JPS59182942U - Boiling cooler - Google Patents
Boiling coolerInfo
- Publication number
- JPS59182942U JPS59182942U JP7839283U JP7839283U JPS59182942U JP S59182942 U JPS59182942 U JP S59182942U JP 7839283 U JP7839283 U JP 7839283U JP 7839283 U JP7839283 U JP 7839283U JP S59182942 U JPS59182942 U JP S59182942U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor stack
- penetration part
- boiling
- storage space
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の冷媒タンク部と凝縮器部一体形の沸騰冷
却装置の構成図、第２図は従来の冷媒タンク部と凝縮器
部分離形の沸騰冷却装置の構成図、第３図は本考案の一
実施例である沸騰冷却装置の構成図を示す。
１・・・半導体スタック、２． ２ａ、 ２ｂ・・・
冷媒タンク、３，３ａ・・・凝縮器、４，４ａ・・・気
密端子、５・・・冷媒液、６，６ａ・・・放熱風胴体、
？、 ７ａ、 ７ｂ・・・密閉気密容器、８・・・
接続管、９・・・貫通部。Figure 1 is a block diagram of a conventional evaporative cooling system with integrated refrigerant tank and condenser parts, Figure 2 is a diagram of a conventional evaporative cooling system with separate refrigerant tank and condenser parts, and Figure 3 is a diagram of a conventional evaporative cooling system with separate refrigerant tank and condenser parts. 1 shows a configuration diagram of a boiling cooling device that is an embodiment of the present invention. 1... semiconductor stack, 2. 2a, 2b...
Refrigerant tank, 3, 3a... Condenser, 4, 4a... Airtight terminal, 5... Refrigerant liquid, 6, 6a... Radiation air body,
? , 7a, 7b... airtight container, 8...
Connection pipe, 9...penetrating part.
Claims (1)
却するものにおいて、密閉気密容器内の凝縮器部と冷媒
タンク部に冷却風の通風する放熱風胴体を共通に設け、
該放熱風胴体に半導体スタックの収納空間である貫通部
を冷却風の流れに対して垂直に設け、冷媒タンク部に放
熱風胴体の貫通部と水平に気密端子を設け、該気密端子
を介して放熱風胴体の貫通部に半導体スタックを収納固
定し、該半導体スタックに接する空間に冷媒液を注入し
半導体スタックが浸漬する構成としたことを特徴とする
沸騰冷却装置。In a device that cools semiconductor elements by heat transfer through boiling and condensation of a refrigerant liquid, a condenser section and a refrigerant tank section in a closed airtight container are provided with a heat radiation body that ventilates cooling air,
A penetration part, which is a storage space for the semiconductor stack, is provided in the hot air body, perpendicular to the flow of the cooling air, and an airtight terminal is provided in the refrigerant tank part, horizontally to the penetration part of the hot air body, and the airtight terminal is used as a storage space for the semiconductor stack. A boiling cooling device characterized in that a semiconductor stack is housed and fixed in a penetration part of a heat radiation body, and a refrigerant liquid is injected into a space in contact with the semiconductor stack so that the semiconductor stack is immersed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7839283U JPS59182942U (en) | 1983-05-25 | 1983-05-25 | Boiling cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7839283U JPS59182942U (en) | 1983-05-25 | 1983-05-25 | Boiling cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59182942U true JPS59182942U (en) | 1984-12-06 |
| JPS6345004Y2 JPS6345004Y2 (en) | 1988-11-22 |
Family
ID=30208394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7839283U Granted JPS59182942U (en) | 1983-05-25 | 1983-05-25 | Boiling cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59182942U (en) |
-
1983
- 1983-05-25 JP JP7839283U patent/JPS59182942U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6345004Y2 (en) | 1988-11-22 |
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