JPS59181542A - Transfer apparatus for lead-frame - Google Patents
Transfer apparatus for lead-frameInfo
- Publication number
- JPS59181542A JPS59181542A JP58055527A JP5552783A JPS59181542A JP S59181542 A JPS59181542 A JP S59181542A JP 58055527 A JP58055527 A JP 58055527A JP 5552783 A JP5552783 A JP 5552783A JP S59181542 A JPS59181542 A JP S59181542A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- frame
- working position
- stopper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Reciprocating Conveyors (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はグイボンディング、ワイヤボンガイング等の本
導体装置の製造工程に用いられるリードフレーム鍜送装
ｆｆＫ関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead frame feeding ffK used in the manufacturing process of the present conductor device such as wire bonding and wire bonding.
第１図を参照して従来装置全説明する。第１図は従来装
置の要部の平面図である。２本の平行に配設されたがイ
ドレールＩａ、］ｂＶＣは、先端に送り爪２ａ、２ｂ、
２ｃ、２ｄを有する送シ機構３が設けられる。また、リ
ードフレーム４１咄方向の端面には一定の間隔で抜き穴
５が設けられており、これを送多爪２ａ〜２ｄで引っＩ
Ｉけて図ボしないカム、クランク等からなる送シ磯構３
により送り幅ａづつ間欠送りする。リードフレーム４に
対してグイビンディング等の作業をする作業位１煮には
位１直決めビン６が固定きれており、間欠送りされてき
たリードフレーム４の位置決め穴７（間隔ａで複数個設
けられる）に挿入される。The entire conventional device will be explained with reference to FIG. FIG. 1 is a plan view of the main parts of a conventional device. The two parallel idle rails Ia,]bVC have feed claws 2a, 2b,
A feeding mechanism 3 having 2c and 2d is provided. In addition, punch holes 5 are provided at regular intervals on the end face of the lead frame 41 in the direction of rotation, and these can be pulled out with the feeding claws 2a to 2d.
Feed mechanism 3 consisting of a cam, crank, etc. that does not rotate
Intermittent feed is performed by the feed width a. During work such as guide binding on the lead frame 4, the first positioning pin 6 is fully fixed, and the positioning hole 7 (multiple holes are provided at intervals of a) of the lead frame 4 that has been intermittently fed. inserted).
上記の如き従来装置シこおいては、通常、リードフレー
ム４に均しボンディング等の作業をする作業位置を搬送
装置に設けたビン６の位・′従に固定し、ここにリード
フレーム４の作業位置（位１崖決め穴７の位置）か来る
ようにリードフレーム４全問欠送シするため、例えば横
幅、ピッチ、穴形状あるいは長格などの異なるリードル
−ム４Ｖζ対してνよ、ガイドレールｌａ 、］ ｂの
間隔を調椴することが必要になるたけでなく、送り爪２
８〜２ｄの位置、ｈＺ置決めビン６の位置などを変更し
たり、部品交」カする必要が出てくろう
この場合、送ｐ機構３や図示しないボンディング装置は
それぞれ独自の駆動系を備えるため、リードフレーム４
の種＠（横幅、ピッチ、長さ等）が変るごとにこれら駆
動系の調整、部品交換が必要になる。そのため、リード
フレーム４の種類が変る場合［１″ｉ装置の稼動率が著
しく低下し、製品の歩留りを低下する。In the conventional device as described above, the work position for leveling and bonding the lead frame 4 is usually fixed at the position of the bin 6 provided in the conveying device, and the lead frame 4 is placed here. In order to feed all the lead frames 4 so that the working position (the position of the predetermined hole 7) is reached, for example, for the lead frames 4Vζ with different widths, pitches, hole shapes, or lengths, the guide is set to ν. Not only is it necessary to adjust the spacing between rails la and b, but also the feed pawl 2
In this case, it will be necessary to change the positions of 8 to 2d, the position of the hZ positioning bin 6, etc., or replace parts.In this case, the feeding mechanism 3 and the bonding device (not shown) each have their own drive system , lead frame 4
Each time the type (width, pitch, length, etc.) changes, it is necessary to adjust these drive systems and replace parts. Therefore, if the type of lead frame 4 changes [1''i, the operating rate of the device will drop significantly and the yield of the product will drop.
