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JPS59189069U - 冷却装置 - Google Patents

冷却装置

Info

Publication number
JPS59189069U
JPS59189069U JP8488183U JP8488183U JPS59189069U JP S59189069 U JPS59189069 U JP S59189069U JP 8488183 U JP8488183 U JP 8488183U JP 8488183 U JP8488183 U JP 8488183U JP S59189069 U JPS59189069 U JP S59189069U
Authority
JP
Japan
Prior art keywords
dryer
circulation circuit
refrigerant circulation
main body
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8488183U
Other languages
English (en)
Inventor
治 羽田
Original Assignee
昭和アルミニウム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和アルミニウム株式会社 filed Critical 昭和アルミニウム株式会社
Priority to JP8488183U priority Critical patent/JPS59189069U/ja
Publication of JPS59189069U publication Critical patent/JPS59189069U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Air-Conditioning For Vehicles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図面はこの考案の実施例を示し、第１図は冷却装置全体
を示す図、第２図は乾燥器を示す断面図である。　　　
　　　　　　　　　　　　−１・・・・・・蒸発器、２
・・・・・・凝縮器、３・・・・・・圧縮機、４・・・
・・・冷媒循環回路、６・・・・・・乾燥器、８・・・
・・・乾燥器本体、９・・・・・・蓋、１０・・・・・
・乾燥剤、１１・・・・・・異物除去フィルタ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 蒸発器１、凝縮器２および圧縮機３を備えており、これ
    ら冷媒循環回路４で連結された冷却装置において、冷媒
    循環回路４の途上に、他の機器とは独立しかつ内部に幹
    乾燥剤１０および異物除去フィルタ１１が入れられた乾
    燥器６が設けられ、乾燥器６が、乾燥器本体８と、乾燥
    器本体８に着脱自在に取付けられた蓋９とよりなる冷却
    装置。
JP8488183U 1983-06-02 1983-06-02 冷却装置 Pending JPS59189069U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8488183U JPS59189069U (ja) 1983-06-02 1983-06-02 冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8488183U JPS59189069U (ja) 1983-06-02 1983-06-02 冷却装置

Publications (1)

Publication Number Publication Date
JPS59189069U true JPS59189069U (ja) 1984-12-14

Family

ID=30214848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8488183U Pending JPS59189069U (ja) 1983-06-02 1983-06-02 冷却装置

Country Status (1)

Country Link
JP (1) JPS59189069U (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153562B2 (en) 2004-11-03 2015-10-06 Tessera, Inc. Stacked packaging improvements
US9570416B2 (en) 2004-11-03 2017-02-14 Tessera, Inc. Stacked packaging improvements
US9218988B2 (en) 2005-12-23 2015-12-22 Tessera, Inc. Microelectronic packages and methods therefor
US9553076B2 (en) 2010-07-19 2017-01-24 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US9123664B2 (en) 2010-07-19 2015-09-01 Tessera, Inc. Stackable molded microelectronic packages
US9570382B2 (en) 2010-07-19 2017-02-14 Tessera, Inc. Stackable molded microelectronic packages
US9324681B2 (en) 2010-12-13 2016-04-26 Tessera, Inc. Pin attachment
US9224717B2 (en) 2011-05-03 2015-12-29 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US9252122B2 (en) 2011-10-17 2016-02-02 Invensas Corporation Package-on-package assembly with wire bond vias
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US9601454B2 (en) 2013-02-01 2017-03-21 Invensas Corporation Method of forming a component having wire bonds and a stiffening layer
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom

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