products | |
JP3444414B2 (en) | Molded products for packaging electronic components | |
JPS6137670Y2 (en) | ||
JP4108375B2 (en) | Decorative resin molding | |
JP4042219B2 (en) | Paint substitute film | |
JPS58145440A (en) | Laminated film and its manufacture | |
JP7421092B2 (en) | Expanded particles and expanded particle molded bodies | |
JPS6140139A (en) | Molded product manufacturing method | |
JPH051068B2 (en) | ||
JPH0687515B2 (en) | Method for manufacturing housing for electric device | |
JPS633174Y2 (en) | ||
JPH11348105A (en) | Product having ground glass touch and manufacture thereof | |
JPH11207899A (en) | Substitute coated film |