本発明は上記の従来技術の欠点ｌ／ｃ逅みてなきれたも
ので、種類の異なる（太きき、形状等７５−異なる）リ
ードフレームに対して、高梢度かつ迅速な調整をするこ
とのでさるソー１゛フレーム搬送装置を提供することを
目的とする。The present invention was developed in view of the above-mentioned drawbacks of the prior art, and is capable of high-speed and high-speed adjustment for lead frames of different types (different in thickness, shape, etc.). The purpose of the present invention is to provide a monkey saw 1 frame conveying device.
上記の目的を実現するため本発明は、搬入装置によって
ガイドレールに搬入され−にの搬送方向に送られるリー
ドフレ−ムを、作業位置の手前のリードフレームのＥｌ
ｍごとＶこ定められる基準位置で停止きせる基準ストツ
ノ平と、この基準ストッパをリードフレームの搬送方向
に沿って移動させると共に任意の位置で停止きせるスト
ッパ作動機構と、基糸ストッパで停止されたリードフレ
ームを挾持手段で挾持すると共にガイドレールに沿って
間欠送りして作業位置全通過させる間欠送り機構と、間
欠送りされたリードフレームを搬出する搬Ｉｆ」装置と
を（＃ｎえるリードフレーム搬送装置全提供するもので
ある。In order to achieve the above-mentioned object, the present invention is designed to move a lead frame carried into a guide rail by a carry-in device and sent in the conveying direction to the
A reference stopper that stops at a reference position determined every m, a stopper operating mechanism that moves this reference stopper along the conveying direction of the lead frame and stops it at an arbitrary position, and a lead stopped at the base thread stopper. An intermittent feeding mechanism that clamps the frame with a clamping means and feeds the frame intermittently along a guide rail to pass all working positions, and a lead frame conveying device that carries out the intermittently fed lead frame. All that is offered.
第２図乃至・貼４図全参照して本発明の一実施例を直間
する。第２図は同芙施例の平面図で、第１図と同−安素
は同一符号で示しである。中１…ベーク、８Ｖこは支持
板９ａ、９ｂが仏いに平行に設けられ、こｔＵこリード
、７レーム４の両端面金それ−ｔＪｎ支持する固５．ｉ
、： ｊｔｌｉｉ カイトレール１ａおよびＯＪ Ｔｌ
１ｈｌｆｌｌｉガイドレールＩｂ（支持板９ａ 、９ｂ
の長手方間νこｈｊｉ ｆｌｌＪ−Ｃきる）が互いしこ
半行に」収９セ」りられ′Ｃいる。An embodiment of the present invention will now be described with reference to all of FIGS. 2 through 4. FIG. 2 is a plan view of the same embodiment, and the same reference numerals as in FIG. 1 indicate the same reference numerals. Middle 1...Bake, 8V Support plates 9a and 9b are provided parallel to the Buddha, 7 leads, 7 metal supports on both ends of frame 4. 5. i
,: jtlii Kiterail 1a and OJ Tl
1hlflli guide rail Ib (support plates 9a, 9b
The longitudinal distances ν, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, and,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,9,,999,,999999999999 11 and 10 and 100, respectively, 9th and 7th of a row, respectively.
神／こ、ＩＩ！＋１足１則ガイドレールｌａの慌り入駒
１ｊおよび搬出１１ｉ＋Ｊには、モータＭ□１Ｍ２によ
ってそれぞれ独立に駆動きれる搬入装置１０および搬出
鉄匝】１が収けられ、２ｚ］づつそれぞれ４個の駆動ロ
ーラ１２ ａ 、 １２ｂ Ｋよつでリードフレーム４
が搬入、憾出芒れる。God/K-II! A carry-in device 10 and a carry-out iron box ]1 which can be independently driven by motors M□1M2 are housed in the hasty input piece 1j and carry-out piece 11i+J of the +1 foot 1 rule guide rail la, and 4 pieces of each of 2z] Drive rollers 12a, 12b K-type lead frame 4
was brought in and was disappointed.
基準ストッパ１３はモータ〜１３ＩＩＣより駆動される
・ストン・旧年動機構１４によってガイドレール１．ｂ
Ｋ沿って移動させられ、ｐＪＴ望の位置（フレームの端
面寸法により定まる）で停止される。The reference stopper 13 is moved by the guide rail 1. b
The pJT is moved along K and stopped at the desired position (determined by the end face dimensions of the frame).
