JPS59175732A - Metal force for transfer mold - Google Patents
Metal force for transfer moldInfo
- Publication number
- JPS59175732A JPS59175732A JP4990083A JP4990083A JPS59175732A JP S59175732 A JPS59175732 A JP S59175732A JP 4990083 A JP4990083 A JP 4990083A JP 4990083 A JP4990083 A JP 4990083A JP S59175732 A JPS59175732 A JP S59175732A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- lead frame
- cavity
- forces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title abstract description 3
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 230000002265 prevention Effects 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000001721 transfer moulding Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000013013 elastic material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 この発明はトランスファ・モールド用金型に関する。[Detailed description of the invention] [Technical field of invention] This invention relates to a mold for transfer molding.
第１図はトランスファ・モールド（移送成形）に用いら
れる従来の金型を示すものである。同図において、金型
は下金型１であり、この下金型ｌには複数のキャビティ
部２，２・・・が設けられ、封止樹脂が注入されるよう
になっている。FIG. 1 shows a conventional mold used for transfer molding. In the figure, the mold is a lower mold 1, and this lower mold 1 is provided with a plurality of cavity parts 2, 2, . . . into which a sealing resin is injected.
これらキャビティ部２．２・・・の周縁の側部にはそれ
ぞれ高さ約０．５〜１． Ｏｍｙｎの突出部３が設けら
れている。この下金型ｌに対向する上金型も同様の構造
となっており、第２図に示すように下金型１上の所定の
位置にリードフレーム４を配置した後、第３図に示すよ
うにリードフレーム４をはさみ込むように上金型５を締
付けるものである。The sides of the periphery of these cavity portions 2.2... each have a height of about 0.5 to 1.5 mm. A protrusion 3 of Omyn is provided. The upper mold 1 facing the lower mold 1 has a similar structure, and after placing the lead frame 4 at a predetermined position on the lower mold 1 as shown in FIG. The upper mold 5 is tightened so that the lead frame 4 is sandwiched therebetween.
しかしなか、ら、このような従来の金型においては、リ
ードフレーム４の板厚のバラツキやその他の要因（例え
ば、型自体の熱によりリードフレーム４に構造的変形が
起る。、）により、リード面と型との間に隙間６が発生
する。このため、キャビティ部２内に注入された樹脂が
この隙間６からリード面上にはみ出し、その結果す−ド
表面上に樹脂パリが発生することになり。However, in such conventional molds, due to variations in the thickness of the lead frame 4 and other factors (for example, structural deformation occurs in the lead frame 4 due to the heat of the mold itself). A gap 6 is generated between the lead surface and the mold. Therefore, the resin injected into the cavity portion 2 protrudes from the gap 6 onto the lead surface, resulting in resin flakes occurring on the lead surface.
モールド工程後にパリ取り作業を行わなければならなか
った。Deburring work had to be done after the molding process.
この発明は上記実情に鑑みてなされたもので。 This invention was made in view of the above circumstances.
その目的は、モールド工程においてキャビティ部からリ
ード面上への樹脂のはみ出しを減少させ、パリ取り作業
を不要とすることのできるトランスファ・モールド用金
型を提供することにある。The object is to provide a transfer molding die that can reduce the overflow of resin from the cavity onto the lead surface during the molding process and eliminate the need for deburring.
この発明は一上下金型のキャビティ部の周縁部特にリー
ドか配置される位置に弾性部材からなる樹脂はみ出し防
止部材を設は一金型の締付は時にこの樹脂はみ出し防止
部材の弾性によりリード面と金型面との間の密着性を向
上させ。In this invention, a resin extrusion prevention member made of an elastic member is provided at the peripheral edge of the cavity portion of the upper and lower molds, particularly at the position where the leads are arranged. Improves the adhesion between the mold surface and the mold surface.
キャビティ部からの樹脂のはみ出しを防止するものであ
る。This prevents the resin from extruding from the cavity.
以下１図面を参照してこの発明の一実施例をティ部１４
．１４からはみ出した樹脂は、はみ出し防止部材１６．
１６・・・により殆ど遮断され。An embodiment of the present invention will be described below with reference to the drawings.
．． The resin protruding from the protrusion prevention member 16.
16... is almost blocked.
その結果リード面に生ずる樹脂パリの面積を減少させる
ことができる。As a result, the area of resin particles generated on the lead surface can be reduced.