リードフレーム４金側端部で挾持するための一対のチャ
ック機構１５ａ、１５６全有する間欠送り機（７４：１
６には、駆動モータＭ４が取り付けられる。これによっ
て、一対のチャック機構１５ａ、＋５ｂはガイドレール
ｌａ、ｌｂと平行に配設されたスライド軸１７に沿って
間欠的に往復運動（ストローク運動）させられる。また
、仕事位置の手前にはり−）’７Ｌ／−ム４が到達した
ことを検知するセンサ１８ａと、リードフレーム４が通
過したことを検知する七／す１８ｂが設けられている。An intermittent feeder (74:1
A drive motor M4 is attached to 6. As a result, the pair of chuck mechanisms 15a and +5b are intermittently reciprocated (stroked) along the slide shaft 17 arranged parallel to the guide rails la and lb. Further, in front of the work position, there are provided a sensor 18a for detecting that the beam 4 has arrived, and a 7/stool 18b for detecting that the lead frame 4 has passed.
なお、仕事位置には位置決めビン１９がある。Note that there is a positioning bin 19 at the work position.
第３図は第２図の一実施例の正面図で、第２図と同一要
素は同一符号で示しである。、１？ンデイング等の処理
をする前のリードフレーム４を搬入する搬入鋏＃１０は
、固定１１１１］ガイドノール１ａに固着した固定ロー
２１０ａと、固にローラｌｏａとχ、」回して配置され
開閉シリンダＣ工の開閉によｐ固定ローラ１０ａの方向
に移動しうる口］動ローラｌＯｂとから構成される。ま
た、ボンディング等の処理全した後のリードフレーム４
を搬出する搬出装置ｊ１は搬入装ｆｉｔｌＯと同様ｒＣ
１固定ローラＪｌａと、開閉シリンダＣ２の開閉により
固定ローラ１１ａの方向に移動しうる１Ｊ動ローラｌ１
ｌ）とから構成される。間欠送り機構１６のスライド軸
１７の両端に織り付けられた一対の固定爪２１Ｊａ、２
１）ｂのド１１４１１ Ｋは、相対して一対の＋ｊＪ動
爪２１ａ、２１ｂが設けられ、これらの間（ｌ−１：開
閉シリンダＣ３，Ｃ４Ｖこよって開閉させられる。FIG. 3 is a front view of one embodiment of FIG. 2, in which the same elements as in FIG. 2 are designated by the same reference numerals. , 1? Carrying scissors #10, which carries in the lead frame 4 before being subjected to processing such as binding, are connected to a fixed row 210a fixed to a fixed guide knoll 1a, and a fixed row 210a fixed to a fixed roller loa and an opening/closing cylinder C. It is composed of a moving roller lOb which can be moved in the direction of the fixed roller 10a by opening and closing the opening and closing of the opening and closing. In addition, the lead frame 4 after all processes such as bonding
The unloading device j1 for unloading is the same as the loading device fitlO.
1 fixed roller Jla and 1J moving roller l1 that can be moved in the direction of the fixed roller 11a by opening and closing the opening/closing cylinder C2.
l). A pair of fixed claws 21Ja, 2 woven at both ends of the slide shaft 17 of the intermittent feed mechanism 16
1) The door 11411K of b is provided with a pair of +jJ movable pawls 21a and 21b facing each other, and is opened and closed by the opening/closing cylinders C3 and C4V between these (1-1).
基準ストツノ月３は、ストッパ作動圏構１４によってリ
ードフレーム４の搬送方向に往偵移動させやれると共に
、開閉シリンダＣ５によって上下方向に移動させられる
。また、仕事位置には必要に応じて幅方向ＶＣＣ調整能
能支持ブロック、リードフレ、−ム押え（共に図示しな
い）およびターレット型の位１４決めビン１９が設けら
れ、これらはモータらによって駆動されるカムＲ手２２
により駆！助される。The reference stopper 3 is moved forward in the conveying direction of the lead frame 4 by the stopper operating mechanism 14, and is also moved in the vertical direction by the opening/closing cylinder C5. Further, at the work position, a support block capable of adjusting VCC in the width direction, a lead frame, a frame holder (both not shown), and a turret-type positioning pin 19 are provided as necessary, and these are driven by a motor. Cam R hand 22
Drive by! Helped.
なお、モータＭ５Ｖｃよってカム群２２を駆動する軸Ｖ
Ｃはセンサ群乙が設けられ、これによって間欠送り機構
１６の動作との同期が図られている。Note that the shaft V that drives the cam group 22 by the motor M5Vc
A sensor group B is provided at C, and synchronization with the operation of the intermittent feed mechanism 16 is achieved by this.
第４図は基準ストン・４′１３の位置と位置決め位置
・冴の関係を説明する図（第４図（ａ） 、 （ｂ）は
互いにリードフレーム４の形状が異なる）で、第２図お
よび第３図と同一要素は同一符号で示す。第４図（ａ）
によシ位置決め位置別と基準ストツノ月３の位置の関係
を説明する。リードフレーム４上にボッダイング等の仕
事をする仕事位置の間隔がｐａであるとすると、間欠送
り機構１６による送りピッチはこれに等しい。また、リ
ードフレーム４の第１番目の仕事位置と長手方向の端面
との距離はＬｌａであるため、基準ストツ／セ１３は位
置決め位１置鴎からＬ２ａ ”” ａ ’ｌａの距離
のところで次のリードフレーム４を停止させればよい。Figure 4 shows the position and positioning of the reference stone 4'13.
- This is a diagram illustrating the relationship between the two (Figures 4(a) and 4(b) have different shapes of lead frames 4), and the same elements as in FIGS. 2 and 3 are indicated by the same reference numerals. Figure 4(a)
The relationship between each positioning position and the position of the reference strut horn 3 will be explained. Assuming that the interval between work positions for performing work such as bodding on the lead frame 4 is pa, the feed pitch by the intermittent feed mechanism 16 is equal to this. Also, since the distance between the first work position and the end face in the longitudinal direction of the lead frame 4 is Lla, the reference stock/set 13 moves to the next position at a distance of L2a ``'' a 'la from the positioning position 1. All that is required is to stop the lead frame 4.
リードフレーム４の形状が異なるときは仕事をするＧＺ
＋＃、の間隔、端面の寸法等が異なるので、第４図（
ｂＪの如く送りピッチをＰｂ、基準ストッパ１３と位置
決め位置′２／１の距離を’２ｂとする（但し、リード
フレーム４の第１番目の仕事位置と長手方向の端面との
距離をし□。GZ works when the shape of lead frame 4 is different.
Since the spacing between + and #, the dimensions of the end faces, etc. are different, Fig. 4 (
As shown in bJ, the feed pitch is Pb, and the distance between the reference stopper 13 and the positioning position '2/1 is '2b' (however, the distance between the first working position of the lead frame 4 and the longitudinal end face is □).
とする）。すなわち、第４図（ａｔと第４図（ｂｌとで
は基準ストン・月３の位置が距離りだけずれている。). That is, the position of the reference stone/moon 3 is shifted by the distance between FIG. 4 (at) and FIG. 4 (bl).
次に、第２図乃至第４図に示す実施例め動作を説明する
。Next, the operation of the embodiment shown in FIGS. 2 to 4 will be explained.
チャック機［１５ａ 、 １５ｂ （固定爪２０ａ、２
１）ｂおよび司動爪２１ａ、２１ｂ等からなる）ＶＣ挾
持されて間欠スオシされているリードフレーム４がセン
サ１．８ ｂを通過すると、開閉シリンダＣが動作して
０−ラ１０ ａ 、 、１０ ｂにより次のリードフレ
ーム４が（４１’ ｌｆ、される。１１）１圧されたリ
ードフレーム４はモータＭｌにより２本のガイドレール
］ａ、Ｉｂに架けわたす状態で鉄人される。このとき、
開閉シリンダＣ５が１用いて基準ストン・ぐ１３が伏り
送路に出ているので、これによって搬入された次のリー
ドフレーム４が仕事位置の千ｉ１Ｊで停止される。Chuck machine [15a, 15b (fixed jaws 20a, 2
1) When the lead frame 4, which is held in the VC (consisting of VC b and drive claws 21a, 21b, etc.) and is intermittently rotated, passes the sensor 1.8b, the opening/closing cylinder C operates and the 0-ra 10a, . 10b, the next lead frame 4 is moved (41'lf).11) The lead frame 4, which has been pressurized by one pressure, is iron-stripped by the motor Ml in a state where it spans the two guide rails]a and Ib. At this time,
Since the opening/closing cylinder C5 is used and the reference stone 13 is exposed to the downward feeding path, the next lead frame 4 carried in is thereby stopped at the work position of 1,000 J.