上記樹脂はみ出し防止部材１６．１６・・・・は少なく
ともリードフレーム１２のリード部が配置される位置に
それぞれ取り付ける必要がおる。The resin extrusion prevention members 16, 16, . . . need to be attached at least to the positions where the lead portions of the lead frame 12 are arranged.
第６図及び第７図においては、キャビティ部１４の周縁
部における複数のリードが配置される位置にそれぞれ対
応させて円柱状の穴２１．２１・・・を設け、これら穴
２１．２１・・・にそれぞれ第８図に示すような円柱状
の耐熱性合成ゴムからなる樹脂はみ出し防止部材２２を
取付けるものである。また、上記穴及び樹脂はみ出し防
止部Ｈの形状は任意であり種々選択できるもので。In FIGS. 6 and 7, cylindrical holes 21, 21, . A cylindrical resin extrusion prevention member 22 made of heat-resistant synthetic rubber as shown in FIG. 8 is attached to each of the holes. Further, the shapes of the hole and the resin extrusion prevention portion H are arbitrary and can be selected from various shapes.
例えば角柱１球−半球状でもよく、あるいは弾性部材の
内部に金属スプリングを装着したものでもよい。For example, it may be in the shape of a prismatic sphere or a hemisphere, or it may be an elastic member with a metal spring mounted inside it.
上記実施例においては、リード部のみ（一対応させて樹
脂はみ出し防止部材２２を設けるようにしたが、第９図
及び第１Ｏ図に示すようにキャビティ部１４の両側のリ
ードの並び方向全体にわたって長手法の穴３１．３１を
設け、これら穴３１，３１に樹脂はみ出し防止部材を取
付けるようにしてもよい。この場合、樹脂はみ出し防止
部材としては、第１１図（ａン〜（りにそれぞれ示すよ
うな、芯入り円柱１円柱１円筒、角柱。In the above embodiment, only the lead portion (although the resin extrusion prevention member 22 is provided in correspondence with the resin extrusion prevention member 22 is provided), as shown in FIG. 9 and FIG. Holes 31 and 31 may be provided in the holes 31 and 31, and resin extrusion prevention members may be attached to these holes 31 and 31. In this case, as the resin extrusion prevention members, as shown in FIGS. A cylinder with a core, 1 cylinder, 1 cylinder, and a square cylinder.
リード部に対応して段部を有する角柱のように種々の形
状が考えられる。Various shapes can be considered, such as a prismatic shape having a stepped portion corresponding to the lead portion.
以上のようにこの発明によれば、モールド工程において
キャビティ部からリード向上への樹脂のはみ出しを減少
させることができるので。As described above, according to the present invention, it is possible to reduce the overflow of the resin from the cavity portion to the lead improvement during the molding process.
稜工程においてパリ取り作業が不要となり、半導体装置
の製造工程を短縮化することができる。There is no need for deburring work in the edge process, and the manufacturing process of semiconductor devices can be shortened.
第１図は従来のモールド金型を示す斜視図。
第２図は上記モールド金型にリードを設置した状態を示
す部分拡大図、第３図は上記モールド金型の締付は時の
状態を示す断面図、第４図はこの発明の一実施例に係る
モールド金型の断面図、第５図は第４図のＡ−Ａ’矢視
断面図、第６図はこの発明の他の実施例を示す平面図、
第７図は第６図のＢ−Ｂ’矢視断面図、第８図は第６図
の実施例に用いられる樹脂はみ出し防止部はを示す斜視
図、第９図はこの発明のさらに他の実施例を示す平面図
、第１０図は第９図のｃ−ｃ’矢視断面図、第１１図は
第９図の実施ｉｔに用いられる樹脂はみ出し防止部輔を
示す斜視図である。
１１・・・下金型−１２・・・リードフレー、ム、１３
・・・上金型、ノ４−・・・キャビティ部、１５・・・
穴。
１６・・・樹脂はみ出し防止部材。
出願人代理人 弁理士 鈴 江 武 豚箱１図
第２図
第 ３＠
第 ４ 図
５−
Ｉ
第 ５１ＩFIG. 1 is a perspective view showing a conventional mold. Fig. 2 is a partially enlarged view showing the state in which the lead is installed in the mold, Fig. 3 is a sectional view showing the state when the mold is tightened, and Fig. 4 is an embodiment of the present invention. 5 is a sectional view taken along the line A-A' in FIG. 4, and FIG. 6 is a plan view showing another embodiment of the present invention.