リードフレーム４が基準ストン・ぞ１３の位置せで来る
とセンサー８ａがこれ全検知し、開し〕シリンダＣ３，
Ｃ４が動作して固定爪２０ａ、２０ｔ）とｒＪ］動爪２
１ａ。When the lead frame 4 comes to the position of the reference stone groove 13, the sensor 8a detects this and opens the cylinder C3,
C4 operates and the fixed claws 20a, 20t) and rJ] movable claw 2
1a.
２１ ｂでリードフレーム４５Ｃ挾持する。そして、開
閉／リングＣ５が閉じて基準ストン・月３がリードフレ
ーム４から外される。Clamp the lead frame 45C with 21b. Then, the opening/closing ring C5 is closed and the reference stone 3 is removed from the lead frame 4.
チャック機構＋５ａ、１５ｂによって挾持されたり−ド
フレーム４（は、間欠送シ機構１６１ｃよって送りピッ
チＰつつ間不送りされる。その間、１回の間欠送りごと
に、什串位置ンこあ・いて−Ｒ７ｆインク等の作菜がな
される。The skewer frame 4 (held by the chuck mechanisms 5a and 15b) is continuously fed by the intermittent feed mechanism 161c at a feed pitch of P. During each intermittent feed, the skewer position is adjusted. - R7f ink, etc. is produced.
１…欠送９が］ＩＬんで−ヒンザ１．８ｂがリードフレ
ーム４のス１１１過を検知すると、開閉シリンダＣ３，
Ｃ４が動ｆ／［ルでナヤソク槻溝１５ａ、１５ｂにょる
挾持動作は解除され、リードフレーム４は搬出に置１１
により早送りきれる。1... When the missing feed 9 is] IL and the hinge 1.8b detects that the lead frame 4 has passed 111, the opening/closing cylinder C3,
When C4 moves f/[, the clamping action by the grooves 15a and 15b is released, and the lead frame 4 is placed in the unloading position 11.
This allows you to fast forward.
リードフレーム４の太ささ、形状等が異なる場合には、
次のようｌ調整を行ンよう１．ブ゛なゎち、幅の広いリ
ードフレーム４および幅の−ｒｔいり一ド７＋／−ム４
の場合にハ、ｏＪ＠！Ｉ側ガイドレールＩｂを支持似９
ａ、９ｂの長手方向に移動感ぜる。′またリードフレー
ム４の長手方向の端面寸法が異なる場合ＶＣは、基準ス
トン・ゼ１３の位置全ストン・や作動機構１４にし九１
整する。If the thickness, shape, etc. of the lead frame 4 are different,
Let's make the following adjustments 1. Wide lead frame 4 and wide -rt lead frame 7 +/- frame 4
Ha, oJ@! Support I side guide rail Ib 9
Feel the movement in the longitudinal direction of a and 9b. 'Also, if the end face dimensions in the longitudinal direction of the lead frame 4 are different, the VC should be adjusted according to the position of the reference stone 13 or the operating mechanism 14.
Arrange.
尚、上記実施例では、ピッチ送りの累積誤差を解消する
ため、ターレット形式で位１近決めビン１９を選択し、
使用できるようにしているが、検出装置によってピンチ
送ｐ量を制御し位置決めビン円忙省略することもできる
。捷た、搬出、搬入、基糸ストン・ンの作動等のための
駆動源は、開閉シリンダ以外のものとすることもできる
。In the above embodiment, in order to eliminate the cumulative error in pitch feed, the 1st closest determining bin 19 is selected in the turret format,
Although it can be used, it is also possible to control the amount of pinch feed by the detection device and omit the need for positioning the bin. The driving source for knitting, carrying out, carrying in, actuating the base yarn stone, etc. may be other than the opening/closing cylinder.