7 is a sectional view taken along the line B-B' in FIG. 6, FIG. 8 is a perspective view showing the resin extrusion prevention part used in the embodiment of FIG. 6, and FIG. FIG. 10 is a plan view showing the embodiment, FIG. 10 is a sectional view taken along the line c-c' in FIG. 9, and FIG. 11 is a perspective view showing a resin extrusion prevention part used in the implementation shown in FIG. 9. 11...Lower mold-12...Lead frame, m, 13
... Upper mold, No. 4-... Cavity part, 15...
hole. 16...Resin extrusion prevention member. Applicant's representative Patent attorney Takeshi Suzue Pig box Figure 1 Figure 2 Figure 3@4 Figure 5-I No. 51I
Claims (1)
ける上、下の金型と、これら金型にそれぞれ設けられ、
封止樹脂が注入されるキャビティ部と１弾性部材で形成
され、かつ前記キャビティ部の周縁部の少なくとも前記
リード部が配置される位置に取付けられ、前記上、下の
金型の締付は時において前記封止樹脂の前記キャビティ
部から前記リード部へのはみ出しを防止する樹脂はみ出
し防止部材とを具備したことを特徴とするトランスファ
・モールド用金型。During molding, the upper and lower molds tighten the lead part of the lead frame, and these molds each have a
It is formed of a cavity portion into which a sealing resin is injected and an elastic member, and is attached to the peripheral edge of the cavity portion at least at a position where the lead portion is disposed, and the upper and lower molds are tightened at a time. A mold for transfer molding, comprising: a resin extrusion prevention member that prevents the sealing resin from extruding from the cavity portion to the lead portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4990083A JPS59175732A (en) | 1983-03-25 | 1983-03-25 | Metal force for transfer mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4990083A JPS59175732A (en) | 1983-03-25 | 1983-03-25 | Metal force for transfer mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59175732A true JPS59175732A (en) | 1984-10-04 |
Family
ID=12843890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4990083A Pending JPS59175732A (en) | 1983-03-25 | 1983-03-25 | Metal force for transfer mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59175732A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242017A (en) * | 1984-05-17 | 1985-12-02 | Fuji Plant Kogyo Kk | Molding resin without generating flash |
| EP1419866A1 (en) * | 2001-08-22 | 2004-05-19 | Sony Corporation | Method and device for forming module electronic component and module electronic component |
| CN108476252A (en) * | 2016-12-22 | 2018-08-31 | 华为技术有限公司 | Processing method of terminal housing, terminal housing and terminal equipment |
| WO2020094411A1 (en) * | 2018-11-07 | 2020-05-14 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |
-
1983
- 1983-03-25 JP JP4990083A patent/JPS59175732A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242017A (en) * | 1984-05-17 | 1985-12-02 | Fuji Plant Kogyo Kk | Molding resin without generating flash |
| JPH0246134B2 (en) * | 1984-05-17 | 1990-10-15 | Fuji Plant Kogyo Kk | |
| EP1419866A1 (en) * | 2001-08-22 | 2004-05-19 | Sony Corporation | Method and device for forming module electronic component and module electronic component |
| EP1419866A4 (en) * | 2001-08-22 | 2009-07-01 | Sony Corp | Method and device for forming module electronic component and module electronic component |
| CN108476252A (en) * | 2016-12-22 | 2018-08-31 | 华为技术有限公司 | Processing method of terminal housing, terminal housing and terminal equipment |
| CN108476252B (en) * | 2016-12-22 | 2021-09-10 | 荣耀终端有限公司 | Terminal shell machining method, terminal shell and terminal equipment |
| WO2020094411A1 (en) * | 2018-11-07 | 2020-05-14 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |
| CN112969563A (en) * | 2018-11-07 | 2021-06-15 | 丹佛斯硅动力有限责任公司 | Molding tool for molding semiconductor power module with top-side pin connector and method of manufacturing such semiconductor power module |
| CN112969563B (en) * | 2018-11-07 | 2023-06-30 | 丹佛斯硅动力有限责任公司 | Molding tool and method for molding semiconductor power modules |
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