上記の如く不発明によれば、搬入装置ＶＣよってがイド
レールに搬入ざｎ−足の搬送方向ＶＣ送られるリードフ
レームを、作業位置の手前のリードフレームの種類ごと
に定められる基準位置で停止させる基準ストッパと、こ
の基準ストン・ぞをリードフレームの搬送方向に沿って
移動させると共に任意の位置で停止させるストッパ作動
機構と、基準ストッパで停止されたリードフレームを挟
持手段で挾持すると共に、ガイドレール［沿って間欠送
ジして作業位置を通過させる間欠送り機構と、間欠送り
されたリードフレームを搬出するｊ般出裂１直とを備え
たので、種類の異なる（大きさ、形状等が１４なる）リ
ードフレームに対して、高精度かつ迅速な調整のできる
リードフレーム搬送装置が得られる。As described above, according to the invention, the carry-in device VC is a standard for stopping the lead frame being carried into the idle rail in the n-foot conveyance direction VC at a reference position determined for each type of lead frame in front of the working position. A stopper, a stopper actuation mechanism that moves the reference stone groove along the conveying direction of the lead frame and stops it at an arbitrary position, and a guide rail [ Equipped with an intermittent feed mechanism that feeds the lead frame intermittently along the line and passes through the working position, and a single shift that carries out the intermittently fed lead frame, it is possible to carry out different types of lead frames (sizes, shapes, etc. ) A lead frame conveying device capable of highly accurate and rapid adjustment of lead frames can be obtained.
特に、基準ストソ／ザをρ」動にしたため、フレームの
種類が変ってピッチ送９幅および端面寸法が変った場合
にも、ピッチ送り幅と位置決め位置までの搬送距離を同
一にできるという特有の効果があるっまた、リードフレ
ームはナヤソク機構によって挾持するため、リードフレ
ームの形状が変るごとに間欠送り機構の部品交換の必要
がなくなる。In particular, because the standard stroke/sha is set to ρ'' movement, even if the type of frame changes and the pitch feed width and end face dimensions change, the pitch feed width and conveyance distance to the positioning position can be kept the same. In addition, since the lead frame is held by the sliding mechanism, there is no need to replace parts of the intermittent feed mechanism every time the shape of the lead frame changes.
更に、−爪と穴の間隙による誤差金なくシ、製品の歩留
りを同上できる。Furthermore, there is no error due to the gap between the claw and the hole, and the yield of the product can be increased.
第１図は従来装置の平面図、第２図な不発明の一実施例
の平面図１．第３図は第２図の一実施例の正面図、第４
図は第２図および第３図の基準ストン・ぐと位置決め位
置の関係を説明する図である。
ｌａ、ｌｂ・・・ガイドレール、
２ａ１２ｂ、２ｃ、２ｄ・”送り爪、３・・・送り機構
、４・・・リードフレーム、５・・・抜き穴、６°゛・
ビン、７・・・位置決め穴、８・・・中［口］ベース、
９ａ 、９ｂ・・・支持板、１０・・・搬入装置、１１
・・・搬出装置、１２ａ、１２ｂ・・・駆動ローラ、１
Ｊ・・す１４−準ストッパ、１１ト・・ストン・ぐ）’
１ミｕｕＪ 機構、１５ａ、１５ｂ・・・ナヤソク函檜
、ｌＯ・・・間欠送９憬構、１７・・・スライド軸、１
８ａ 、 １８ｂ・・・セノザ、１９・・・位首仄めビ
ン、２（ｌａ、加す川向ボ爪、２Ｊ ａ 、 ２１ ｂ
・・・ＯＪ妨爪、乙・・・カム消二、調・・セ／ツ゛イ
坪、ｂｌ −（Ｘ’Ｌ 置決め位１虚、Ｃ，、Ｃ２，Ｃ
，３，Ｃ４，Ｃ５−”−Ｅ−タ。
出願人代理人 尾 股 消FIG. 1 is a plan view of a conventional device, and FIG. 2 is a plan view of an embodiment of the invention. Figure 3 is a front view of one embodiment of Figure 2;
This figure is a diagram illustrating the relationship between the reference stones and positioning positions in FIGS. 2 and 3. la, lb...Guide rail, 2a12b, 2c, 2d・Feeding claw, 3...Feeding mechanism, 4...Lead frame, 5...Drilling hole, 6°
Bottle, 7... Positioning hole, 8... Middle [mouth] base,
9a, 9b...Support plate, 10...Carrying device, 11
... Carrying out device, 12a, 12b... Drive roller, 1
J...S14-Semi-stopper, 11...Ston...Gu)'
1 miuuJ mechanism, 15a, 15b... Nayasoku box cypress, lO... Intermittent feed 9-shaft mechanism, 17... Slide shaft, 1
8a, 18b... Cenoza, 19... Ranked bottle, 2(la, Add Kawamuka Bozume, 2J a, 21 b
...OJ jamming, Otsu...cam erasing two, tone...Se/tsutsuitsubo, bl - (X'L positioning position 1 imaginary, C,, C2, C
, 3, C4, C5-"-E-ta. Applicant's agent Omata Cancellation
Claims (1)
ために該リードフレームの搬送方向に沿って対向して配
設された２本のガイドレールと、前記搬入側から前記２
本のガイドレールに架けわたした状態でｍＩ記’）−ｒ
ｐンームを搬入する千人装置と、１ｊｊＪ記娘人伸ｊか
ら移送された前記リードフレームを作業位置の手前の該
リードフレームの種類ごとに九′ｆる基準位憤で停止卜
させる基準ストノ／やと、該基準ストノー４をｍＪ記記
入入側ら搬出側に往復移動させると共に任意の位置で停
止させるストン・母作動機購と、ｍｌ記基準ストッパで
停止された前記リードフレームを挾持する挟持手段を有
してな９、該挟持手段で挾持した該リードフレームを前
記ガイドレールに沿って前記搬送方向に間欠送シして６
１記作業位置を通過させる間欠送りａ構と、前記作業位
置を通過した前記リードフレームをｍＪ記搬出側ＶＣｇ
＆出する搬出装装置とを備えるリードフレーム搬送装置
。Lead frame fc @ from the person side to the carry-out side; two guide rails arranged facing each other along the conveyance direction of the lead frame for subsequent conveyance;
mI')-r while hanging it over the guide rail of the book.
A 1,000-man device for transporting the P-frame, and a standard cylinder for stopping the lead frame transferred from the 1jjJ station at a standard position of 9'f for each type of lead frame in front of the working position. There is also a stone/main actuator that reciprocates the reference stator 4 from the mJ input side to the output side and stops it at an arbitrary position, and a clamp that clamps the lead frame stopped at the ml reference stopper. means (9) intermittently transporting the lead frame clamped by the clamping means (6) in the conveying direction along the guide rail;
1. An intermittent feed mechanism a for passing through the working position, and mJ for the lead frame that has passed the working position, and an unloading side VCg.
A lead frame conveying device equipped with a loading and unloading device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58055527A JPS59181542A (en) | 1983-03-31 | 1983-03-31 | Transfer apparatus for lead-frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58055527A JPS59181542A (en) | 1983-03-31 | 1983-03-31 | Transfer apparatus for lead-frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59181542A true JPS59181542A (en) | 1984-10-16 |
Family
ID=13001191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58055527A Pending JPS59181542A (en) | 1983-03-31 | 1983-03-31 | Transfer apparatus for lead-frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59181542A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188328A (en) * | 1986-02-14 | 1987-08-17 | Toshiba Seiki Kk | Pellet mounting apparatus |
| JPH0367839A (en) * | 1989-08-07 | 1991-03-22 | Shinkawa Ltd | Feeding method for tabular member |
| JPH0328725U (en) * | 1989-07-28 | 1991-03-22 | ||
| JPH06177196A (en) * | 1992-12-01 | 1994-06-24 | Kaijo Corp | Substrate transfer device |
| KR100739015B1 (en) | 2006-06-16 | 2007-07-13 | 한국단자공업 주식회사 | Conveyor Conveying Discharge Device and Discharge Method Using The Same |
-
1983
- 1983-03-31 JP JP58055527A patent/JPS59181542A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188328A (en) * | 1986-02-14 | 1987-08-17 | Toshiba Seiki Kk | Pellet mounting apparatus |
| JPH0328725U (en) * | 1989-07-28 | 1991-03-22 | ||
| JPH0367839A (en) * | 1989-08-07 | 1991-03-22 | Shinkawa Ltd | Feeding method for tabular member |
| JPH06177196A (en) * | 1992-12-01 | 1994-06-24 | Kaijo Corp | Substrate transfer device |
| KR100739015B1 (en) | 2006-06-16 | 2007-07-13 | 한국단자공업 주식회사 | Conveyor Conveying Discharge Device and Discharge Method Using The Same |
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